公开(公告)号：US20230387885A1

公开(公告)日：2023-11-30

申请号：US18446074

申请日：2023-08-08

Applicant: SEIKO EPSON CORPORATION

Inventor： Seiichiro OGURA ,  Keiichi YAMAGUCHI ,  Masahiro OSHIO ,  Takashi YAMAZAKI

IPC: H03H9/21 ,  H03H3/02 ,  H03H9/05 ,  G01C19/5607 ,  H03H3/04 ,  H03H9/10 ,  G01C19/5621

CPC classification number: H03H9/21 ,  H03H3/02 ,  H03H9/0595 ,  G01C19/5607 ,  H03H3/04 ,  H03H9/1014 ,  H03H9/0533 ,  H03H9/0547 ,  G01C19/5621 ,  H03H2003/0492 ,  H03H2003/026

Abstract: A vibration element includes a base and a vibrating arm extending from the base. The vibrating arm includes an arm positioned between the base and a weight. A weight film is disposed on the weight. The weight has a first principal surface and a second principal surface in a front and back relationship with respect to a center plane of the arm. A center of gravity of the weight is located between the first principal surface and the center plane of the arm. A center of gravity of the weight film is located between the second principal surface and the center plane of the arm.

公开(公告)号：US20230327649A1

公开(公告)日：2023-10-12

申请号：US18334303

申请日：2023-06-13

Applicant: Akoustis, Inc.

Inventor： Ya SHEN ,  Rohan W. HOULDEN ,  David M. AICHELE ,  Jeffrey B. SHEALY

IPC: H03H9/60 ,  H03H9/56 ,  H03H9/00 ,  H03H9/05 ,  H03H9/10 ,  H03H9/17 ,  H03H9/54 ,  H03H3/02

CPC classification number: H03H9/605 ,  H03H2003/021 ,  H03H9/0095 ,  H03H9/0523 ,  H03H9/0533 ,  H03H9/105 ,  H03H9/173 ,  H03H9/175 ,  H03H9/176 ,  H03H9/542 ,  H03H9/562 ,  H03H9/566 ,  H03H9/568 ,  H03H3/02 ,  H03H9/0014 ,  H03H2003/025 ,  H03H9/564

Abstract: An RF circuit device using modified lattice, lattice, and ladder circuit topologies. The devices can include four resonator devices and four shunt resonator devices. In the ladder topology, the resonator devices are connected in series from an input port to an output port while shunt resonator devices are coupled the nodes between the resonator devices. In the lattice topology, a top and a bottom serial configurations each includes a pair of resonator devices that are coupled to differential input and output ports. A pair of shunt resonators is cross-coupled between each pair of a top serial configuration resonator and a bottom serial configuration resonator. The modified lattice topology adds baluns or inductor devices between top and bottom nodes of the top and bottom serial configurations of the lattice configuration. These topologies may be applied using single crystal or polycrystalline bulk acoustic wave (BAW) resonators.

公开(公告)号：US11689186B2

公开(公告)日：2023-06-27

申请号：US16828675

申请日：2020-03-24

Applicant: Akoustis, Inc.

Inventor： Ya Shen ,  Rohan W. Houlden ,  David M. Aichele ,  Jeffrey B. Shealy

IPC: H03H9/60 ,  H03H9/56 ,  H03H9/05 ,  H03H9/10 ,  H03H9/17 ,  H03H9/54 ,  H03H9/00 ,  H03H3/02

CPC classification number: H03H9/605 ,  H03H3/02 ,  H03H9/0014 ,  H03H9/0095 ,  H03H9/0523 ,  H03H9/0533 ,  H03H9/105 ,  H03H9/173 ,  H03H9/175 ,  H03H9/176 ,  H03H9/542 ,  H03H9/562 ,  H03H9/564 ,  H03H9/566 ,  H03H9/568 ,  H03H2003/021 ,  H03H2003/025

Abstract: An RF circuit device using modified lattice, lattice, and ladder circuit topologies. The devices can include four resonator devices and four shunt resonator devices. In the ladder topology, the resonator devices are connected in series from an input port to an output port while shunt resonator devices are coupled the nodes between the resonator devices. In the lattice topology, a top and a bottom serial configurations each includes a pair of resonator devices that are coupled to differential input and output ports. A pair of shunt resonators is cross-coupled between each pair of a top serial configuration resonator and a bottom serial configuration resonator. The modified lattice topology adds baluns or inductor devices between top and bottom nodes of the top and bottom serial configurations of the lattice configuration. These topologies may be applied using single crystal or polycrystalline bulk acoustic wave (BAW) resonators.

