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公开(公告)号:US11717004B2
公开(公告)日:2023-08-08
申请号:US16607790
申请日:2018-04-20
IPC分类号: A23G9/28 , A21D13/33 , A21D13/36 , A23P20/15 , A21D13/24 , A21C15/02 , A23G9/48 , A23G9/50 , B65D3/06 , B65D85/78
CPC分类号: A23G9/288 , A21C15/025 , A21D13/24 , A21D13/33 , A21D13/36 , A23G9/283 , A23G9/48 , A23G9/506 , A23P20/15 , B65D3/06 , B65D85/78
摘要: The present disclosure relates to a method for preparing an ice cream cone, formed by a cone-shaped wafer and a layer of chocolate arranged on the inner face and upper edge of said wafer, with ice cream inside the ice cream cone. Another object of the invention is the ice cream cone obtained from said process.
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公开(公告)号:US20200178561A1
公开(公告)日:2020-06-11
申请号:US16607790
申请日:2018-04-20
IPC分类号: A23G9/28 , A23G9/50 , A23P20/15 , A23G9/48 , A21C15/02 , A21D13/24 , A21D13/33 , A21D13/36 , B65D85/78 , B65D3/06
摘要: The present disclosure relates to a method for preparing an ice cream cone, formed by a cone-shaped wafer and a layer of chocolate arranged on the inner face and upper edge of said wafer, with ice cream inside the ice cream cone. Another object of the invention is the ice cream cone obtained from said process.
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