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公开(公告)号：US20120235544A1
公开(公告)日：2012-09-20
申请号：US13263054
申请日：2010-12-03
IPC分类号： H01L41/047
CPC分类号： H01L41/047 , H01L41/0475 , H01L41/0477 , H03H9/0509 , H03H9/1021 , H03H9/215
摘要： A lead type piezoelectric resonator device includes a piezoelectric resonator plate and a lead terminal that supports the piezoelectric resonator plate. The piezoelectric resonator plate is provided with a terminal electrode that is electrically connected to the lead terminal, and the lead terminal is provided with a bonding layer that is electrically connected to the piezoelectric resonator plate. The piezoelectric resonator plate and the lead terminal are electromechanically bonded to each other by the terminal electrode and the bonding layer. A bonding material containing an Sn—Cu alloy is produced from the terminal electrode and the bonding layer by the bonding of the terminal electrode and the bonding layer.
摘要翻译： 引线型压电谐振器装置包括压电谐振器板和支撑压电谐振器板的引线端子。 压电谐振器板设置有与引线端子电连接的端子电极，并且引线端子设置有电连接到压电谐振器板的接合层。 压电谐振器板和引线端子通过端子电极和接合层彼此机电结合。 通过端子电极和接合层的接合，由端子电极和接合层制造含有Sn-Cu合金的接合材料。
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2.发明申请ELECTRONIC COMPONENT PACKAGE, BASE OF ELECTRONIC COMPONENT PACKAGE, AND JUNCTION STRUCTURE OF ELECTRONIC COMPONENT PACKAGE AND CIRCUIT SUBSTRATE 有权电子元件封装，电子元器件封装基座和电子元件封装和电路基板的结构结构公开(公告)号：US20110114353A1
公开(公告)日：2011-05-19
申请号：US12674505
申请日：2008-08-21
CPC分类号： H01L23/49838 , H01L23/053 , H01L23/49822 , H01L23/50 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/16195 , H03H9/1021 , H05K1/0243 , H05K3/3442 , H05K2201/09181 , H05K2201/10068 , H05K2201/10075 , H05K2201/10727 , Y02P70/613 , H01L2924/00
摘要： An electronic component package has a base in the shape of a rectangle as viewed from the top, and a metal lid. A terminal electrode on a base bottom surface and a circuit substrate are joined using a conductive adhesive material. In the electronic component package, a first terminal electrode group including two or more terminal electrodes formed in parallel is formed eccentrically to one corner position of the base bottom surface, and a single second terminal electrode, or a second terminal electrode group including two or more terminal electrodes formed in parallel, is formed eccentrically only to a first diagonal position diagonally opposite the one corner position. Also, no-electrode regions in which no terminal electrode is formed along a short side of the base are provided at another corner position facing the one corner position in a short side direction of the base, and a second diagonal position diagonally opposite the other corner position. At least one of the terminal electrodes is a ground terminal electrode connected to the metal lid.
摘要翻译： 电子部件封装具有从顶部观察为矩形形状的基部和金属盖。 使用导电性粘合剂材料将基底面上的端子电极和电路基板接合。 在电子部件封装中，包括形成为平行的两个以上的端子电极的第一端子电极组偏心地形成在底部底面的一个拐角位置，单个第二端子电极或包括两个以上的第二端子电极组 形成为平行的端子电极偏心地形成为与一个角位置对角地相对的第一对角线位置。 此外，在基部的短边方向上的与一个角位置相对的另一个角位置设置有沿着基部的短边没有形成端子电极的无电极区域，并且与另一个角部对角地相对的第二对角线位置 位置。 至少一个端子电极是连接到金属盖的接地端子电极。
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公开(公告)号：US08987975B2
公开(公告)日：2015-03-24
申请号：US13263054
申请日：2010-12-03
IPC分类号： H01L41/047 , H03H9/05 , H03H9/10 , H03H9/215
CPC分类号： H01L41/047 , H01L41/0475 , H01L41/0477 , H03H9/0509 , H03H9/1021 , H03H9/215
摘要： A lead type piezoelectric resonator device includes a piezoelectric resonator plate and a lead terminal that supports the piezoelectric resonator plate. The piezoelectric resonator plate is provided with a terminal electrode that is electrically connected to the lead terminal, and the lead terminal is provided with a bonding layer that is electrically connected to the piezoelectric resonator plate. The piezoelectric resonator plate and the lead terminal are electromechanically bonded to each other by the terminal electrode and the bonding layer. A bonding material containing an Sn—Cu alloy is produced from the terminal electrode and the bonding layer by the bonding of the terminal electrode and the bonding layer.
