公开(公告)号：US07512518B2

公开(公告)日：2009-03-31

申请号：US11780064

申请日：2007-07-19

申请人： Alexandre Blander ,  Richard Brassard ,  Carl Savard ,  Julien Sylvestre

发明人： Alexandre Blander ,  Richard Brassard ,  Carl Savard ,  Julien Sylvestre

IPC分类号： G06F15/00

CPC分类号： G01B17/02

摘要： A method of using acoustic signals in the form of waves or pulses to non-destructively measure the thickness of a bonding layer sandwiched between and bonding together overlying and underlying materials different from the bonding layer especially when the thickness of the bonding layer is so small that the features (maxima, minima, time position) of the echo from the interface of the bonding layer and the overlying material is indistinguishable, i.e., not independently observable from the features (maxima, minima, time position) of the echo from the interface of the bonding layer and the underlying material.

摘要翻译： 使用波形或脉冲形式的声信号以非破坏性方式测量不同于接合层的覆盖层和下层材料之间的粘合层的厚度，并且粘结在一起，特别是当粘合层的厚度如此小时，特别是当接合层的厚度如此小时， 来自接合层和覆盖材料的界面的回波的特征（最大值，最小值，时间位置）是不可区分的，即不能独立地从来自接口的界面的特征（最大值，最小值，时间位置）观察到回波 粘合层和下层材料。

公开(公告)号：US20110042784A1

公开(公告)日：2011-02-24

申请号：US12854973

申请日：2010-08-12

申请人： David L. Edwards ,  Jean-Luc Landreville ,  Kathryn R. Lange ,  Carl Savard ,  Kamla K. Sikka ,  Hilton T. Toy

发明人： David L. Edwards ,  Jean-Luc Landreville ,  Kathryn R. Lange ,  Carl Savard ,  Kamla K. Sikka ,  Hilton T. Toy

IPC分类号： H01L23/29 ,  H01L21/50 ,  H01L23/52

CPC分类号： H01L23/3675 ,  H01L21/563 ,  H01L21/565 ,  H01L23/293 ,  H01L23/296 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/00

摘要： Embodiments of the invention are generally related to packaging of integrated circuit devices, and more specifically to the placement of thermal paste for cooling an integrated circuit device during operation. A barrier element may be placed along at least one side of an integrated circuit chip. The barrier element may contain thermal paste pumped out during expansion and contraction of the package components to areas near the chip. The barrier element may also form a reservoir to replenish thermal paste that is lost during thermal pumping of the paste.

摘要翻译： 本发明的实施例通常涉及集成电路器件的封装，更具体地涉及在操作期间放置用于冷却集成电路器件的散热膏。 屏障元件可以沿着集成电路芯片的至少一侧放置。 阻挡元件可以包含在包装部件膨胀和收缩期间泵出的热浆料到芯片附近的区域。 阻挡元件还可以形成储存器以补充在浆料的热泵送期间损失的热糊料。

公开(公告)号：US20080021673A1

公开(公告)日：2008-01-24

申请号：US11780064

申请日：2007-07-19

申请人： Alexandre Blander ,  Richard Brassard ,  Carl Savard ,  Julien Sylvestre

发明人： Alexandre Blander ,  Richard Brassard ,  Carl Savard ,  Julien Sylvestre

IPC分类号： G01B17/02

CPC分类号： G01B17/02

摘要： A method of using acoustic signals in the form of waves or pulses to non-destructively measure the thickness of a bonding layer sandwiched between and bonding together overlying and underlying materials different from the bonding layer especially when the thickness of the bonding layer is so small that the features (maxima, minima, time position) of the echo from the interface of the bonding layer and the overlying material is indistinguishable, i.e., not independently observable from the features (maxima, minima, time position) of the echo from the interface of the bonding layer and the underlying material.

摘要翻译： 使用波形或脉冲形式的声信号以非破坏性方式测量不同于接合层的覆盖层和下层材料之间的粘合层的厚度，并且粘结在一起，特别是当粘合层的厚度如此小时，特别是当接合层的厚度如此小时， 来自接合层和覆盖材料的界面的回波的特征（最大值，最小值，时间位置）是不可区分的，即不能独立地从来自接口的界面的特征（最大值，最小值，时间位置）观察到回波 粘合层和下层材料。