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公开(公告)号：US4814296A
公开(公告)日：1989-03-21
申请号：US90827
申请日：1987-08-28
IPC分类号： B28D5/00 , B27G19/10 , F28D5/00 , H01L21/301 , H01L21/304 , H01L21/306 , H01L27/148
CPC分类号： B27G19/10 , H01L21/3043 , Y10S148/028
摘要： A process for forming individual dies having faces that allow the dies to be assembled against other like dies to form one and/or two dimensional scanning arrays wherein the active side of a wafer is etched to form small V-shaped grooves defining the die faces, relatively wide grooves are cut in the inactive side of the wafer opposite each V-shaped groove, and the wafer cut by sawing along the V-shaped grooves, the saw being located so that the side of the saw blade facing the die is aligned with the bottom of the V-shaped groove so that there is retained intact one side of the V-shaped groove to intercept and prevent cracks and chipping caused by sawing from damaging the die active surface and any circuits thereon.
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公开(公告)号：US06927381B2
公开(公告)日：2005-08-09
申请号：US10656622
申请日：2003-09-05
申请人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Gaurav Sharma , Alain E. Perregaux , Robert P. Herloski
发明人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Gaurav Sharma , Alain E. Perregaux , Robert P. Herloski
CPC分类号： H01L27/14645 , H01L27/14621
摘要： A photosensitive imaging device for recording images across the entire visible spectrum includes a set of photosensors which have a peak response around the orange part of the spectrum, about 600 nm. The peak response is obtained by combining responses of, in one case, photosensors associated with a filter which admits red or infrared wavelengths and longer and photosensors associated with a filter which admits orange wavelengths and longer. In another case, the photosensor is structured to attenuate longer wavelengths, which, in combination with a filter which admits orange and longer wavelengths, can simulate a peak behavior around the orange part of the spectrum.
摘要翻译： 用于在整个可见光谱上记录图像的光敏成像装置包括一组光敏元件，其在约600nm处具有围绕光谱的橙色部分的峰值响应。 峰响应通过组合响应，在一种情况下，与允许红色或红外波长的滤波器相关联的光电传感器以及与允许橙色波长和更长的滤波器相关联的光电传感器的响应。 在另一种情况下，光电传感器被构造为衰减更长的波长，其与允许橙色和较长波长的滤波器组合可以模拟在光谱的橙色部分周围的峰值行为。
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公开(公告)号：US06646248B2
公开(公告)日：2003-11-11
申请号：US09841279
申请日：2001-04-24
申请人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Gaurav Sharma , Alain E. Perregaux , Robert P. Herloski
发明人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Gaurav Sharma , Alain E. Perregaux , Robert P. Herloski
IPC分类号： H01L2700
CPC分类号： H01L27/14645 , H01L27/14621
摘要： A photosensitive imaging device for recording images across the entire visible spectrum includes a set of photosensors which have a peak response around the orange part of the spectrum, about 600 nm. The peak response is obtained by combining responses of, in one case, photosensors associated with a filter which admits red or infrared wavelengths and longer and photosensors associated with a filter which admits orange wavelengths and longer. In another case, the photosensor is structured to attenuate longer wavelengths, which, in combination with a filter which admits orange and longer wavelengths, can simulate a peak behavior around the orange part of the spectrum.
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公开(公告)号：US06316284B1
公开(公告)日：2001-11-13
申请号：US09656879
申请日：2000-09-07
IPC分类号： H01L2100
CPC分类号： H01L27/14643 , H01L27/14685
摘要： The present invention generally relates to a digital scanner for scanning images. More specifically, the present invention is directed to a method and apparatus for enhancing the quality of scanned images obtained by filtering out the infrared component of digital data to provide enhanced digital images.
摘要翻译： 本发明一般涉及用于扫描图像的数字扫描仪。 更具体地，本发明涉及一种用于增强通过滤出数字数据的红外分量而获得的扫描图像的质量以提供增强的数字图像的方法和装置。
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5.发明授权Use of a U-groove as an alternative to using a V-groove for protection against dicing induced damage in silicon 失效使用U形槽作为使用V形槽的替代方案来防止在硅中切割引起的损坏公开(公告)号：US06955989B2
公开(公告)日：2005-10-18
申请号：US09996681
申请日：2001-11-30
申请人： Alain E. Perregaux , Paul A. Hosier , Josef E. Jedlicka , Nicholas J. Salatino , Jagdish C. Tandon
发明人： Alain E. Perregaux , Paul A. Hosier , Josef E. Jedlicka , Nicholas J. Salatino , Jagdish C. Tandon
IPC分类号： B28D5/02 , H01L21/301 , H01L21/3065 , H01L21/302
摘要： The present disclosure relates that by modifying chip die dicing methodology to a U-groove profile from a V-groove profile by modifying the second etch step to be a dry etch instead of a wet etch results in a direct cost savings by eliminating a more expensive process step, as well as the need for stripping the developed photoresist layer. Furthermore, going to a U-groove profile accomplishes additional indirect and greater cost savings resulting from increased process throughput, improved yield, and reduced metal layer defects.
