公开(公告)号：US20110042784A1

公开(公告)日：2011-02-24

申请号：US12854973

申请日：2010-08-12

申请人： David L. Edwards ,  Jean-Luc Landreville ,  Kathryn R. Lange ,  Carl Savard ,  Kamla K. Sikka ,  Hilton T. Toy

发明人： David L. Edwards ,  Jean-Luc Landreville ,  Kathryn R. Lange ,  Carl Savard ,  Kamla K. Sikka ,  Hilton T. Toy

IPC分类号： H01L23/29 ,  H01L21/50 ,  H01L23/52

CPC分类号： H01L23/3675 ,  H01L21/563 ,  H01L21/565 ,  H01L23/293 ,  H01L23/296 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/00

摘要： Embodiments of the invention are generally related to packaging of integrated circuit devices, and more specifically to the placement of thermal paste for cooling an integrated circuit device during operation. A barrier element may be placed along at least one side of an integrated circuit chip. The barrier element may contain thermal paste pumped out during expansion and contraction of the package components to areas near the chip. The barrier element may also form a reservoir to replenish thermal paste that is lost during thermal pumping of the paste.

摘要翻译： 本发明的实施例通常涉及集成电路器件的封装，更具体地涉及在操作期间放置用于冷却集成电路器件的散热膏。 屏障元件可以沿着集成电路芯片的至少一侧放置。 阻挡元件可以包含在包装部件膨胀和收缩期间泵出的热浆料到芯片附近的区域。 阻挡元件还可以形成储存器以补充在浆料的热泵送期间损失的热糊料。