公开(公告)号：US20050116794A1

公开(公告)日：2005-06-02

申请号：US10996380

申请日：2004-11-23

Applicant: Shinji Mizuno

Inventor： Shinji Mizuno

IPC: H01L21/60 ,  H03B5/30 ,  H03H3/02 ,  H03H9/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/25 ,  H03H9/54

CPC classification number: H03H9/0547 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/4903 ,  H01L2224/49171 ,  H01L2224/49174 ,  H01L2224/4942 ,  H01L2224/49429 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/15787 ,  H03H9/0533 ,  H03H9/1014 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A resonator device includes a resonator supported by a substrate as a base. The resonator is connected to a wire extending from the substrate by wire bonding so as to be suspended in midair and supported over the supporting substrate.

Abstract translation: 谐振器装置包括由作为基底的基板支撑的谐振器。 谐振器通过引线接合连接到从基板延伸的线，以便悬挂在空中并被支撑在支撑基板上。

公开(公告)号：US4494033A

公开(公告)日：1985-01-15

申请号：US478934

申请日：1983-03-25

Applicant: William C. Morse ,  John B. Phaneuf

Inventor： William C. Morse ,  John B. Phaneuf

IPC: H03H9/05 ,  H01L41/08

CPC classification number: H03H9/0547 ,  H03H9/0533

Abstract: A mini-oscillator assembly (20) is formed by initially bonding ribbon leads (34) to contact pads (32) on a planar substrate (26) of a hybrid integrated circuit device (22) such that the leads project from the substrate in the plane thereof. Inverted V-shaped notches (50) then are formed in the ribbon leads (34) as the leads are cut to length. The ribbon leads (34) then are formed over the substrate (26) so that the V-shaped notches (50) face away from the substrate (26) and are aligned with one another on opposite sides of a plane extending from an imaginary line (52) extending between and interconnecting the substrate contact pads (32). Wire leads (38) of a crystal resonator plate (24) then are soldered in the V-shaped notches (50) to form the mini-oscillator assembly (20).

Abstract translation: 微型振荡器组件（20）通过首先将带状引线（34）接合到混合集成电路器件（22）的平面基板（26）上的接触焊盘（32）而形成，使得引线从基板 它的平面。 然后当导线被切割成长度时，在带状引线（34）中形成倒V形凹口（50）。 然后，带状引线（34）形成在衬底（26）上方，使得V形凹口（50）远离衬底（26）并且在从假想线延伸的平面的相对侧上彼此对准 （52）在衬底接触焊盘（32）之间延伸并互连。 然后将晶体谐振器板（24）的引线（38）焊接在V形凹口（50）中以形成微型振荡器组件（20）。

公开(公告)号：US2386916A

公开(公告)日：1945-10-16

申请号：US48236143

申请日：1943-04-09

Applicant: WESTERN ELECTRIC CO

Inventor： SWICKARD ANDREW E

IPC: H03H9/05 ,  H03H9/19

CPC classification number: H03H9/0533

公开(公告)号：US20240162879A1

公开(公告)日：2024-05-16

申请号：US18509367

申请日：2023-11-15

Applicant: SEIKO EPSON CORPORATION

Inventor： Norihito MATSUKAWA ,  Atsushi MATSUO ,  Kensaku ISOHATA

IPC: H03H9/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/19

CPC classification number: H03H9/02133 ,  H03H9/02102 ,  H03H9/0509 ,  H03H9/0533 ,  H03H9/0595 ,  H03H9/1021 ,  H03H9/19

Abstract: A vibrator element includes a vibrating section having a rectangular shape in a plan view and including a first principal surface, a second principal surface, and an excitation portion sandwiched by a first excitation electrode and a second excitation electrode and making a thickness-shear vibration, a coupling arm extending from a corner part of the vibrating section in a first direction, and a supporting arm having a side surface at one end part side coupled to the coupling arm and extending in a second direction crossing the first direction, wherein the supporting arm includes a first supporting electrode electrically coupled to the first excitation electrode and bonded to a container via an adhesive member, and a width of the coupling arm along the second direction is four or more times a thickness of the excitation portion along a third direction crossing the first direction and the second direction and equal to or smaller than a length from an end part of the supporting arm at the coupling arm side to the first supporting electrode along the second direction.

公开(公告)号：US11646719B2

公开(公告)日：2023-05-09

申请号：US17886149

申请日：2022-08-11

Applicant: AKOUSTIS, INC.

