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公开(公告)号:US20240227007A9
公开(公告)日:2024-07-11
申请号:US18498461
申请日:2023-10-31
IPC分类号: B22F7/06 , B22F3/14 , C22C29/02 , E21B10/567
CPC分类号: B22F7/06 , B22F3/14 , C22C29/02 , E21B10/567 , B22F2302/10 , B22F2302/406 , B22F2304/10
摘要: Embodiments disclosed herein relate to polycrystalline diamond compacts that have a substrate including a cementing constituent constituting less than 13 weight percent (wt %) of the substrate, the cementing constituent including a cobalt alloy having and at least one alloying element, wherein the at least one alloying element constitutes less than 12 wt % of the substrate and wherein the cobalt constitutes less than 12 wt % of the substrate; and methods of making the same.
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公开(公告)号:US20240116108A1
公开(公告)日:2024-04-11
申请号:US18277042
申请日:2022-02-18
申请人: CUMMINS INC.
发明人: Howard S. Savage
CPC分类号: B22F7/06 , B22F3/225 , B22F10/14 , B22F10/64 , B33Y10/00 , B33Y40/20 , B33Y80/00 , B22F2998/10
摘要: A system for an engine comprises a component manufactured via additive manufacturing. The component includes a first material with a first contraction rate. An insert is disposed in the component and comprises a second material with a second contraction rate that is lower than the first contraction rate. When the component and the insert are exposed to a temperature suitable for sintering, the component contracts around the insert, thereby coupling the insert and the component.
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公开(公告)号:US11912397B2
公开(公告)日:2024-02-27
申请号:US17975046
申请日:2022-10-27
申请人: EMBRAER S.A.
IPC分类号: B22F10/20 , B64C23/06 , B33Y70/00 , B33Y80/00 , F03G7/06 , C21D6/00 , B22F10/28 , B22F12/90 , B22F10/64 , B64C3/18
CPC分类号: B64C23/065 , B33Y70/00 , B33Y80/00 , B64C23/072 , C21D6/004 , F03G7/06 , B22F10/20 , B22F10/28 , B22F10/64 , B22F12/90 , B22F2301/15 , B64C3/185 , C21D2201/01 , Y02T50/10 , B22F2999/00 , B22F10/28 , B22F7/06 , B22F2207/01 , B22F5/006
摘要: Thermally configurable structural elements (e.g., aircraft components such as an aircraft winglet spar) capable of assuming at least first and second structural configurations are provided whereby the structural element includes an integral actuation mechanism may be formed of sintered shape memory alloy (SMA) particles and sintered non-SMA particles formed by an additive layer manufacturing (ALM) process, such as 3D printing. The ALM process thereby provides by at least one thermally configurable region, and at least one non-thermally configurable region which is unitarily contiguous with the at least one thermally configurable region. The at least one thermally configurable region is capable of assuming at least first and second positional orientations in response to the presence or absence of a thermal input to thereby cause the structural element to assume the at least first and second structural configurations, respectively.
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公开(公告)号:US11883882B2
公开(公告)日:2024-01-30
申请号:US17381483
申请日:2021-07-21
IPC分类号: B22F3/22 , B22F3/10 , B22F7/02 , B22F7/06 , F01D9/04 , F01D25/24 , B22F3/105 , B22F5/00 , B22F3/02
CPC分类号: B22F3/225 , B22F3/105 , B22F3/1021 , B22F5/009 , B22F7/02 , B22F7/06 , F01D9/04 , F01D25/246 , B22F3/02 , B22F2003/023 , B22F2999/00 , F05D2230/22 , B22F2999/00 , B22F2003/023 , B22F3/225 , B22F2207/01
摘要: A method of forming a component from a part in the green state, including selecting at least one first portion of the part to undergo a different local volume reduction from at least one second portion to obtain the component. The green part is provided with the first portion(s) having a first solid loading and the second portion(s) having a second solid loading different from the first solid loading, then debound and sintered to obtain the component. The different first and second solid loadings produce the different local volume reduction in the first portion(s). The first portion(s) can be selected by determining a resulting final shape obtained from debinding and sintering a green part having a uniform first volumetric proportion of binder, and selecting the first portion(s) requiring a different local deformation than that producing the resulting final shape to obtain a desired final shape.
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公开(公告)号:US11801551B2
公开(公告)日:2023-10-31
申请号:US16020519
申请日:2018-06-27
IPC分类号: B22D19/06 , B22F5/00 , B22F7/06 , B22F10/00 , E21B10/55 , B33Y10/00 , B28B1/00 , B33Y70/00 , B22F10/14
CPC分类号: B22D19/06 , B22F5/00 , B22F7/06 , B22F10/00 , B22F10/14 , B28B1/001 , B33Y70/00 , B22F2005/001 , B33Y10/00 , E21B10/55 , B22F2998/10 , B22F10/14 , B22F7/06 , C22C1/051
摘要: In some embodiments, the present disclosure includes a method of forming a body of an earth-boring downhole tool. A mold is formed that has at least one interior surface defining a mold cavity within the mold. The mold cavity has a shape corresponding to a shape of the body of the earth-boring downhole tool to be formed therein. At least one insert is formed that includes particles of hard-phase material and a binder material using an additive manufacturing process. The at least one insert is positioned within the mold cavity. Additional particles of hard-phase material are provided within the mold cavity, and the additional particles of hard-phase material are infiltrated with molten metal, thus sintering and/or infiltrating the at least one insert to form the body of the earth-boring downhole tool. The resulting body of the earth-boring downhole tool includes the sintered and/or infiltrated at least one insert.
