公开(公告)号：US5226404A

公开(公告)日：1993-07-13

申请号：US902477

申请日：1992-06-19

申请人： Katsumi Mogi ,  Hiro Ohzeki

发明人： Katsumi Mogi ,  Hiro Ohzeki

IPC分类号： B27B17/08 ,  B27B33/14 ,  B28D1/08 ,  B28D1/12

CPC分类号： B27B33/144 ,  B27B17/08 ,  B27B33/14 ,  B27B33/145 ,  B27B33/148 ,  B28D1/082 ,  B28D1/125 ,  Y10T83/7101 ,  Y10T83/7201 ,  Y10T83/913

摘要： A cutting apparatus comprises an endless chain body comprising a plurality of plate-like flaps connected to each other for angular movement in a common plane. Each flap has an end face on an inner peripheral side of the chain body, and at least a part of the flaps having a cutting device at the end face. The apparatus further comprises a plurality of sprockets supporting the chain body in tension, and defining a common plane of cut effected by the combination of the chain body and the sprockets. The chain body is supported by a rigid backplate, of thickness not greater than the thickness of the flaps. It provides a firm support to the rotating chain body to permit sliding movement of the chain body within the common plane of cut. The apparatus further comprises a means for activating the rotational movement of the sprockets in cooperation with the chain body, and a means for moving an object or the chain body toward each other to effect removal of a material disposed within the extended plane of the common plane of cut to effect separation of an object into severed sections.

摘要翻译： 切割装置包括环形链体，其包括彼此连接的多个板状翼片，用于在公共平面中进行角运动。 每个翼片在链体的内周侧具有端面，并且至少一部分翼片在端面处具有切割装置。 该装置还包括多个链轮，其在张力下支撑链体，并且限定由链体和链轮组合实现的公共切割平面。 链体由刚性背板支撑，厚度不大于襟翼的厚度。 它为旋转链体提供牢固的支撑，以允许链体在共同切割平面内的滑动运动。 该装置还包括用于与链条主体一起启动链轮的旋转运动的装置，以及用于将物体或链条体朝向彼此移动以实现设置在公共平面的延伸平面内的材料的移除的装置 切割以实现将物体分离成切断的部分。

公开(公告)号：US5657123A

公开(公告)日：1997-08-12

申请号：US528194

申请日：1995-09-14

申请人： Katsumi Mogi ,  Osamu Endo

发明人： Katsumi Mogi ,  Osamu Endo

IPC分类号： G01B11/06 ,  G01B9/02

CPC分类号： B24B49/12 ,  B24B37/005 ,  B24B49/08 ,  G01B11/0675

摘要： A light interference-type film thickness measuring mechanism 24 measures a film thickness by irradiating a light emitted from a light transmission portion on to the bottom surface of a wafer W held by a wafer holding head 8 and receives the reflected light and. A cleaning mechanism 26 includes a cleaning fluid tank 27 a top surface of which is opened and arranged in the vicinity of the bottom surface of the wafer; a light transmission portion 50 formed at the bottom portion 48 of the tank 27; a wafer cleaning nozzle 40 spraying the cleaning fluid on the measuring points at the bottom surface of the wafer; a light transmission portion cleaning nozzle 44 spraying the cleaning fluid on the light transmission portion 50 and cleaning fluid supply means for supplying cleaning fluid to these nozzles.

摘要翻译： 光干涉型膜厚测量机构24通过将从透光部分发射的光照射到由晶片保持头8保持的晶片W的底表面上来测量膜厚度，并接收反射光。 清洁机构26包括其顶表面被打开并布置在晶片的底表面附近的清洁流体箱27; 形成在罐27的底部48处的光透射部分50; 将清洗液喷射在晶片底面的测量点上的晶片清洗喷嘴40; 在该透光部分50上喷射清洗液的透光部清洗喷嘴44以及向这些喷嘴供给清洗液的清洗液供给机构。

公开(公告)号：US5209216A

公开(公告)日：1993-05-11

申请号：US850222

申请日：1992-03-12

申请人： Katsumi Mogi

发明人： Katsumi Mogi

IPC分类号： B27B17/08 ,  B27B33/14 ,  B28D1/08 ,  B28D1/12

CPC分类号： B27B17/08 ,  B27B33/14 ,  B27B33/144 ,  B27B33/145 ,  B27B33/148 ,  B28D1/082 ,  B28D1/125 ,  Y10T83/913

摘要： A chain cutter comprises an endless chain body including a plurality of plate-like flaps connected to each other to provide angular movement in a common plane; each of the flaps has an end face on a inner peripheral side of said chain body, and at least a part of said flaps has a cutting device at the end face.

摘要翻译： 链条切割器包括环形链体，其包括彼此连接的多个板状翼片，以在公共平面中提供角运动; 每个翼片在所述链体的内周侧具有端面，并且所述翼片的至少一部分在端面处具有切割装置。

公开(公告)号：US5531635A

公开(公告)日：1996-07-02

申请号：US406527

申请日：1995-03-20

申请人： Katsumi Mogi ,  Osamu Endo

发明人： Katsumi Mogi ,  Osamu Endo

IPC分类号： B24B53/007 ,  B24B53/017 ,  B24B53/12 ,  H01L21/304 ,  B24B53/00

CPC分类号： B24B53/017

摘要： A truing apparatus for a wafer polishing pad is provided which is capable of obtaining a sufficient truing effect while keeping the polishing amount of a polishing pad to a maximum. The truing apparatus includes a truing grinding wheel having an abrasive grain layer having ultra-abrasive grains electrodeposited thereon, a support arm for rotatably supporting the truing grinding wheel by bringing the polishing surface of an electrodeposition abrasive grain layer into abutment with the polishing pad, a grinding wheel rotary motor for rotating the grinding wheel, a self-aligning bearing disposed between a grinding wheel support plate and a grinding wheel rotation shaft, and pure water supply means for supplying pure water from the inside of the truing grinding wheel. The outer diameter of the grinding wheel is greater than the outer diameter of the wafers W, and the polishing surface of the grinding wheel is brought into abutment with the polishing pad over the overall width of one circumferential portion of a wafer polishing area. The grain size of the ultra-abrasive grains is preferably set at #60 to #230.

摘要翻译： 提供了一种用于晶片抛光垫的修整装置，其能够在保持抛光垫的抛光量最大的同时获得足够的修整效果。 修整装置包括：研磨砂轮，具有电沉积在其上的超磨粒的磨粒层，支撑臂，用于通过使电沉积磨粒层的抛光表面与抛光垫邻接，可旋转地支撑修整砂轮; 用于旋转砂轮的砂轮旋转马达，设置在砂轮支撑板和砂轮旋转轴之间的自调心轴承，以及用于从修整砂轮内部供应纯净水的纯净水供给装置。 砂轮的外径大于晶片W的外径，并且研磨轮的抛光表面在抛光垫的一个圆周部分的整个宽度上与抛光垫抵接。 超磨粒的粒径优选设定为＃60〜＃230。