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公开(公告)号:US06960272B1
公开(公告)日:2005-11-01
申请号:US09711692
申请日:2000-11-13
申请人: Edward F. Tokas , Ken C. Caster , Mark A. Weih
发明人: Edward F. Tokas , Ken C. Caster , Mark A. Weih
CPC分类号: C08J5/12 , B60C1/00 , C09J5/04 , C09J2400/163 , C09J2421/006 , Y10S156/91
摘要: A method for bonding a material to a first substrate surface that includes providing a catalyst at the first substrate surface and then contacting that surface with a material that undergoes a metathesis reaction to bond the material to the first substrate surface. There are two embodiments of this method—a coating process and an adhesive process. In the coating embodiment, the metathesizable material is contacted with the catalyst on the substrate surface so that it undergoes metathesis polymerization to form the coating. The adhesive process includes (a) providing a catalyst at the first substrate surface, (b) providing a metathesizable material between the first substrate surface and the second substrate surface, and (c) contacting the catalyst on the first substrate surface with the metathesizable material so that the metathesizable material undergoes a metathesis reaction and bonds the first substrate surface to the second substrate surface.
摘要翻译: 一种用于将材料粘合到第一衬底表面的方法,包括在第一衬底表面处提供催化剂,然后使该表面与经历复分解反应的材料接触以将材料粘合到第一衬底表面。 该方法有两个实施方案 - 涂覆方法和粘合方法。 在涂布实施例中,可复分解材料与衬底表面上的催化剂接触,使得其进行易位聚合以形成涂层。 粘合方法包括(a)在第一基材表面提供催化剂,(b)在第一基材表面和第二基材表面之间提供可复分解材料,和(c)使第一基材表面上的催化剂与可复分解材料 使得可复分解材料经历复分解反应并将第一基材表面结合到第二基材表面。
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公开(公告)号:US06973949B1
公开(公告)日:2005-12-13
申请号:US09711567
申请日:2000-11-13
申请人: Edward F. Tokas , Ken C. Caster , Mark A. Weih
发明人: Edward F. Tokas , Ken C. Caster , Mark A. Weih
CPC分类号: C08J5/12 , B60C1/00 , C09J5/04 , C09J2400/163 , C09J2421/006 , Y10S156/91
摘要: A method for bonding a material to a first substrate surface that includes providing a catalyst at the first substrate surface and then contacting that surface with a material that undergoes a metathesis reaction to bond the material to the first substrate surface. There are two embodiments of this method—a coating process and an adhesive process. In the coating embodiment, the metathesizable material is contacted with the catalyst on the substrate surface so that it undergoes metathesis polymerization to form the coating. The adhesive process includes (a) providing a catalyst at the first substrate surface, (b) providing a metathesizable material between the first substrate surface and the second substrate surface, and (c) contacting the catalyst on the first substrate surface with the metathesizable material so that the metathesizable material undergoes a metathesis reaction and bonds the first substrate surface to the second substrate surface.
摘要翻译: 一种用于将材料粘合到第一衬底表面的方法,包括在第一衬底表面处提供催化剂,然后使该表面与经历复分解反应的材料接触以将材料粘合到第一衬底表面。 该方法有两个实施方案 - 涂覆方法和粘合方法。 在涂布实施例中,可复分解材料与衬底表面上的催化剂接触,使得其进行易位聚合以形成涂层。 粘合方法包括(a)在第一基材表面提供催化剂,(b)在第一基材表面和第二基材表面之间提供可复分解材料,和(c)使第一基材表面上的催化剂与可复分解材料 使得可复分解材料经历复分解反应并将第一基材表面结合到第二基材表面。
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公开(公告)号:US06962729B2
公开(公告)日:2005-11-08
申请号:US09209706
申请日:1998-12-11
申请人: Edward F. Tokas , Ken C. Caster
发明人: Edward F. Tokas , Ken C. Caster
CPC分类号: C08J5/12 , B60C1/00 , C09J5/04 , C09J2400/163 , C09J2421/006 , Y10S156/91
摘要: A method for bonding a material to a first substrate surface that includes providing a catalyst at the first substrate surface and then contacting that surface with a material that undergoes a metathesis reaction to bond the material to the first substrate surface. There are two embodiments of this method—a coating process and an adhesive process. In the coating embodiment, the metathesizable material is contacted with the catalyst on the substrate surface so that it undergoes metathesis polymerization to form the coating. The adhesive process includes (a) providing a catalyst at the first substrate surface, (b) providing a metathesizable material between the first substrate surface and the second substrate surface, and (c) contacting the catalyst on the first substrate surface with the metathesizable material so that the metathesizable material undergoes a metathesis reaction and bonds the first substrate surface to the second substrate surface.
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