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公开(公告)号：US09991614B2
公开(公告)日：2018-06-05
申请号：US15538525
申请日：2015-12-22
发明人： Shinichi Hayashi , Masao Saito , Reiji Tsukao , Yasushi Akutsu
CPC分类号： H01R11/01 , H01B1/20 , H01B5/14 , H01R13/2414 , H05K3/323
摘要： An anisotropic electrically conductive film that is suitable for use in fine-pitch FOG connections and COG connections and that also can reduce increases in production costs associated with increasing the electrically conductive particle density. The anisotropic electrically conductive film includes an electrically insulating adhesive layer and electrically conductive particles disposed within the electrically insulating adhesive layer. The anisotropic electrically conductive film has electrically conductive particle disposition regions that are disposed in a manner corresponding to the arrangement of terminals of electronic components to be connected. The electrically conductive particle disposition regions are formed periodically in the longitudinal direction of the anisotropic electrically conductive film. The anisotropic electrically conductive film also has buffer regions in which no electrically conductive particles are disposed that are formed between adjacent electrically conductive particle disposition regions for connection.
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公开(公告)号：US09923293B2
公开(公告)日：2018-03-20
申请号：US15171636
申请日：2016-06-02
申请人： Raytheon Company
CPC分类号： H01R12/75 , H01R9/0515 , H01R12/55 , H01R12/718 , H01R13/2414 , H05K1/0243 , H05K3/301 , H05K2201/10303
摘要： A connectable assembly is provided and includes a body defining a recess, a male conductive element supportively disposed proximate to the body and a conductive compliant (CC) plug disposed within the recess for establishing a radially compliant, axially free running electrical connection with the male conductive element.
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公开(公告)号：US09832874B2
公开(公告)日：2017-11-28
申请号：US14745526
申请日：2015-06-22
CPC分类号： H05K1/117 , H01R12/52 , H01R12/73 , H01R13/2414 , H01R43/26 , H05K1/144 , H05K3/368 , H05K2201/0133 , H05K2201/0314 , H05K2201/041 , H05K2201/042 , H05K2201/10159 , H05K2201/10189 , H05K2201/10265 , H05K2201/10954 , Y10T29/49128
摘要： A printed circuit board (PCB) assembly includes a first PCB and a second PCB disposed substantially parallel and opposite to each other, such that a second side of the first PCB is opposite to a first side of the second PCB; wherein the second PCB has a first set of side connectors on its first side and a second set of side connectors on its second side, configured for both electrical power supply to and signal communication with the second PCB; the second PCB both electrically and mechanically connected to the second side of the first PCB via a first elastomeric connector; and the second PCB electrically connected to the first PCB via its second set of side connectors and a flexible electrical connector that is electrically connected to the second set of side connectors and the first PCB.
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公开(公告)号：US20170207190A1
公开(公告)日：2017-07-20
申请号：US15324759
申请日：2015-07-22
发明人： Reiji TSUKAO
IPC分类号： H01L23/00 , H01L23/498
CPC分类号： H01L24/73 , G02F1/13458 , G02F2202/28 , H01L22/14 , H01L23/49811 , H01L23/49838 , H01L24/14 , H01L24/17 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/13017 , H01L2224/13019 , H01L2224/13144 , H01L2224/13147 , H01L2224/16012 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29357 , H01L2224/29371 , H01L2224/32225 , H01L2224/73204 , H01L2224/81132 , H01L2224/81191 , H01L2224/81203 , H01L2224/83132 , H01L2224/83192 , H01L2224/83203 , H01L2224/9211 , H01L2924/1426 , H01R4/04 , H01R12/7076 , H01R13/2414 , H05K1/111 , H05K3/323 , H05K2201/0269 , H05K2201/09409 , H01L2924/00
摘要： A connection body includes a circuit board terminals arranged into terminal rows, the terminals rows being arranged in parallel to one another in a widthwise direction orthogonal to a direction in which the terminals are arranged, and an electronic component including bumps arranged into bump rows corresponding to the terminal rows, the bumps being arranged in parallel to one another in a widthwise direction orthogonal to a direction in which the bumps are arranged. The electronic component is connected upon the circuit board interposed by an anisotropic conductive adhesive including electrically conductive particles arranged therein. A distance between mutually opposing terminals of the terminals and bumps of the bumps arranged toward the outer sides of the circuit board and the electronic component is greater than a distance between mutually opposing terminals of the terminals and bumps of the bumps arranged toward their inner sides.
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公开(公告)号：US09705184B2
公开(公告)日：2017-07-11
申请号：US14649078
申请日：2013-11-28
CPC分类号： H01Q1/273 , G04G17/04 , G04G17/06 , H01Q1/241 , H01R12/52 , H01R13/2414 , H01R2201/02
摘要： An antenna assembly for a mobile device comprising a printed circuit board and an antenna structure located at a distance from the printed circuit board. The antenna structure is electrically connected to the printed circuit board via at least one elastomeric connector comprising a plurality of conductive filaments and an insulating structure extending between the antenna structure and the printed circuit board.
