公开(公告)号：US5358165A

公开(公告)日：1994-10-25

申请号：US60540

申请日：1993-05-13

申请人： Jun Andoh

发明人： Jun Andoh

IPC分类号： G03G15/02 ,  H01T19/00 ,  H05K13/06

CPC分类号： H05K13/06 ,  H01T19/00

摘要： An automatic wiring machine of a corona discharge device with a wire wound around a spool by displacement of a head, comprises a head for wiring along a wiring pattern of the corona discharge device set on a palette and holding the wire, a tension device for applying a required tension to the supplied wire when the head carries out wiring, a welding machine for welding an arranged wire onto the corona discharge device and fixing the wire and a cutting device for cutting an unnecessary portion of the wire.

摘要翻译： 一种电晕放电装置的自动布线机，其具有通过头部移位缠绕在线轴上的线，包括：沿着设置在调色板上并且保持线的电晕放电装置的布线图案布线的头，用于施加的张力装置 当头部进行布线时，所供应的线材所需的张力，用于将布置的线材焊接到电晕放电装置上并固定线材的焊接机以及用于切割线材的不需要部分的切割装置。

公开(公告)号：US06795257B2

公开(公告)日：2004-09-21

申请号：US09888600

申请日：2001-06-26

申请人： Jun Andoh ,  Yoshihiro Morii ,  Hiroshi Takemoto ,  Nobuaki Ono ,  Toshio Kobayashi

发明人： Jun Andoh ,  Yoshihiro Morii ,  Hiroshi Takemoto ,  Nobuaki Ono ,  Toshio Kobayashi

IPC分类号： G02B702

CPC分类号： G02B27/62 ,  G02B7/025 ,  G02B26/12

摘要： Providing a fixing structure for parts of optical element by which fixing of parts of optical element with high accuracy can be achieved after positional adjustment in axes with an arrangement the positional adjustment in axes of parts of optical element is easily achieved before the fixing of the parts of optical element. The fixing structure comprises lens 3 having an edge surface which is a side surface surrounding a light beam passing surface; an intermediate holding member 5 having a first attaching surface 5a which is facing to the side surface and having a second attaching surface 5b which has a different angle from said first attaching surface 5a; and a housing 2 having an attaching surface 2c which is facing to the second attaching surface 5b; the housing 2 and the lens 3 which has been adjusted the positional relation to the housing 2 are adhered and fixed through the intermediate holding member 5.

摘要翻译： 提供一种用于光学元件的部件的固定结构，通过这样的方式，可以在轴的位置调整之后实现光学元件的高精度部件的固定，即在部件的固定之前容易实现光学元件的部件的轴线的位置调整 的光学元件。 固定结构包括具有围绕光束通过表面的侧表面的边缘表面的透镜3; 中间保持构件5具有面向侧面的第一安装面5a，具有与第一安装面5a成不同角度的第二安装面5b; 以及具有与第二安装面5b相对的安装面2c的壳体2; 已经调节了与壳体2的位置关系的壳体2和透镜3通过中间保持构件5粘结和固定。

公开(公告)号：US06740949B2

公开(公告)日：2004-05-25

申请号：US10231282

申请日：2002-08-30

申请人： Jun Andoh ,  Tatsuya Tsuyuki

发明人： Jun Andoh ,  Tatsuya Tsuyuki

IPC分类号： H01L310232

CPC分类号： H01L31/0203 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/16195 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed is a solid state image sensing device. The solid state image sensing device comprises a semiconductor chip for image sensing which has at least one of photoelectric conversion element line; and a package into which the semiconductor chip is received. The package is composed of an insulating package body which has the semiconductor chip mounted on a flat inner bottom surface of a concave portion; a transparent cover glass to be fixed on an upper surface of an outer frame of the concave portion for sealing the concave portion; and a lead frame which is brought out to the outside of the package body. The solid state image sensing device has a reference plane for attaching onto an image input apparatus is arranged on the package. The reference plane for attaching is made parallel to the inner bottom surface of the concave portion on which the semiconductor chip is mounted.

摘要翻译： 公开了一种固态图像感测装置。 该固态图像感测装置包括：具有光电转换元件线中至少一个的用于图像感测的半导体芯片; 以及接收半导体芯片的封装。 封装由绝缘封装体组成，绝缘封装体具有安装在凹部的平坦的内底面上的半导体芯片; 固定在所述凹部的外框的上表面的透明盖玻璃，用于密封所述凹部; 以及引出框架，其被引出到包装体的外部。 固态图像感测装置具有用于附着到图像输入装置上的参考平面布置在包装上。 用于安装的参考平面与安装有半导体芯片的凹部的内底表面平行。

公开(公告)号：US06472247B1

公开(公告)日：2002-10-29

申请号：US09886990

申请日：2001-06-25

申请人： Jun Andoh ,  Yoshihiro Morii ,  Toshio Kobayashi ,  Akio Yashiba ,  Hiroshi Takemoto ,  Takeshi Sano ,  Tsutomu Sakatsu

发明人： Jun Andoh ,  Yoshihiro Morii ,  Toshio Kobayashi ,  Akio Yashiba ,  Hiroshi Takemoto ,  Takeshi Sano ,  Tsutomu Sakatsu

IPC分类号： H01L2100

CPC分类号： H01L27/14618 ,  H01L23/13 ,  H01L24/81 ,  H01L27/14625 ,  H01L27/14683 ,  H01L29/0657 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/18 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/00 ,  H01L2224/0401

摘要： In a solid-state imaging device and its production method according to the present invention, a solid-state image sensor has an effective light-receiving region on a circuit formation surface provided in a face-down condition. A transparent substrate has a conductor pattern provided thereon to confront the circuit formation surface of the image sensor. A transparent adhesive agent is provided between the image sensor and the substrate and formed into a thin layer, the adhesive agent covering the light-receiving region of the image sensor. A plurality of bumps are provided on one of the image sensor and the substrate to interconnect the image sensor and the conductor pattern of the substrate.

摘要翻译： 在根据本发明的固态成像装置及其制造方法中，固态图像传感器在面朝下设置的电路形成面上具有有效的受光区域。 透明基板具有设置在其上的导体图案，以面对图像传感器的电路形成表面。 在图像传感器和基板之间设置透明粘合剂，并形成薄膜，该粘合剂覆盖图像传感器的光接收区域。 在图像传感器和基板中的一个上设置多个凸块以将图像传感器和基板的导体图案互连。