Diamond compact
    2.
    发明授权
    Diamond compact 失效
    钻石小巧

    公开(公告)号:US06620375B1

    公开(公告)日:2003-09-16

    申请号:US09673243

    申请日:2000-12-05

    IPC分类号: B22F706

    摘要: Disclosed is a method of making a composite diamond having a cutting edge comprising a diamond compact bonded to a cemented carbide substrate, the diamond compact having a working surface, an edge of which provides the cutting edge, wherein the diamond compact comprises a first phase containing a polycrystalline mass of diamond particles and a second phase containing a diamond catalyst/solvent and ruthenium, which method includes the steps of providing a cemented carbide substrate, providing a layer of diamond particles on a surface of the substrate, providing a source of diamond catalyst/solvent and ruthenium, wherein the source of the diamond catalyst/solvent and ruthenium is the cemented carbide substrate.

    摘要翻译: 公开了一种制备具有切割边缘的复合金刚石的方法,所述切割边缘包括结合到硬质合金基底的金刚石致密体,所述金刚石致密体具有工作表面,其边缘提供切割边缘,其中所述金刚石致密体包括含有 金刚石颗粒的多晶块和含有金刚石催化剂/溶剂和钌的第二相,该方法包括以下步骤:提供硬质合金基材,在基材的表面上提供金刚石颗粒层,提供金刚石催化剂源 /溶剂和钌,其中金刚石催化剂/溶剂的来源和钌是硬质合金基体。

    Diamond compact
    3.
    发明授权
    Diamond compact 失效
    钻石小巧

    公开(公告)号:US06821188B2

    公开(公告)日:2004-11-23

    申请号:US10425940

    申请日:2003-04-30

    IPC分类号: B24B100

    摘要: There is disclosed a method of abrading a product where a corrosive environment is experienced which includes the steps of using, as the abrading element, a composite diamond compact comprising a diamond compact bonded to a cemented carbide substrate, the diamond compact comprising a polycrystalline mass of diamond particles and a second phase containing diamond catalyst/solvent and a noble metal.

    摘要翻译: 公开了一种研磨产生腐蚀性环境的产品的方法,该方法包括以下步骤:使用包含结合到硬质合金基体的金刚石致密剂的复合金刚石复合体作为研磨元件,所述金刚石复合体包含多晶质的 金刚石颗粒和含有金刚石催化剂/溶剂和贵金属的第二相。