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公开(公告)号：US20110290892A1
公开(公告)日：2011-12-01
申请号：US13129268
申请日：2009-11-13
IPC分类号： G06K19/077 , G06K19/02
CPC分类号： G06K19/07749 , B42D25/29 , B42D25/328 , B42D2033/46 , B42D2035/20 , G06K19/0775 , G06K19/07773 , G06K19/07786 , G06K19/145 , G06K19/16 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H01L2924/07811 , H01Q1/2225 , H01Q1/38 , H01L2924/00 , H01L2224/0401
摘要： A contactless integrated circuit (IC) label has an IC chip and is capable of exchanging data with an external reading device without contact. The contactless IC label includes: a transparent label base material; an optical variable device formed on a lower surface of the label base material; a conductive layer bonded to and formed on a lower surface of the optical variable device, and configured to function as an antenna of the IC chip; a connecting layer electrically connected to the IC chip; an insulating layer formed between the conductive layer and the connecting layer, and configured to electrically couple the conductive layer and the connecting layer; and an impedance adjusting unit formed on at least the connecting layer of the conductive layer and the connecting layer, and configured to adjust impedances of the conductive layer and the IC chip.
摘要翻译： 非接触集成电路（IC）标签具有IC芯片，并且能够与外部读取装置交换数据而不接触。 非接触式IC标签包括：透明标签基材; 形成在标签基材的下表面上的光学可变装置; 导电层，其结合并形成在所述光学可变器件的下表面上，并且被配置为用作所述IC芯片的天线; 电连接到IC芯片的连接层; 绝缘层，形成在所述导电层和所述连接层之间，并且被配置为电连接所述导电层和所述连接层; 以及阻抗调节单元，形成在所述导电层和所述连接层的至少所述连接层上，并且被配置为调整所述导电层和所述IC芯片的阻抗。
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公开(公告)号：US08395504B2
公开(公告)日：2013-03-12
申请号：US12227285
申请日：2007-05-16
申请人： Kozue Furuichi , Toru Endo , Manabu Suzuki , Hidehiko Kando
发明人： Kozue Furuichi , Toru Endo , Manabu Suzuki , Hidehiko Kando
IPC分类号： G08B13/14
CPC分类号： G06K19/07381 , G06K19/0776 , G06K19/07798
摘要： An IC label for prevention of forgery includes: a label substrate which has an adhesive agent for affixing the same to an object; a non-contact IC medium which is provided on the label substrate and has an IC chip for storing predetermined identification information and an antenna for wireless transmission of the identification information; and a security function portion which is provided on the label substrate and prevents replication.
摘要翻译： 用于防止伪造的IC标签包括：标签基板，其具有用于将其粘贴到物体上的粘合剂; 设置在标签基板上并具有用于存储预定识别信息的IC芯片和用于识别信息的无线传输的天线的非接触IC介质; 以及设置在标签基板上并防止复制的安全功能部分。
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公开(公告)号：US20090303044A1
公开(公告)日：2009-12-10
申请号：US12227285
申请日：2007-05-16
申请人： Kozue Furuichi , Toru Endo , Manabu Suzuki , Hidehiko Kando
发明人： Kozue Furuichi , Toru Endo , Manabu Suzuki , Hidehiko Kando
CPC分类号： G06K19/07381 , G06K19/0776 , G06K19/07798
摘要： An IC label for prevention of forgery includes: a label substrate which has an adhesive agent for affixing the same to an object; a non-contact IC medium which is provided on the label substrate and has an IC chip for storing predetermined identification information and an antenna for wireless transmission of the identification information; and a security function portion which is provided on the label substrate and prevents replication.
摘要翻译： 用于防止伪造的IC标签包括：标签基板，其具有用于将其粘贴到物体上的粘合剂; 设置在标签基板上并具有用于存储预定识别信息的IC芯片和用于识别信息的无线传输的天线的非接触IC介质; 以及设置在标签基板上并防止复制的安全功能部分。
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公开(公告)号：US08376236B2
公开(公告)日：2013-02-19
申请号：US13129268
申请日：2009-11-13
CPC分类号： G06K19/07749 , B42D25/29 , B42D25/328 , B42D2033/46 , B42D2035/20 , G06K19/0775 , G06K19/07773 , G06K19/07786 , G06K19/145 , G06K19/16 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H01L2924/07811 , H01Q1/2225 , H01Q1/38 , H01L2924/00 , H01L2224/0401
摘要： A contactless integrated circuit (IC) label has an IC chip and is capable of exchanging data with an external reading device without contact. The contactless IC label includes: a transparent label base material; an optical variable device formed on a lower surface of the label base material; a conductive layer bonded to and formed on a lower surface of the optical variable device, and configured to function as an antenna of the IC chip; a connecting layer electrically connected to the IC chip; an insulating layer formed between the conductive layer and the connecting layer, and configured to electrically couple the conductive layer and the connecting layer; and an impedance adjusting unit formed on at least the connecting layer of the conductive layer and the connecting layer, and configured to adjust impedances of the conductive layer and the IC chip.
摘要翻译： 非接触集成电路（IC）标签具有IC芯片，并且能够与外部读取装置交换数据而不接触。 非接触式IC标签包括：透明标签基材; 形成在标签基材的下表面上的光学可变装置; 导电层，其结合并形成在所述光学可变器件的下表面上，并且被配置为用作所述IC芯片的天线; 电连接到IC芯片的连接层; 绝缘层，形成在所述导电层和所述连接层之间，并且被配置为电连接所述导电层和所述连接层; 以及阻抗调节单元，形成在所述导电层和所述连接层的至少所述连接层上，并且被配置为调整所述导电层和所述IC芯片的阻抗。
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