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    Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste
    1.
    发明授权
    Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste 有权
    铜颗粒簇和粉末含有与导电胶的导电填料相同的粉末

    公开(公告)号：US06620344B2

    公开(公告)日：2003-09-16

    申请号：US09741024

    申请日：2000-12-21

    申请人： Kazushi Sano ,  Yoshihiro Okada ,  Hiromasa Miyoshi ,  Yoshiomi Takada

    发明人： Kazushi Sano ,  Yoshihiro Okada ,  Hiromasa Miyoshi ,  Yoshiomi Takada

    IPC分类号： H01B102

    CPC分类号： C09D5/24 ,  B22F1/0014 ,  B22F1/0096 ,  B22F9/24 ,  H01B1/026 ,  H01C7/027 ,  H05K1/095 ,  Y10T428/2982

    摘要： Copper particle clusters constituting a powder suitable for making a conductive paste are provided that are individually composed of not fewer than two and not more than 20 unit particles joined through neck portions. A conductive paste made from the powder is excellent in conductivity. A conductive filler for conductive paste is provided that consists essentially of a mixture of copper particle clusters A individually composed of two or more unit particles joined through neck portions and spherical metallic particles B of smaller diameter than the particles A. A conductive paste made from the filler is low in viscosity and excellent in conductivity.

    摘要翻译： 提供构成适于制造导电浆料的粉末的铜颗粒簇，其分别由不少于2个且不超过20个通过颈部连接的单位颗粒构成。 由粉末制成的导电膏具有优异的导电性。 提供一种用于导电膏的导电填料，其基本上由单独由两个或更多个通过颈部连接的单元颗粒组成的铜颗粒簇A和直径小于颗粒A的球形金属颗粒B的混合物组成。由 填料粘度低，导电性好。

    Ferromagnetic powder
    2.
    发明授权
    Ferromagnetic powder 有权
    铁磁粉

    公开(公告)号：US06506264B1

    公开(公告)日：2003-01-14

    申请号：US09601942

    申请日：2000-08-10

    申请人： Seiichi Hisano ,  Kazuhisa Saito ,  Kazushi Sano ,  Akio Sawabe ,  Akito Inoue ,  Kenichi Inoue

    发明人： Seiichi Hisano ,  Kazuhisa Saito ,  Kazushi Sano ,  Akio Sawabe ,  Akito Inoue ,  Kenichi Inoue

    IPC分类号： H01F1055

    CPC分类号： H01F1/06 ,  B22F1/0011 ,  C22C33/0285 ,  G11B5/70621 ,  G11B5/714

    摘要： A ferromagnetic powder containing iron as the principal component and containing more than 5 to 50 at. % Co, 0.1 to 30 at. % Al, 0.1 to 10 at. % of a rare earth element inclusive of Y, 0.05% by weight or less of an element belonging to Group 1a of the Periodic Table, and 0.1% by weight or less (inclusive of 0% by weight) of an element belonging to Group 2a of the Periodic Table, the powder comprising flat acicular particles having a mean major axis length of 0.01 to 0.40 &mgr;m and a crystallite diameter as determined by X-ray diffraction (Dx) of 50 to 250 angstrom, provided that the cross section diameter in the minor axis direction cut perpendicular to the major axis has a larger width and a smaller width, and that this cross section ratio in the minor axis direction, which is a larger width to smaller width ratio, uniformly yields a value of greater than 1, preferably 1.5 or higher, and the powder yielding a &sgr;s/Dx ratio of 0.7 or higher, wherein, &sgr;s represents the saturation magnetization and Dx represents the crystallite size determined by X-ray diffraction.

    摘要翻译： 含有铁作为主要成分并含有5〜50个以上的铁磁粉末。 ％Co，0.1〜30at。 ％Al，0.1〜10at。 含有Y的稀土元素的％，属于元素周期表的第1a族的元素的0.05重量％以下，属于第2a族的元素的0.1重量％以下（包括0重量％） 的周期表的粉末，该粉末包含平均长轴长度为0.01至0.40μm的扁平针状颗粒和通过X射线衍射测定的微晶直径（Dx）为50至250埃，条件是在 垂直于长轴的短轴方向具有较大的宽度和较小的宽度，并且短径方向上的宽度与宽度比较大的横截面比均匀地产生大于1的值，优选地 1.5或更高，并且产生0.7或更高的sigmas / Dx比的粉末，其中sigmas表示饱和磁化强度，Dx表示通过X射线衍射确定的微晶尺寸。

    Copper powder and process for producing copper powder
    6.
    发明授权
    Copper powder and process for producing copper powder 有权
    铜粉和铜粉生产工艺

