公开(公告)号：US06369450B1

公开(公告)日：2002-04-09

申请号：US09482103

申请日：2000-01-13

申请人： Kazuyoshi Amani ,  Tsukasa Shiraishi ,  Yoshihiro Bessho

发明人： Kazuyoshi Amani ,  Tsukasa Shiraishi ,  Yoshihiro Bessho

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13082 ,  H01L2224/13099 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/305 ,  H05K3/321 ,  H01L2924/00014

摘要： A mounting structure is formed by flip-chip mounting a semiconductor device onto a substrate. An electrical connecting portion of the semiconductor device is connected to an electrical connecting portion of the substrate by means of an electrically conductive adhesive. A region of the semiconductor device which is not involved in electrical connection is bonded to a region of the substrate which is not involved in electrical connection by means of an adhesive. A test of electrical properties is performed on the semiconductor device and the substrate which are connected to each other. If it is determined that the electrical properties are poor in the test, the semiconductor device is separated from the substrate after heating a bonding place of the adhesive up to a temperature higher than a glass transition point or a melting point of the adhesive. If it is determined that the electrical properties are good in the test, the semiconductor device and the substrate are sealed by means of a sealing resin.

摘要翻译： 通过将半导体器件倒装安装到衬底上来形成安装结构。 半导体器件的电连接部分通过导电粘合剂连接到基片的电连接部分。 不参与电连接的半导体器件的区域通过粘合剂结合到不涉及电连接的基板的区域。 对彼此连接的半导体器件和衬底进行电特性的测试。 如果在测试中确定电气性能差，则在将粘合剂的粘合位置加热到高于粘合剂的玻璃化转变点或熔点的温度之后，半导体器件与基板分离。 如果在测试中确定电性能良好，则半导体器件和衬底通过密封树脂密封。