Methods for fabricating dual material gate in a semiconductor device
    1.
    发明授权
    Methods for fabricating dual material gate in a semiconductor device 失效
    在半导体器件中制造双材料栅极结构的方法

    公开(公告)号:US07635648B2

    公开(公告)日:2009-12-22

    申请号:US12100557

    申请日:2008-04-10

    IPC分类号: H01L21/311

    摘要: A method for fabricating dual material gate structures in a device is provided. The dual material gate structures have different gate electrode materials in different regions of the device. In one embodiment, the method includes providing a substrate having a patterned first gate electrode and a patterned first gate dielectric layer disposed on the substrate, removing a portion of the first gate electrode from the substrate to define a trench on the substrate, and filling the trench to form a second gate electrode.

    摘要翻译: 提供了一种在器件中制造双材料栅极结构的方法。 双材料栅结构在器件的不同区域具有不同的栅电极材料。 在一个实施例中,该方法包括提供具有图案化的第一栅极电极和设置在衬底上的图案化的第一栅极介电层的衬底,从衬底去除第一栅电极的一部分以在衬底上限定沟槽,并填充 沟槽以形成第二栅电极。

    METHODS FOR FABRICATING DUAL MATERIAL GATE IN A SEMICONDUCTOR DEVICE
    2.
    发明申请
    METHODS FOR FABRICATING DUAL MATERIAL GATE IN A SEMICONDUCTOR DEVICE 失效
    用于在半导体器件中制造双材料栅的方法

    公开(公告)号:US20090258484A1

    公开(公告)日:2009-10-15

    申请号:US12100557

    申请日:2008-04-10

    IPC分类号: H01L21/3205

    摘要: A method for fabricating dual material gate structures in a device is provided. The dual material gate structures have different gate electrode materials in different regions of the device. In one embodiment, the method includes providing a substrate having a patterned first gate electrode and a patterned first gate dielectric layer disposed on the substrate, removing a portion of the first gate electrode from the substrate to define a trench on the substrate, and filling the trench to form a second gate electrode.

    摘要翻译: 提供了一种在器件中制造双材料栅极结构的方法。 双材料栅结构在器件的不同区域具有不同的栅电极材料。 在一个实施例中,该方法包括提供具有图案化的第一栅极电极和设置在衬底上的图案化的第一栅极介电层的衬底,从衬底去除第一栅电极的一部分以在衬底上限定沟槽,并填充 沟槽以形成第二栅电极。