公开(公告)号：US20090081372A1

公开(公告)日：2009-03-26

申请号：US12236568

申请日：2008-09-24

申请人： Ken-ichi Sugimura ,  Kazuhisa Hirao

发明人： Ken-ichi Sugimura ,  Kazuhisa Hirao

IPC分类号： B05D3/02 ,  H01B1/22

CPC分类号： H01B1/02 ,  B22F7/04 ,  B22F2998/10 ,  C04B41/009 ,  C04B41/5144 ,  C04B41/52 ,  C04B2111/00844 ,  C22C32/0089 ,  H01G4/0085 ,  H01G4/30 ,  C04B41/4539 ,  C04B41/4578 ,  C04B41/5041 ,  C04B35/00 ,  C04B35/468 ,  B22F1/0059 ,  B22F3/22 ,  B22F3/1021

摘要： The present invention provides a conductor paste for rapid firing that is applied to a ceramic green sheet and is fired along with the green sheet under high-rate temperature rise conditions at a high heating rate of at least 600° C./hr from room temperature to the maximum firing temperature. The paste includes as a conductor-forming powder material: a conductive metallic powder comprising, as a main component, nickel powder; and barium titanate ceramic powder with a mean particle diameter of 10 nm to 80 nm as an additive. The ceramic powder content is 5 to 25 mass parts per 100 mass parts of the conductive metallic powder.

摘要翻译： 本发明提供一种用于快速烧制的导体糊料，其用于陶瓷生片，并在高速升温条件下以与室温下至少600℃/小时的高加热速率一起焙烧 达到最高烧制温度。 该糊状物包括作为导体形成粉末材料的导电金属粉末，其以镍粉末为主要成分; 和平均粒径为10nm至80nm的钛酸钡陶瓷粉末作为添加剂。 陶瓷粉末含量为每100质量份导电金属粉末为5〜25质量份。

公开(公告)号：US20120121798A1

公开(公告)日：2012-05-17

申请号：US13358686

申请日：2012-01-26

申请人： Ken-ichi Sugimura ,  Kazuhisa Hirao

发明人： Ken-ichi Sugimura ,  Kazuhisa Hirao

IPC分类号： B05D5/12 ,  B05D3/02

CPC分类号： H01B1/02 ,  B22F7/04 ,  B22F2998/10 ,  C04B41/009 ,  C04B41/5144 ,  C04B41/52 ,  C04B2111/00844 ,  C22C32/0089 ,  H01G4/0085 ,  H01G4/30 ,  C04B41/4539 ,  C04B41/4578 ,  C04B41/5041 ,  C04B35/00 ,  C04B35/468 ,  B22F1/0059 ,  B22F3/22 ,  B22F3/1021

摘要： The present invention provides a conductor paste for rapid firing that is applied to a ceramic green sheet and is fired along with the green sheet under high-rate temperature rise conditions at a high heating rate of at least 600° C./hr from room temperature to the maximum firing temperature. The paste includes as a conductor-forming powder material: a conductive metallic powder comprising, as a main component, nickel powder; and barium titanate ceramic powder with a mean particle diameter of 10 nm to 80 nm as an additive. The ceramic powder content is 5 to 25 mass parts per 100 mass parts of the conductive metallic powder.

摘要翻译： 本发明提供一种用于快速烧制的导体糊料，其用于陶瓷生片，并在高速升温条件下以与室温下至少600℃/小时的高加热速率一起焙烧 达到最高烧制温度。 该糊状物包括作为导体形成粉末材料的导电金属粉末，其以镍粉末为主要成分; 和平均粒径为10nm至80nm的钛酸钡陶瓷粉末作为添加剂。 陶瓷粉末含量为每100质量份导电金属粉末为5〜25质量份。