SOI semiconductor wafer having different thickness active layers and semiconductor device formed therein

    公开(公告)号:US06593627B2

    公开(公告)日:2003-07-15

    申请号:US10108648

    申请日:2002-03-29

    申请人: Katsumi Egashira

    发明人: Katsumi Egashira

    IPC分类号: H01L2701

    摘要: A semiconductor wafer has a first element forming section, a second element forming section adjoining the first element forming section, and a third element forming section adjoining the second element forming section. The first element forming section has a first supporting substrate, a first buried insulating film formed on the first supporting substrate, and a first active layer formed on the first buried insulating film. The second element forming section has a second supporting substrate, a second buried insulating film formed on the second supporting substrate, and a second active layer formed on the second buried insulating film. The second active layer has a thickness being different from a thickness of the first active layer. The third element forming section has a third active layer.