公开(公告)号：US06923045B2

公开(公告)日：2005-08-02

申请号：US10892048

申请日：2004-07-15

申请人： Chee Peng Neo ,  Cher Khng Victor Tan ,  Kian Seng Ho ,  Hock Chuan Tan

发明人： Chee Peng Neo ,  Cher Khng Victor Tan ,  Kian Seng Ho ,  Hock Chuan Tan

IPC分类号： G01B11/30 ,  G01B5/34 ,  H01L21/66

CPC分类号： G01B11/303 ,  Y10T29/49004

摘要： An apparatus and method for detecting characteristics of a microelectronic substrate. The microelectronic substrate can have a first surface with first topographical features, such as roughness elements, and a second surface facing opposite from the first surface and having second topographical features, such as protruding conductive structures. In one embodiment, the apparatus can include a support member configured to carry the microelectronic substrate with a first portion of the first surface exposed and a second portion of the second surface exposed. The apparatus can further include a topographical feature detector positioned proximate to support member and aligned with the first portion of the first surface of the microelectronic substrate to detect characteristics, such as a roughness, of the first surface while the microelectronic substrate is carried by the support member.

摘要翻译： 一种用于检测微电子衬底特性的装置和方法。 微电子衬底可以具有第一表面，其具有第一形貌特征，诸如粗糙元件，以及与第一表面相对的第二表面，并且具有第二形貌特征，例如突出的导电结构。 在一个实施例中，该装置可以包括被配置为承载微电子基板的支撑构件，其中第一表面的第一部分被暴露并且第二表面的第二部分被暴露。 该装置还可以包括位于支撑构件附近并与微电子衬底的第一表面的第一部分对准的形貌特征检测器，以检测第一表面的特性，例如粗糙度，而微电子衬底由支撑体承载 会员。

公开(公告)号：US07213447B2

公开(公告)日：2007-05-08

申请号：US11157338

申请日：2005-06-20

申请人： Chee Peng Neo ,  Cher Khng Victor Tan ,  Kian Seng Ho ,  Hock Chuan Tan

发明人： Chee Peng Neo ,  Cher Khng Victor Tan ,  Kian Seng Ho ,  Hock Chuan Tan

IPC分类号： G01B5/34 ,  G06K9/00

CPC分类号： G01B11/303 ,  Y10T29/49004

摘要： An apparatus and method for detecting characteristics of a microelectronic substrate. The microelectronic substrate can have a first surface with first topographical features, such as roughness elements, and a second surface facing opposite from the first surface and having second topographical features, such as protruding conductive structures. In one embodiment, the apparatus can include a support member configured to carry the microelectronic substrate with a first portion of the first surface exposed and a second portion of the second surface exposed. The apparatus can further include a topographical feature detector positioned proximate to support member and aligned with the first portion of the first surface of the microelectronic substrate to detect characteristics, such as a roughness, of the first surface while the microelectronic substrate is carried by the support member.

摘要翻译： 一种用于检测微电子衬底特性的装置和方法。 微电子衬底可以具有第一表面，其具有第一形貌特征，诸如粗糙元件，以及与第一表面相对的第二表面，并且具有第二形貌特征，例如突出的导电结构。 在一个实施例中，该装置可以包括被配置为承载微电子基板的支撑构件，其中第一表面的第一部分被暴露并且第二表面的第二部分被暴露。 该装置还可以包括位于支撑构件附近并与微电子衬底的第一表面的第一部分对准的形貌特征检测器，以检测第一表面的特性，例如粗糙度，而微电子衬底由支撑体承载 会员。

公开(公告)号：US06779386B2

公开(公告)日：2004-08-24

申请号：US09944247

申请日：2001-08-30

申请人： Chee Peng Neo ,  Cher Khng Victor Tan ,  Kian Seng Ho ,  Hock Chuan Tan

发明人： Chee Peng Neo ,  Cher Khng Victor Tan ,  Kian Seng Ho ,  Hock Chuan Tan

IPC分类号： G01B534

CPC分类号： G01B11/303 ,  Y10T29/49004

摘要： An apparatus and method for detecting characteristics of a microelectronic substrate. The microelectronic substrate can have a first surface with first topographical features, such as roughness elements, and a second surface facing opposite from the first surface and having second topographical features, such as protruding conductive structures. In one embodiment, the apparatus can include a support member configured to carry the microelectronic substrate with a first portion of the first surface exposed and a second portion of the second surface exposed. The apparatus can further include a topographical feature detector positioned proximate to support member and aligned with the first portion of the first surface of the microelectronic substrate to detect characteristics, such as a roughness, of the first surface while the microelectronic substrate is carried by the support member.

摘要翻译： 一种用于检测微电子衬底特性的装置和方法。 微电子衬底可以具有第一表面，其具有第一形貌特征，诸如粗糙元件，以及与第一表面相对的第二表面，并且具有第二形貌特征，例如突出的导电结构。 在一个实施例中，该装置可以包括被配置为承载微电子基板的支撑构件，其中第一表面的第一部分被暴露并且第二表面的第二部分被暴露。 该装置还可以包括位于支撑构件附近并与微电子衬底的第一表面的第一部分对准的形貌特征检测器，以检测第一表面的特性，例如粗糙度，而微电子衬底由支撑体承载 会员。