公开(公告)号：US4524045A

公开(公告)日：1985-06-18

申请号：US525804

申请日：1983-08-24

申请人： Yoshiaki Hayashi ,  Kouichi Haraguchi ,  Yukio Koshidaka

发明人： Yoshiaki Hayashi ,  Kouichi Haraguchi ,  Yukio Koshidaka

IPC分类号： B29C49/12 ,  B29C49/64 ,  B29C17/07

CPC分类号： B29C49/64 ,  B29C2049/6692 ,  B29C49/12 ,  B29K2067/00 ,  Y10S264/903

摘要： This invention relates to a method of fabricating a bottle-shaped container of saturated polyester having superior mechanical strength, very low degrees of age and high temperature deformation, and superior dimensional stability. The piece for forming the bottle-shaped container is heated to an orientation temperature, is biaxially oriented in a blowing mold and is then thermally set by maintaining the outer wall surface of the expanded container in contact with the inner wall surface of the mold, which is kept at a temperature in the range between the glass transition point and the crystallization temperature, for longer than 5 seconds. The blowing mold is formed with the size adjusted in capacity by approx. 6% to allow for shrinkage of the product container when the container is exposed to a high temperature greater than 70.degree. C. and then left to stand, so as to thereby obtain a container of accurate capacity.

摘要翻译： 本发明涉及一种制造饱和聚酯的瓶状容器的方法，其具有优异的机械强度，非常低的年龄和高温变形，并且具有优异的尺寸稳定性。 将形成瓶状容器的部件加热到取向温度，在吹塑模具中双轴取向，然后通过将膨胀容器的外壁表面保持与模具的内壁表面接触来热定形，其中 保持在玻璃化转变点和结晶温度之间的范围内的温度超过5秒钟。 吹塑模具的尺寸被调整为大约 当容器暴露于大于70℃的高温，然后静置时，6％的容积使容器收缩，从而获得准确容量的容器。

公开(公告)号：US5606200A

公开(公告)日：1997-02-25

申请号：US180481

申请日：1994-01-12

申请人： Kouichi Haraguchi ,  Yuji Ichimura

发明人： Kouichi Haraguchi ,  Yuji Ichimura

IPC分类号： H01L23/28 ,  H01L23/04 ,  H01L23/06 ,  H01L23/24 ,  H01L23/22 ,  H01L23/053 ,  H01L23/48

CPC分类号： H01L23/06 ,  H01L23/04 ,  H01L23/24 ,  H01L2924/0002

摘要： A resin sealed semiconductor device includes a metallic base plate and a covering case adhered to a peripheral section of the metallic base plate. Semiconductor elements are loaded on the metallic base plate, and lead-out terminals extend from an upper surface of a terminal-supporting plate made to adhere to lead-out terminals. The terminal-supporting plate forms an upper surface of the covering case 5 which is filled with a sealing resin. Uneven stripes are molded and extend circumferentially over the entire outer peripheral surface of terminal-supporting plate to roughen the peripheral surface, and the adhesion strength is reinforced by increasing the adhesive area between the terminal-supporting plate and the sealing resin.

摘要翻译： 树脂密封半导体器件包括金属基板和粘附到金属基板的周边部分的覆盖壳体。 半导体元件装载在金属基板上，引出端子从制造的端子支撑板的上表面延伸到引出端子。 端子支撑板形成填充有密封树脂的覆盖壳体5的上表面。 不均匀的条纹被模制并且在端子支撑板的整个外周表面周向延伸以使外周表面粗糙化，并且通过增加端子支撑板和密封树脂之间的粘合剂面积来增强粘附强度。