公开(公告)号：US06861667B2

公开(公告)日：2005-03-01

申请号：US10619895

申请日：2003-07-15

申请人： Mathew L. Gilk ,  John W. O'Sullivan ,  David A. Johnson

发明人： Mathew L. Gilk ,  John W. O'Sullivan ,  David A. Johnson

IPC分类号： H01R4/66 ,  H01R13/514 ,  H01L23/58

CPC分类号： H01R13/2435 ,  H01R13/514 ,  H01R2201/20

摘要： A grounding assembly for testing which can be readily changed is provided by an insert which is retained within an opening in a test socket. Flexible projections from the socket fit within grooves in the insert to provide the retention means. The insert is positioned within an opening in the socket adjacent to an opening containing a device under test (DUT). The insert is also between the DUT and a test board, and has contacts arranged such they connect ground contacts on the DUT to opposing contacts on the test board. The insert can provide different numbers, arrangements, and types of contacts as well as different materials for both the contact and contact body by merely changing the insert.

摘要翻译： 可以容易地改变的用于测试的接地组件由保持在测试插座中的开口内的插入件提供。 该插座的柔性凸起配合在插入件中的槽内以提供保持装置。 插入件位于插座中的开口内，邻近包含待测器件（DUT）的开口。 插入件也在DUT和测试板之间，并且具有布置成使得它们将DUT上的接地触点连接到测试板上的相对触点的触点。 插入件可以通过仅改变插入件来为触点和接触体提供不同的数量，布置和类型的触点以及不同的材料。

公开(公告)号：US07255576B2

公开(公告)日：2007-08-14

申请号：US11449119

申请日：2006-06-08

申请人： John W. O'Sullivan ,  John E. Nelson

发明人： John W. O'Sullivan ,  John E. Nelson

IPC分类号： H01R12/00

CPC分类号： G01R1/0466 ,  G01R1/0483 ,  H01R12/714 ,  H01R13/2414 ,  H01R13/2442 ,  H01R2201/20

摘要： A test assembly for testing electrical performance of microcircuits contained in leadless packages has Kelvin contacts. Slider contacts in a plurality of contact assemblies slide compliantly to accommodate lack of coplanarity in terminals on the package. A resilient elastomeric block may be inserted through interior spaces of the contact assembly and in interfering relation with features of a housing that supports and aligns the contact assemblies, to apply force to the slider contacts to force them against the microcircuit terminals.

摘要翻译： 用于测试无引线封装中包含的微电路的电气性能的测试组件具有开尔文接触。 多个接触组件中的滑块触点顺应滑动以适应封装端子中的共面性不足。 弹性弹性体块可以插入穿过接触组件的内部空间并且与支撑和对准接触组件的壳体的特征相互干涉，以向滑块接触件施加力以迫使它们抵靠微电路端子。

公开(公告)号：US07074049B2

公开(公告)日：2006-07-11

申请号：US11085782

申请日：2005-03-21

申请人： John W. O'Sullivan ,  John E. Nelson

发明人： John W. O'Sullivan ,  John E. Nelson

IPC分类号： H01R12/00

CPC分类号： G01R1/0466 ,  G01R1/0483 ,  H01R12/714 ,  H01R13/2414 ,  H01R13/2442 ,  H01R2201/20

摘要： A test assembly for testing electrical performance of microcircuits contained in leadless packages has Kelvin contacts. Slider contacts in a plurality of contact assemblies slide compliantly to accommodate lack of coplanarity in terminals on the package. A resilient elastomeric block may be inserted through interior spaces of the contact assembly and in interfering relation with features of a housing that supports and aligns the contact assemblies, to apply force to the slider contacts to force them against the microcircuit terminals.

摘要翻译： 用于测试无引线封装中包含的微电路的电气性能的测试组件具有开尔文接触。 多个接触组件中的滑块触点顺应滑动以适应封装端子中的共面性不足。 弹性弹性体块可以插入穿过接触组件的内部空间并且与支撑和对准接触组件的壳体的特征相互干涉，以向滑块接触件施加力以迫使它们抵靠微电路端子。