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1.
公开(公告)号:US20080248726A1
公开(公告)日:2008-10-09
申请号:US10586593
申请日:2004-12-09
CPC分类号: C09K3/1463 , B24B1/00 , B24B19/226 , B24B49/00 , C09K3/1409
摘要: Disclosed is a polishing method which is effective to prevent lowering of the polishing efficiency in the later stage of polishing. The polishing method is characterized in that polishing is performed while so adjusting a polishing liquid as to have a pH of not less than 2 and less than 7.
摘要翻译: 公开了一种抛光方法,其有效地防止抛光后期抛光效率的降低。 抛光方法的特征在于,在调整抛光液的同时进行抛光,使其pH值不小于2且小于7。