Method for manufacturing BICMOS devices
    1.
    发明授权
    Method for manufacturing BICMOS devices 失效
    制造BICMOS器件的方法

    公开(公告)号:US5196356A

    公开(公告)日:1993-03-23

    申请号:US874612

    申请日:1992-04-27

    IPC分类号: H01L27/06 H01L21/8249

    CPC分类号: H01L21/8249 Y10S148/009

    摘要: A method for BICMOS devices is disclosed, wherein an emitter and a base of a vertical PNP transistor are self-aligned, an extrinsic base is formed by adapting a base electrode polysilicon layer as a diffusion source, and the base electrode and an intrinsic base are coupled by diffusion of N type impurities adapting the N.sup.+ polysilicon as a diffusion source, so that the manufacturing process is simplified and the resistance of the extrinsic base is reduced.

    摘要翻译: 公开了一种用于BICMOS器件的方法,其中垂直PNP晶体管的发射极和基极是自对准的,通过使基极多晶硅层适应扩散源形成非本征基极,并且基极和本征基极 通过使N型多晶硅适应扩散源的N型杂质的扩散耦合,使得制造工艺简化,并且外部基极的电阻降低。