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公开(公告)号：US09692188B2
公开(公告)日：2017-06-27
申请号：US15334041
申请日：2016-10-25
申请人： Quell Corporation
发明人： Ken Godana , Dusty Erven , Kevin Foreman , Paul Miller
IPC分类号： H01R12/00 , H01R13/66 , H01R13/24 , H01R43/00 , H01R43/20 , H01R13/6588 , H01R13/6599 , H01G4/008 , H01G4/18 , H01R13/6464 , H01R107/00
CPC分类号： H01R13/665 , H01G4/008 , H01G4/18 , H01R13/2414 , H01R13/6464 , H01R13/6588 , H01R13/6599 , H01R13/6625 , H01R43/007 , H01R43/20 , H01R2107/00 , Y10T29/49208
摘要： A connector insert comprising conductive wire and a plurality of layers of conductive and non-conductive elastomers, and methods of fabrication thereof.
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公开(公告)号：US20170170583A1
公开(公告)日：2017-06-15
申请号：US15350239
申请日：2016-11-14
CPC分类号： H01R12/7088 , H01R12/718 , H01R13/2414 , H01R13/658 , H05K1/0216 , H05K1/0263 , H05K1/181 , H05K3/4015 , H05K2201/0314 , H05K2201/10265 , H05K2201/10272 , H05K2201/1031 , H05K2201/10371 , H05K2201/10409 , H05K2201/10757 , H05K2201/2036 , Y02P70/611
摘要： The present embodiments relate to providing electrical connectivity to electric-powered components mounted in parallel on a wiring board. An electrical apparatus is provided in which electricity is conducted from an electrically conductive member onto first and second electrically conductive pathways, of a wiring board through the use of first and second resiliently-deformable electrically conductive connectors. First and second electric-powered components are mounted to the respective first and second electrically conductive pathways. The first and second resiliently-deformable electrically conductive connectors are compressed between the electrically conductive member and the wiring board such that the first connector provides an electrical connection between the conductive member and the first electrically conductive pathway, and the second connector provides an electrical connection between the conductive member and the second electrically conductive pathway.
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公开(公告)号：US20170140850A1
公开(公告)日：2017-05-18
申请号：US15115838
申请日：2015-01-29
发明人： Kumiko KITAMURA
CPC分类号： H01B5/14 , B32B27/08 , B32B27/16 , B32B27/20 , B32B27/308 , B32B27/38 , B32B37/144 , B32B37/16 , B32B2250/03 , B32B2250/24 , B32B2255/10 , B32B2270/00 , B32B2307/202 , B32B2307/206 , B32B2307/51 , B32B2307/704 , B32B2310/0831 , B32B2333/00 , B32B2363/00 , B32B2457/00 , H01B13/0036 , H01L24/29 , H01R4/04 , H01R13/2414 , H05K3/323
摘要： An anisotropic conductive film has a first insulating resin layer and a second insulating resin layer. The first insulating resin layer is formed of a photopolymerized resin, the second insulating resin layer is formed of a thermo-cationically or thermo-anionically polymerizable resin, a photo-cationically or photo-anionically polymerizable resin, a thermo-radically polymerizable resin, or a photo-radically polymerizable resin, and conductive particles for anisotropic conductive connection are disposed in a single layer on a surface of the first insulating resin layer on a side of the second insulating resin layer. The elastic modulus of the anisotropic conductive film as a whole is 0.13 MPa or more.
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公开(公告)号：US20170093094A1
公开(公告)日：2017-03-30
申请号：US15310803
申请日：2015-05-18
申请人： AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Junichi Mukuno , Kensaku Takata
IPC分类号： H01R13/6584 , H01R13/52
CPC分类号： H01R13/6584 , H01R13/2414 , H01R13/5219
摘要： A connector structure (C) for connecting a plurality of electric devices accommodated in metal casings (10, 50) and arranged proximate to each other includes a first connector (30) provided in one (10) of the metal casings, a second connector (70) provided in the other (50) of the metal casings and configured to electrically connect the electric devices by being connected to the first connector (30), and a conductive resilient member (90) arranged to be sandwiched between the both metal casings while being electrically conductive to the metal casings (10, 50) and surround connected parts of the first and second connectors (30, 70).
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公开(公告)号：US20170077633A1
公开(公告)日：2017-03-16
申请号：US14851947
申请日：2015-09-11
发明人： Jason Paul Hricik
CPC分类号： H01R13/03 , H01R12/714 , H01R13/2414
摘要： In the present invention, a surface mount technology (SMT) connector for a printed circuit board (PCB) or a flexible printed circuit (FPC) includes a body formed of a non-conductive material, a connection member disposed on the body and adapted to engage the body with a mating surface and at least one terminal disposed on the body, the at least one terminal formed from a conductive polymer.
摘要翻译： 在本发明中，用于印刷电路板（PCB）或柔性印刷电路（FPC）的表面贴装技术（SMT）连接器包括由非导电材料形成的本体，设置在主体上的连接构件， 将所述主体与配合表面和设置在所述主体上的至少一个端子接合，所述至少一个端子由导电聚合物形成。
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