摘要翻译： 本公开内容涉及通过将第二蚀刻步骤通过将第二蚀刻步骤修改为干蚀刻而不是湿蚀刻将芯片芯片切割方法修改为U形沟槽轮廓导致通过消除更昂贵的直接成本节省 工艺步骤，以及剥离显影的光致抗蚀剂层的需要。 此外，进入U形凹槽轮廓可实现额外的间接和更大的成本节省，这是由于加工量增加，产量提高和金属层缺陷减少。
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公开(公告)号：US06768565B1
公开(公告)日：2004-07-27
申请号：US09657342
申请日：2000-09-07
IPC分类号： H01L2700
CPC分类号： H04N1/031 , H01L27/14621 , H04N2201/02493
摘要： The present invention generally relates to a digital scanner for scanning images. More specifically, the present invention is directed to a method and apparatus for enhancing the quality of scanned images obtained by filtering out the infrared component of digital data to provide enhanced digital images.
摘要翻译： 本发明一般涉及用于扫描图像的数字扫描仪。 更具体地，本发明涉及一种用于增强通过滤出数字数据的红外分量而获得的扫描图像的质量以提供增强的数字图像的方法和装置。
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公开(公告)号：US5119181A
公开(公告)日：1992-06-02
申请号：US681809
申请日：1991-04-08
IPC分类号： H04N1/48
CPC分类号： H04N1/486
摘要： A color chip construction especially adapted for use in fabricating full width arrays in which the individual chip photosites consisting of a blue, green, and red photodiode shaped and positioned to provide a rectangular photosite with square sides that enhance butting of the color chip with other like color chips to form full width color arrays.
摘要翻译： 特别适用于制造全宽阵列的彩色芯片结构，其中由蓝色，绿色和红色光电二极管组成的单个芯片光电二极管形成并定位成提供具有方形侧面的矩形光泽，以增强与其他类似物的颜色芯片对接 彩色芯片组成全彩色阵列。
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公开(公告)号：US5031032A
公开(公告)日：1991-07-09
申请号：US501584
申请日：1990-03-30
CPC分类号： H04N1/486
摘要： A color chip construction especially adapted for use in fabricating full width arrays in which the individual chip photosites consisting of a blue, green, and red photodiode shaped and positioned to provide a rectangular photosite with square sides that enhance butting of the color chip with other like color chips to form full width color arrays.
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公开(公告)号：US5521125A
公开(公告)日：1996-05-28
申请号：US328789
申请日：1994-10-28
申请人： Brian T. Ormond , Josef E. Jedlicka
发明人： Brian T. Ormond , Josef E. Jedlicka
IPC分类号： H01L21/304 , H01L21/78
CPC分类号： H01L21/78 , H01L21/3043
摘要： A wafer design and dicing technique for creating semiconductor chips from wafers. A succession of oxide layers are deposited in first and second regions of a surface of a silicon substrate. The regions are separated by a street having no oxide layers therein, and the successive oxide layers form a vertical wall with a surface normal to the surface of the silicon substrate. A shock-absorbent material is deposited in the street, forming a concave meniscus therein. The shock-absorbent material retards the trajectories of silicon particles set into motion when the wafer is diced into chips.
摘要翻译： 用于从晶圆制造半导体芯片的晶片设计和切割技术。 一系列氧化物层沉积在硅衬底表面的第一和第二区域中。 这些区域由其中没有氧化物层的街道分开，并且连续的氧化物层形成具有与硅衬底的表面垂直的表面的垂直壁。 冲击吸收材料沉积在街上，在其中形成凹面弯月面。 当晶片切成芯片时，吸震材料阻止硅颗粒轨迹运动。
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10.发明授权In-line image sensor in combination with linear variable filter based spectrophotometer 有权联机图像传感器与线性可变滤波器分光光度计相结合公开(公告)号：US08368002B2
公开(公告)日：2013-02-05
申请号：US12580028
申请日：2009-10-15
CPC分类号： G01J3/2803 , G01J3/12 , G01J3/26 , G01J3/51 , G01J3/513 , G01J2003/1234
摘要： A photosensitive apparatus including a full width array of photosensors and a first photosensor chip. The first photosensor chip including a linear array of photosensors having a plurality of pixels arranged in a long direction and a linear variable filter adapted to transmit at least ten unique bandwidths of wavelengths of light along a length of the linear variable filter where the linear variable filter is fixedly secured to the linear array. Each respective pixel receives a unique bandwidth of wavelengths of light as a light passes through the linear variable filter and the length is aligned with the long direction. The full width array of photosensors is arranged perpendicular to a process direction of a printing device.
摘要翻译： 一种感光装置，包括全光束传感器阵列和第一光电传感器芯片。 第一光传感器芯片包括具有沿长方向布置的多个像素的光电传感器的线性阵列和适于沿着线性可变滤波器的长度传输至少十个唯一的波长波长的线性可变滤波器，其中线性可变滤波器 固定地固定在线性阵列上。 当光线通过线性可变滤波器并且长度与长方向对准时，每个像素接收光的波长的唯一带宽。 光传感器的全宽阵列垂直于打印装置的处理方向布置。
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