公开(公告)号：US06969682B2

公开(公告)日：2005-11-29

申请号：US10693668

申请日：2003-10-24

申请人： Kyle M. Hanson ,  Paul Z. Wirth ,  Steven L. Peace ,  Jon Kuntz ,  Scott A. Bruner

发明人： Kyle M. Hanson ,  Paul Z. Wirth ,  Steven L. Peace ,  Jon Kuntz ,  Scott A. Bruner

IPC分类号： H01L21/00 ,  H01L21/3213 ,  H01L21/311

CPC分类号： H01L21/6715 ,  H01L21/32134 ,  H01L21/67017 ,  Y10S438/906 ,  Y10S438/913

摘要： A system for processing wafers includes a robot moveable within an enclosure to load and unload workpieces into and out of workpiece processors. A processor includes an upper rotor having alignment pins, and a lower rotor having one or more openings for receiving the alignment pins to form a processing chamber around the workpiece. The alignment pins center the workpiece relative to a rotor spin axis and to an etch or drain groove in the upper rotor. A first fluid outlet delivers processing fluid to a central region of the workpiece. The processing fluid is distributed across the workpiece surface via centrifugal force generated by spinning the processing chamber. Purge gas is optionally delivered into the processing chamber through an annular opening around the first fluid outlet to help remove processing fluid from the processing chamber.

摘要翻译： 用于处理晶片的系统包括可在外壳内移动以将工件加载和卸载到工件处理器中的机器人。 处理器包括具有对准销的上转子和具有一个或多个开口的下转子，用于接收对准销以在工件周围形成处理室。 对准销使工件相对于转子旋转轴线和上转子中的蚀刻或排水槽居中。 第一流体出口将处理流体输送到工件的中心区域。 处理液通过旋转处理室产生的离心力分布在工件表面上。 吹扫气体可选地通过围绕第一流体出口的环形开口输送到处理室中，以帮助从处理室去除处理流体。

公开(公告)号：US06774056B2

公开(公告)日：2004-08-10

申请号：US10200043

申请日：2002-07-19

申请人： Jon Kuntz ,  Steven Peace ,  Ed Derks ,  Brian Aegerter

发明人： Jon Kuntz ,  Steven Peace ,  Ed Derks ,  Brian Aegerter

IPC分类号： H01L2131

CPC分类号： H01L21/68785 ,  H01L21/67057 ,  H01L21/67086 ,  H01L21/6715 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/14 ,  Y10S438/906 ,  Y10S438/913

摘要： A process system for processing a semiconductor wafer or other similar flat workpiece has a head including a workpiece holder. A motor in the head spins the workpiece. A head lifter lowers the head to move the workpiece into a bath of liquid in a bowl. Sonic energy is introduced into the liquid and travels through the liquid to the workpiece, to assist in processing. The head is lifted to bring the workpiece to a rinse position. The bath liquid is drained. The workpiece is rinsed via radial spray nozzles in the base. The head is lifted to a dry position. A reciprocating swing arm sprays a drying fluid onto the bottom surface of the spinning wafer, to dry the wafer.

摘要翻译： 用于处理半导体晶片或其它类似的平坦工件的处理系统具有包括工件保持器的头部。 头部的电机旋转工件。 头部升降器降低头部以将工件移动到碗中的液体浴中。 声能被引入到液体中并通过液体传送到工件，以帮助加工。 抬起头部以使工件进入冲洗位置。 浴液被排出。 工件通过基座中的径向喷嘴冲洗。 头部被抬起到干燥的位置。 往复摇摆臂将干燥流体喷射到旋转晶片的底表面上，以干燥晶片。