    公开(公告)号：US06875252B2

    公开(公告)日：2005-04-05

    申请号：US10216750

    申请日：2002-08-13

    申请人： Kazushi Sano ,  Yoshihiro Okada ,  Hiromasa Miyoshi ,  Yoshiomi Takada

    发明人： Kazushi Sano ,  Yoshihiro Okada ,  Hiromasa Miyoshi ,  Yoshiomi Takada

    IPC分类号： B22F9/16 ,  B22F9/24 ,  H01G4/008 ,  B22F1/00

    CPC分类号： H01G4/0085 ,  B22F9/24

    摘要： A copper powder is provided that has an average particle diameter in the range of from not less than 0.1 μm to less than 1.5 μm, that has a narrow particle size distribution width whose value A defined by Equation (1) below in terms of X25, X50 and X75 defined below is not greater than 1.2, and that forms a pseudo-fused sintered product when held at a temperature of 800° C. under an atmosphere of inert gas at one atmosphere pressure: A=(X75−X25)/X50  (1), where X25, X50 and X75 are values of particle diameter X corresponding to Q %=25%, 50% and 75% on a cumulative particle-size curve plotted in an orthogonal coordinate system whose abcissa represents particle diameter X (μm) and ordinate represents Q % (ratio of particles present of a diameter not greater than the corresponding value of X; expressed in units of vol % of particles). The copper powder is produced by conducting wet reduction of cuprous oxide into metallic copper powder in the presence of ammonia or an ammonium salt. When used to form the terminal electrodes of multi-layer capacitor, it enables the electrodes to form into solid sintered bodies with few pores by sintering at a low temperature.

    摘要翻译： 提供了具有平均粒径在0.1μm以上且小于1.5μm的范围内的铜粉末，其具有窄的粒度分布宽度，其由以下等式（1）定义的值为X25， 下面定义的X50和X75不大于1.2，并且当在一个大气压力的惰性气体气氛下在800℃的温度下保持时形成假熔融烧结产品：其中X25，X50和X75为 在垂直坐标系中绘制的累积粒度曲线上的Q％= 25％，50％和75％的粒径X，其坐标表示粒径X（母体），纵坐标表示Q％（a 直径不大于X的相应值;以粒子的体积％为单位表示）。 通过在氨或铵盐的存在下将氧化亚铜湿法还原成金属铜粉来制造铜粉末。 当用于形成多层电容器的端子电极时，通过在低温下烧结，能够使电极形成具有少孔的固体烧结体。

    Copper powder for electrically conductive paste
    7.
    发明授权
    Copper powder for electrically conductive paste 有权
    铜粉用于导电糊

    公开(公告)号：US06881240B2

    公开(公告)日：2005-04-19

    申请号：US10319529

    申请日：2002-12-16

    申请人： Kazushi Sano ,  Yoshihiro Okada ,  Hiromasa Miyoshi

    发明人： Kazushi Sano ,  Yoshihiro Okada ,  Hiromasa Miyoshi

    IPC分类号： B22F1/00 ,  B22F9/24 ,  H05K1/09

    CPC分类号： B22F1/0062 ,  B22F1/0081 ,  B22F9/24 ,  B22F2998/00 ,  B22F2998/10 ,  H05K1/095 ,  Y10T428/12181 ,  B22F1/02 ,  B22F9/04 ,  B22F1/0059

    摘要： When copper powder manufactured by a wet reduction method is kneaded with resin in a high filling rate, it is difficult to maintain a low viscosity. The invention is to solve the problem of high viscosity without changing the characteristics such as particle size and specific surface area of the copper powder obtained by a wet reduction method. This invention relates to copper powder for an electrically conductive paste wherein copper powder manufactured by a wet reduction method is subjected to a surface-flattening treatment in which the particles are mechanically collided each other.

    摘要翻译： 当通过湿还原法制造的铜粉以高填充率与树脂捏合时，难以保持低粘度。 本发明解决高粘度问题，而不改变通过湿法还原法得到的铜粉末的粒度和比表面积等特性。 本发明涉及一种用于导电膏的铜粉，其中通过湿法还原法制造的铜粉经受其中颗粒机械相互碰撞的表面平整处理。

    Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste
    8.
    发明授权
    Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste 有权
    铜颗粒簇和粉末含有与导电胶的导电填料相同的粉末

    公开(公告)号：US07235119B2

    公开(公告)日：2007-06-26

    申请号：US11084116

    申请日：2005-03-21

    申请人： Kazushi Sano ,  Yoshihiro Okada ,  Hiromasa Miyoshi ,  Yoshiomi Takada

    发明人： Kazushi Sano ,  Yoshihiro Okada ,  Hiromasa Miyoshi ,  Yoshiomi Takada

    IPC分类号： B22F9/24

    CPC分类号： C09D5/24 ,  B22F1/0014 ,  B22F1/0096 ,  B22F9/24 ,  H01B1/026 ,  H01C7/027 ,  H05K1/095 ,  Y10T428/2982

    摘要： Copper particle clusters constituting a powder suitable for making a conductive paste are provided that are individually composed of not fewer than two and not more than 20 unit particles joined through neck portions. A conductive paste made from the powder is excellent in conductivity. A conductive filler for conductive paste is provided that consists essentially of a mixture of copper particle clusters A individually composed of two or more unit particles joined through neck portions and spherical metallic particles B of smaller diameter than the particles A. A conductive paste made from the filler is low in viscosity and excellent in conductivity.

    摘要翻译： 提供构成适于制造导电浆料的粉末的铜颗粒簇，其分别由不少于2个且不超过20个通过颈部连接的单位颗粒构成。 由粉末制成的导电膏具有优异的导电性。 提供一种用于导电膏的导电填料，其基本上由单独由两个或更多个通过颈部连接的单元颗粒组成的铜颗粒簇A和直径小于颗粒A的球形金属颗粒B的混合物组成。由 填料粘度低，导电性好。