公开(公告)号：US4814296A

公开(公告)日：1989-03-21

申请号：US90827

申请日：1987-08-28

申请人： Josef E. Jedlicka ,  Kimberly R. Page ,  Alain E. Perregaux ,  Fred F. Wilczak, Jr.

发明人： Josef E. Jedlicka ,  Kimberly R. Page ,  Alain E. Perregaux ,  Fred F. Wilczak, Jr.

IPC分类号： B28D5/00 ,  B27G19/10 ,  F28D5/00 ,  H01L21/301 ,  H01L21/304 ,  H01L21/306 ,  H01L27/148

CPC分类号： B27G19/10 ,  H01L21/3043 ,  Y10S148/028

摘要： A process for forming individual dies having faces that allow the dies to be assembled against other like dies to form one and/or two dimensional scanning arrays wherein the active side of a wafer is etched to form small V-shaped grooves defining the die faces, relatively wide grooves are cut in the inactive side of the wafer opposite each V-shaped groove, and the wafer cut by sawing along the V-shaped grooves, the saw being located so that the side of the saw blade facing the die is aligned with the bottom of the V-shaped groove so that there is retained intact one side of the V-shaped groove to intercept and prevent cracks and chipping caused by sawing from damaging the die active surface and any circuits thereon.