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6.
公开(公告)号:US11799065B2
公开(公告)日:2023-10-24
申请号:US17161305
申请日:2021-01-28
申请人: NICHIA CORPORATION
CPC分类号: H01L33/641 , B22F3/105 , B22F3/12 , B22F7/06 , H01L21/4871 , H01L23/3732 , H01L23/3736 , B22F2202/06 , B22F2301/10 , B22F2302/406 , B22F2304/10
摘要: A method of producing a heat dissipation substrate, the method including: providing a composite material containing diamond and a metal; performing a treatment on a surface of the composite material to reduce a thickness of the composite material, the treatment forming a processed surface of the composite material; and subsequently, performing pulsed electric current sintering with a pressure of less than 50 MPa applied to the composite material, to heat the composite material.
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公开(公告)号:US20230293208A1
公开(公告)日:2023-09-21
申请号:US18203128
申请日:2023-05-30
申请人: K2M, Inc.
发明人: Patrick Melton , Michael Prosser
IPC分类号: A61B17/70 , A61B34/10 , A61F2/30 , A61F2/44 , A61B17/86 , B29C64/393 , B29C64/153 , B33Y50/02 , B33Y70/00 , B22F7/06 , A61B17/80 , B22F10/00
CPC分类号: A61B17/7035 , A61B17/7037 , A61B17/7032 , A61B34/10 , A61F2/30942 , A61F2/442 , A61B17/7049 , A61B17/86 , B29C64/393 , B29C64/153 , B33Y50/02 , B33Y70/00 , B22F7/06 , A61B17/80 , A61F2/4455 , B22F10/00 , B33Y10/00
摘要: A method of manufacturing a surgical implant includes simultaneously forming a first component and a second component of the surgical implant. Formation of the first and second components includes depositing a first quantity of material to a building platform and fusing the first quantity of material to form a first layer of the first and second components. The method of manufacturing also includes depositing a second quantity of material over the first layer of the first and second components and fusing the second quantity of material to form a second layer of the first and second components. The surgical implant is fully assembled upon the completion of the formation of the first and second components.
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公开(公告)号:US11756732B2
公开(公告)日:2023-09-12
申请号:US17275815
申请日:2019-09-13
申请人: FOGALE SENSORS
发明人: Mathieu Valat , Jean-Pierre Ruffini
CPC分类号: H01G4/008 , B22F3/15 , B22F7/06 , B22F2301/25 , B22F2302/253
摘要: A method for the assembly of a metal part and a ceramic part, including the following steps:
supplying a solid ceramic part of the alumina type;
supplying a solid metal part, the metal being selected from platinum and tantalum, or an alloy including a majority of one of these metals;
depositing at least one layer, called interface layer, on at least one of the solid parts, the interface layer containing magnesium oxide;
bringing into contact the solid metal part and the solid ceramic part such that the interface layer is located between the solid parts; and
hot densification under pressure of the solid parts brought into contact, to create a close bond between the solid parts and form a spinel from the interface layer. An electrical device, such as a capacitive sensor having a sensitive part produced according to the present method, is also provided.-
公开(公告)号:US11680449B2
公开(公告)日:2023-06-20
申请号:US16338907
申请日:2016-11-02
IPC分类号: E21B10/567 , E21B10/573 , E21B10/55 , E21B10/46 , B22F3/24 , B22F7/06 , C22C26/00
CPC分类号: E21B10/5673 , B22F3/24 , B22F7/06 , C22C26/00 , E21B10/5735 , B22F2003/244 , B22F2998/10 , B22F2999/00 , E21B10/46 , E21B10/55
摘要: The present disclosure provides a sintering assembly and a polycrystalline diamond compact (PDC) including a acid-labile leach-enhancing material, a PDC including cavities formed by removal of an acid-labile leach-enhancing material, and a method of forming a leached PDC using an acid-labile leach-enhancing material. The present disclosure further includes drill bits using PDCs formed suing an acid-labile leach-enhancing material.
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10.
公开(公告)号:US20190242191A1
公开(公告)日:2019-08-08
申请号:US16240751
申请日:2019-01-06
申请人: Wenhui Jiang
发明人: Wenhui Jiang
IPC分类号: E21B10/573 , C04B37/02 , C22C29/08 , C22C26/00 , B22F7/06
CPC分类号: E21B10/5735 , B22F7/06 , B22F2005/001 , C04B37/021 , C22C26/00 , C22C29/08
摘要: The present invention relates to a polycrystalline diamond compact cutter with a low cobalt content cemented tungsten carbide substrate having a coating covering at least a portion of the carbide substrate and the method of making the same. The carbide substrate has a content of three to ten percent by weight on average of cobalt or its alloy as a binder. The coating covers at least partially the exterior surfaces of the carbide substrate, and it may extend over partially or entirely the polycrystalline diamond table. The coating is either a single layer or multilayer. The coating comprises at least a metallic layer. The coating has a thickness of 0.1 μm-100 μm. The coating may have a metallurgical bonding with the polycrystalline diamond compact cutter. Methods for preparing such coating comprise physical vapor deposition, chemical vapor deposition, thermoreactive deposition and diffusion, electrical plating, electroless plating, or their combinations.
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