Method for processing a thin film substrate
    1.
    发明授权
    Method for processing a thin film substrate 有权
    薄膜基板的加工方法

    公开(公告)号:US07176578B2

    公开(公告)日:2007-02-13

    申请号:US11258763

    申请日:2005-10-26

    Abstract: The present invention comprises a processed thin film substrate (10) and a method therefore, in order to produce a flexible printed circuit card, having a plurality of microvias going or passing through the thin film substrate and electrically connected along faced-away surfaces, in order to form an electric circuit. A first a number of real nano-tracks are filled with a first material (M1), having good electric properties, for the formation of a first number of, here denominated, first vias (V10, V30, V 50), that a second number of real nano-tracks are filled with a second material (M2), having good electric properties, for the formation of a second number of, here denominated, second vias (V20, V40, V60). The first material (M1) and the second material (M2) of said first and second vias (V10–V60) are chosen having mutually different thermoelectric properties. A material surface-applied to the thin film substrate, coated on both sides (10a, 10b) of the thin film substrate (10), is distributed and/or adapted in order to allow the electrical interconnection of first vias, allocated the first material (M1), with second vias, allocated the second material (M2), and that a first via (V10) included in a series connection and a last via (V60) included in the series connection are serially co-ordinated in order to form an electric thermocouple (100) or other circuit arrangement.

    Abstract translation: 本发明包括一种处理过的薄膜基片(10)及其方法,以便制造出一种柔性印刷电路卡,其具有多个微孔进入或通过薄膜基片并沿着相对表面电连接, 以形成电路。 第一个真正的纳米轨道填充有具有良好电性能的第一材料(M1),用于形成第一数量的这里计量的第一通孔(V 10,V 30,V 50), 第二数量的真实纳米轨道填充有具有良好电性能的第二材料(M 2),用于形成第二数量的这里计数的第二通孔(V 20,V 40,V 60)。 选择所述第一和第二通孔(V 10 -V 60)的第一材料(M 1)和第二材料(M 2)具有相互不同的热电性质。 涂布在薄膜基板(10a,10b)的两侧(10a,10b)上的表面施加到薄膜基板上的材料被分布和/或适配,以便允许第一通孔的电互连, 具有第二通孔的第一材料(M 1)分配第二材料(M 2),并且串联连接中包括的第一通孔(V 10)和串联连接中包括的最后通孔(V 60)是串联的 为了形成电热电偶(100)或其他电路布置。

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