摘要翻译： 引线型压电谐振器装置包括压电谐振器板和支撑压电谐振器板的引线端子。 压电谐振器板设置有与引线端子电连接的端子电极，并且引线端子设置有电连接到压电谐振器板的接合层。 压电谐振器板和引线端子通过端子电极和接合层彼此机电结合。 通过端子电极和接合层的接合，由端子电极和接合层制造含有Sn-Cu合金的接合材料。
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4.发明授权公开(公告)号：US08279610B2
公开(公告)日：2012-10-02
申请号：US12674505
申请日：2008-08-21
CPC分类号： H01L23/49838 , H01L23/053 , H01L23/49822 , H01L23/50 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/16195 , H03H9/1021 , H05K1/0243 , H05K3/3442 , H05K2201/09181 , H05K2201/10068 , H05K2201/10075 , H05K2201/10727 , Y02P70/613 , H01L2924/00
摘要： An electronic component package has a base in the shape of a rectangle as viewed from the top, and a metal lid. A terminal electrode on a base bottom surface and a circuit substrate are joined using a conductive adhesive material. In the electronic component package, a first terminal electrode group including two or more terminal electrodes formed in parallel is formed eccentrically to one corner position of the base bottom surface, and a single second terminal electrode, or a second terminal electrode group including two or more terminal electrodes formed in parallel, is formed eccentrically only to a first diagonal position diagonally opposite the one corner position. Also, no-electrode regions in which no terminal electrode is formed along a short side of the base are provided at another corner position facing the one corner position in a short side direction of the base, and a second diagonal position diagonally opposite the other corner position. At least one of the terminal electrodes is a ground terminal electrode connected to the metal lid.
摘要翻译： 电子部件封装具有从顶部观察为矩形形状的基部和金属盖。 使用导电性粘合剂材料将基底面上的端子电极和电路基板接合。 在电子部件封装中，包括形成为平行的两个以上的端子电极的第一端子电极组偏心地形成在底部底面的一个拐角位置，单个第二端子电极或包括两个以上的第二端子电极组 形成为平行的端子电极偏心地形成为与一个角位置对角地相对的第一对角线位置。 此外，在基座的短边方向上的与一个角位置相对的另一个角位置处设置有沿着基座的短边没有形成端子电极的无电极区域，并且与另一个角部对角地相对的第二对角线位置 位置。 至少一个端子电极是连接到金属盖的接地端子电极。
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公开(公告)号：US20120280597A1
公开(公告)日：2012-11-08
申请号：US13379709
申请日：2011-01-28
IPC分类号： H01L41/053 , H01L41/22
CPC分类号： H01L23/10 , H01L2924/0002 , H01L2924/16315 , H03H9/1021 , H03H9/1035 , H01L2924/00
摘要： A piezoelectric resonator device in which excitation electrodes of a piezoelectric resonator plate are hermetically sealed, includes a plurality of sealing members that hermetically seal the excitation electrodes of the piezoelectric resonator plate. The plurality of sealing members each have a bonding layer, and at least one of the plurality of sealing members is provided with a bank portion and having the bonding layer formed on a top face of the bank portion. The plurality of sealing members are bonded together with the bonding layers of the sealing members, and a bonding material that contains an intermetallic compound is formed.
摘要翻译： 压电谐振器的激励电极密封的压电谐振器装置包括密封压电谐振器板的激励电极的多个密封构件。 多个密封构件各自具有接合层，并且多个密封构件中的至少一个密封构件设置有堤部，并且在堤部的顶面上形成有接合层。 多个密封构件与密封构件的接合层结合在一起，并且形成包含金属间化合物的接合材料。
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公开(公告)号：US08723400B2
公开(公告)日：2014-05-13
申请号：US13379709
申请日：2011-01-28
IPC分类号： H01L41/053
CPC分类号： H01L23/10 , H01L2924/0002 , H01L2924/16315 , H03H9/1021 , H03H9/1035 , H01L2924/00
摘要： A piezoelectric resonator device in which excitation electrodes of a piezoelectric resonator plate are hermetically sealed, includes a plurality of sealing members that hermetically seal the excitation electrodes of the piezoelectric resonator plate. The plurality of sealing members each have a bonding layer, and at least one of the plurality of sealing members is provided with a bank portion and having the bonding layer formed on a top face of the bank portion. The plurality of sealing members are bonded together with the bonding layers of the sealing members, and a bonding material that contains an intermetallic compound is formed.
摘要翻译： 压电谐振器的激励电极密封的压电谐振器装置包括密封压电谐振器板的激励电极的多个密封构件。 多个密封构件各自具有接合层，并且多个密封构件中的至少一个密封构件设置有堤部，并且在堤部的顶面上形成有接合层。 多个密封构件与密封构件的接合层结合在一起，并且形成包含金属间化合物的接合材料。
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