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公开(公告)号：US09427824B2
公开(公告)日：2016-08-30
申请号：US13516954
申请日：2012-06-15
IPC分类号： B23K26/364 , B23K26/08 , B23K26/16 , B23K26/38 , B23K26/40
CPC分类号： B23K26/0846 , B23K26/142 , B23K26/16 , B23K26/364 , B23K26/38 , B23K26/40 , B23K26/402 , B23K26/702 , B23K2101/16 , B23K2103/172 , B23K2103/42 , B23K2103/50
摘要： A laser processing system includes a metal platform having a metal surface wherein at least a portion of the platform surface is substantially planar with a substantially smooth topography. A laser source is configured to generate a laser beam having a focal point that is directed toward a substantially planar portion of the platform surface. A motion mechanism is configured to move at least one of the metal platform and the focal point along at least one axis. A restraining mechanism restrains a film against the platform surface such that an adjoining surface of the restrained film remains in intimate contact with the surface. A controller is configured to operate the laser source, the motion mechanism or both to cut the restrained film in a predetermined pattern with a generated laser beam such that the cut does not extend through the adjoining surface of the restrained film.
摘要翻译： 激光加工系统包括具有金属表面的金属平台，其中平台表面的至少一部分基本上是平面的，具有基本平滑的形貌。 激光源被配置为产生具有指向平台表面的基本平坦的部分的焦点的激光束。 运动机构构造成沿着至少一个轴线移动金属平台和焦点中的至少一个。 限制机构将薄膜限制在平台表面上，使得约束膜的相邻表面保持与表面紧密接触。 控制器被配置为操作激光源，运动机构或两者以产生的激光束以预定图案切割受限膜，使得切口不延伸穿过约束膜的邻接表面。
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公开(公告)号：US20130334739A1
公开(公告)日：2013-12-19
申请号：US13516954
申请日：2012-06-15
IPC分类号： B29C35/08
CPC分类号： B23K26/0846 , B23K26/142 , B23K26/16 , B23K26/364 , B23K26/38 , B23K26/40 , B23K26/402 , B23K26/702 , B23K2101/16 , B23K2103/172 , B23K2103/42 , B23K2103/50
摘要： A laser processing system includes a metal platform having a metal surface wherein at least a portion of the platform surface is substantially planar with a substantially smooth topography. A laser source is configured to generate a laser beam having a focal point that is directed toward a substantially planar portion of the platform surface. A motion mechanism is configured to move at least one of the metal platform and the focal point along at least one axis. A restraining mechanism restrains a film against the platform surface such that an adjoining surface of the restrained film remains in intimate contact with the surface. A controller is configured to operate the laser source, the motion mechanism or both to cut the restrained film in a predetermined pattern with a generated laser beam such that the cut does not extend through the adjoining surface of the restrained film.
摘要翻译： 激光加工系统包括具有金属表面的金属平台，其中平台表面的至少一部分基本上是平面的，具有基本平滑的形貌。 激光源被配置为产生具有指向平台表面的基本平坦的部分的焦点的激光束。 运动机构构造成沿着至少一个轴线移动金属平台和焦点中的至少一个。 限制机构将薄膜限制在平台表面上，使得约束膜的相邻表面保持与表面紧密接触。 控制器被配置为操作激光源，运动机构或两者以产生的激光束以预定图案切割受限膜，使得切口不延伸穿过约束膜的邻接表面。
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