公开(公告)号：US4546543A

公开(公告)日：1985-10-15

申请号：US562955

申请日：1983-12-19

Applicant: John B. Phaneuf

Inventor： John B. Phaneuf

IPC: H01R43/28 ,  H05K5/00 ,  H01R43/00 ,  B21F21/00

CPC classification number: H05K5/0091 ,  H01R43/28 ,  Y10T29/49222

Abstract: Projecting leads (28) on a support container (16) for a mini-oscillator assembly (14) initially are straightened in perpendicular directions in a lead-straightening mechanism (48). The straightened leads (28) then are reverse-bent in a bending mechanism (50), utilizing contact pads (26) on a substrate (22) of the mini-oscillator assembly (14) as anvils, so that the lead outer end portions retain the assembly adjacent the support container and so that the lead outer end portions can be bonded to the contact pads. Seating of the lead outer end portions (59) firmly on the contact pads (26) is insured by a lead-seating mechanism 60. The lead-bending mechanism 50 also applies pressure to the substrate (22) in the lead-bending operation to cause uniform spreading of an adhesive material (33) between the substrate and the support container (26).

Abstract translation: 在微型振荡器组件（14）的支撑容器（16）上的投影引线（28）最初在铅直矫直机构（48）中在垂直方向上被拉直。 然后，在弯曲机构（50）中，使微型振荡器组件（14）的基板（22）上的接触焊盘（26）作为砧座，将矫直导线（28）反向弯曲，使得引线外端部 将组件保持在支撑容器附近并且使得引线外端部分可以接合到接触垫。 引线外端部（59）牢固地固定在接触焊盘（26）上的座位由引线座机构60保证。引导弯曲机构50还在引导弯曲操作中向基板（22）施加压力， 导致粘合剂材料（33）在基材和支撑容器（26）之间的均匀铺展。

公开(公告)号：US4494033A

公开(公告)日：1985-01-15

申请号：US478934

申请日：1983-03-25

Applicant: William C. Morse ,  John B. Phaneuf

Inventor： William C. Morse ,  John B. Phaneuf

IPC: H03H9/05 ,  H01L41/08

CPC classification number: H03H9/0547 ,  H03H9/0533

Abstract: A mini-oscillator assembly (20) is formed by initially bonding ribbon leads (34) to contact pads (32) on a planar substrate (26) of a hybrid integrated circuit device (22) such that the leads project from the substrate in the plane thereof. Inverted V-shaped notches (50) then are formed in the ribbon leads (34) as the leads are cut to length. The ribbon leads (34) then are formed over the substrate (26) so that the V-shaped notches (50) face away from the substrate (26) and are aligned with one another on opposite sides of a plane extending from an imaginary line (52) extending between and interconnecting the substrate contact pads (32). Wire leads (38) of a crystal resonator plate (24) then are soldered in the V-shaped notches (50) to form the mini-oscillator assembly (20).

Abstract translation: 微型振荡器组件（20）通过首先将带状引线（34）接合到混合集成电路器件（22）的平面基板（26）上的接触焊盘（32）而形成，使得引线从基板 它的平面。 然后当导线被切割成长度时，在带状引线（34）中形成倒V形凹口（50）。 然后，带状引线（34）形成在衬底（26）上方，使得V形凹口（50）远离衬底（26）并且在从假想线延伸的平面的相对侧上彼此对准 （52）在衬底接触焊盘（32）之间延伸并互连。 然后将晶体谐振器板（24）的引线（38）焊接在V形凹口（50）中以形成微型振荡器组件（20）。