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公开(公告)号：US07253079B2
公开(公告)日：2007-08-07
申请号：US10142127
申请日：2002-05-09
IPC分类号： H01I29/84
摘要： A coplanar mounting member for a MEM sensor includes a first surface coplanar with a connection pad on the surface of a MEM sensor board containing the MEM sensor control circuit; a second surface inclined to the surface of the board for mounting a MEM sensor and an electrical conductor array for interconnecting the MEM sensor with the connection pad on the board.
摘要翻译： 用于MEM传感器的共面安装构件包括：第一表面，其与包含MEM传感器控制电路的MEM传感器板的表面上的连接焊盘共面; 与板的表面倾斜的用于安装MEM传感器的第二表面和用于将MEM传感器与板上的连接垫相互连接的电导体阵列。
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公开(公告)号：US07679171B2
公开(公告)日：2010-03-16
申请号：US11157879
申请日：2005-06-21
申请人： Richard S. Anderson , David S. Hanson , Frederick J. Kasparian , Thomas F. Marinis , Joseph W. Soucy
发明人： Richard S. Anderson , David S. Hanson , Frederick J. Kasparian , Thomas F. Marinis , Joseph W. Soucy
IPC分类号： H01L23/28
CPC分类号： F16F15/073 , B81B7/0048 , F16F1/18 , G01D11/30
摘要： A sensor isolation system including a sensor, a package for the sensor, and a compliant interposer disposed between the sensor and the package and interconnecting the sensor to the package to isolate the sensor from thermal and mechanical stresses and yet at the same time providing a physical interconnect between the sensor and the package.
摘要翻译： 传感器隔离系统，包括传感器，用于传感器的封装以及设置在传感器和封装之间并将传感器与封装相互连接的兼容插入件，以将传感器与热和机械应力隔离，同时提供物理 传感器和封装之间的互连。
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公开(公告)号：US20080148850A1
公开(公告)日：2008-06-26
申请号：US11823747
申请日：2007-06-28
IPC分类号： G01P15/00
摘要： A three axes MEM accelerometer system includes three MEM accelerometer sensors and a MEM sensor board including a MEM sensor control circuit for the accelerometer sensors. The accelerometer sensors are mounted mutually orthogonally. At least two coplanar mounting members have a first surface coplanar with a connection pad on the surface of the sensor board. A second surface is inclined to the surface of the board for mounting a MEM accelerometer sensor. An electrical conductor array interconnects the MEM accelerometer sensor with the connection pad on the board.
摘要翻译： 三轴MEM加速度计系统包括三个MEM加速度计传感器和一个包含用于加速度计传感器的MEM传感器控制电路的MEM传感器板。 加速度计传感器相互垂直安装。 至少两个共面安装构件具有与传感器板表面上的连接垫共面的第一表面。 第二表面倾斜于板的表面，用于安装MEM加速度计传感器。 电导体阵列将MEM加速计传感器与电路板上的连接垫相互连接。
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4.发明授权公开(公告)号：US07215213B2
公开(公告)日：2007-05-08
申请号：US11181035
申请日：2005-07-13
CPC分类号： B81B7/0012 , G04F5/14 , H01L2924/0002 , H01L2924/00
摘要： A suspension of a chip-scale device is accomplished using a suspension frame and at least one first tether. The chip-scale suspension frame defines a first plane and an opening through the suspension frame. At least one first tether crosses the opening at a first angle relative to the first plane and can be used to position the chip-scale device at least partially within the opening.
摘要翻译： 使用悬挂框架和至少一个第一系绳来实现芯片级设备的悬架。 芯片级悬挂框架限定了第一平面和通过悬挂框架的开口。 至少一个第一系绳相对于第一平面以第一角度穿过开口，并且可以用于将芯片尺寸装置至少部分地定位在开口内。
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公开(公告)号：US06937479B2
公开(公告)日：2005-08-30
申请号：US10141993
申请日：2002-05-09
申请人： Richard S. Anderson , David S. Hanson , Frederick J. Kasparian , Thomas F. Marinis , Joseph W. Soucy
发明人： Richard S. Anderson , David S. Hanson , Frederick J. Kasparian , Thomas F. Marinis , Joseph W. Soucy
IPC分类号： F16F1/18 , F16F15/073 , G01D11/30 , H05K7/02
CPC分类号： F16F15/073 , B81B7/0048 , F16F1/18 , G01D11/30
摘要： A sensor isolation system including a sensor, a package for the sensor, and a compliant interposer disposed between the sensor and the package and interconnecting the sensor to the package to isolate the sensor from thermal and mechanical stresses and yet at the same time providing a physical interconnect between the sensor and the package.
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公开(公告)号：US06891239B2
公开(公告)日：2005-05-10
申请号：US10374400
申请日：2003-02-26
申请人： Richard S. Anderson , James H. Connelly , David S. Hanson , Joseph W. Soucy , Thomas F. Marinis
发明人： Richard S. Anderson , James H. Connelly , David S. Hanson , Joseph W. Soucy , Thomas F. Marinis
IPC分类号： B81B7/00 , H01L27/14 , H05K20060101
CPC分类号： B81B7/007 , H01L2224/48091 , H01L2924/00014
摘要： An integrated sensor and electronics package wherein a micro-electromechanical sensor die is bonded to one side of the package substrate, one or more electronic chips are bonded to an opposite side of the package substrate, internal electrical connections run from the sensor die, through the package substrate, and to the one or more electronic chips, and input/output connections on the package substrate are electrically connected to one or more of the electronic chips.
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