Inventor： Jeffrey B. Shealy ,  Michael Hodge ,  Rohan W. Houlden ,  Shawn R. Gibb ,  Mary Winters ,  Ramakrishna Vetury ,  David M. Aichele

IPC: H03H9/70 ,  H03H9/02 ,  H03H9/205 ,  H03H9/58 ,  H03H9/60 ,  H03H9/54 ,  H03H3/02 ,  H03H9/00 ,  H03H9/05

CPC classification number: H03H9/703 ,  H03H3/02 ,  H03H9/0095 ,  H03H9/02031 ,  H03H9/02118 ,  H03H9/205 ,  H03H9/542 ,  H03H9/581 ,  H03H9/605 ,  H03H9/0523 ,  H03H9/0533 ,  H03H2003/023 ,  H03H2003/025

Abstract: An RF filter system including a plurality of BAW resonators arranged in a circuit, the circuit including a serial configuration of resonators and a parallel shunt configuration of resonators, the circuit having a circuit response corresponding to the serial configuration and the parallel configuration of the plurality of bulk acoustic wave resonators including a transmission loss from a pass band having a bandwidth from 5.170 GHz to 5.835 GHz. Resonators include a support member with a multilayer reflector structure; a first electrode including tungsten; a piezoelectric film including aluminum scandium nitride; a second electrode including tungsten; and a passivation layer including silicon nitride. At least one resonator includes at least a portion of the first electrode located within a cavity region defined by a surface of the support member.

公开(公告)号：US20180309422A1

公开(公告)日：2018-10-25

申请号：US16019267

申请日：2018-06-26

Applicant: Akoustis, Inc.

Inventor： Jeffrey B. SHEALY ,  Michael HODGE ,  Rohan W. HOULDEN ,  Shawn R. GIBB ,  Mary WINTERS ,  Ramakrishna VETURY ,  David AICHELE

IPC: H03H3/02 ,  H03H9/00 ,  H03H9/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/205 ,  H03H9/54 ,  H03H9/56 ,  H01L41/187 ,  H01L41/047 ,  H01L27/20 ,  H01L41/29 ,  H01L41/332

CPC classification number: H03H3/02 ,  H01L27/20 ,  H01L41/0475 ,  H01L41/0477 ,  H01L41/187 ,  H01L41/29 ,  H01L41/332 ,  H03H9/0095 ,  H03H9/02031 ,  H03H9/02118 ,  H03H9/0523 ,  H03H9/0533 ,  H03H9/1014 ,  H03H9/105 ,  H03H9/173 ,  H03H9/175 ,  H03H9/205 ,  H03H9/542 ,  H03H9/562 ,  H03H9/564 ,  H03H2003/021 ,  H03H2003/025

Abstract: An RF circuit device using modified lattice, lattice, and ladder circuit topologies. The devices can include four resonator devices and four shunt resonator devices. In the ladder topology, the resonator devices are connected in series from an input port to an output port while shunt resonator devices are coupled the nodes between the resonator devices. In the lattice topology, a top and a bottom serial configurations each includes a pair of resonator devices that are coupled to differential input and output ports. A pair of shunt resonators is cross-coupled between each pair of a top serial configuration resonator and a bottom serial configuration resonator. The modified lattice topology adds baluns or inductor devices between top and bottom nodes of the top and bottom serial configurations of the lattice configuration. These topologies may be applied using single crystal or polycrystalline bulk acoustic wave (BAW) resonators.

公开(公告)号：US6093997A

公开(公告)日：2000-07-25

申请号：US128124

申请日：1998-08-03

Applicant: Charles Zimnicki ,  James F. Caruba

Inventor： Charles Zimnicki ,  James F. Caruba

IPC: H01L41/053 ,  H03H9/10 ,  H03H9/17 ,  H05K1/18 ,  H01L41/04

CPC classification number: H03H9/1014 ,  H01L41/053 ,  H03H9/0533 ,  H03H9/0547 ,  H05K1/182

Abstract: A piezoelectric resonator (12) is embedded within an electrically insulating substrate assembly (36), such as a multilayer printed circuit board. Electrical conductors (22,24) extend from electrodes of the resonator (12) through holes (32) in upper and lower layers (26,29) of the substrate assembly (36) and connect to electrical traces (34). The lower layer (29) has a pocket which forms a cavity (38) within the substrate assembly (36) adapted to contain the piezoelectric resonator (12). The conductors (22,24) support the resonator (12) such that the resonator (12) does not contact the assembly (36). As the resonator is substantially larger than associated electrical components, embedding it within a substrate eliminates the size penalty that is normally required to mount a large piezoelectric resonator.

Abstract translation: 压电谐振器（12）嵌入电绝缘基板组件（36）内，例如多层印刷电路板。 电导体（22,24）从谐振器（12）的电极通过衬底组件（36）的上层和下层（26,29）中的孔（32）延伸并连接到电迹线（34）。 下层（29）具有在适于容纳压电谐振器（12）的衬底组件（36）内形成空腔（38）的口袋。 导体（22,24）支撑谐振器（12），使得谐振器（12）不接触组件（36）。 由于谐振器基本上大于相关联的电气部件，将其嵌入衬底中消除了安装大压电谐振器通常需要的尺寸损失。