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1.发明申请METHOD AND A DEVICE FOR ASSEMBLING A CHIP ON A SUBSTRATE BY PROVIDING A SOLDER-FORMING MASS 有权用于通过提供焊料形成质量来组装衬底上的芯片的方法和装置公开(公告)号：US20100139089A1
公开(公告)日：2010-06-10
申请号：US12576542
申请日：2009-10-09
CPC分类号： H05K3/34 , B23K1/0056 , B23K3/0607 , B23K2101/36 , H01L24/75 , H01L2924/12042 , H05K3/341 , H05K3/3494 , H05K2201/10969 , H05K2203/0195 , H05K2203/0415 , H05K2203/107 , H05K2203/163 , Y02P70/613 , Y10T29/49144 , Y10T29/53174 , Y10T29/53178 , H01L2924/00
摘要： In this method, a vertical stack is formed on an axis coinciding substantially with the gravity direction and comprising, from top to bottom: the element; the mass in a solid state; and the substrate. The mass is then heated so as to cause it to pass into a liquid state enabling it to spread on the substrate. More particularly, after the stack has been formed, the element is left free to move vertically, and during heating, variation in the vertical position of the element is measured.
摘要翻译： 在该方法中，垂直堆叠形成在与重力方向基本重合的轴上，并且包括从顶部到底部的元件; 质量处于固体状态; 和基板。 然后将该质量加热以使其进入液态，使其能够在基底上扩散。 更具体地说，在堆叠已经形成之后，元件可以自由地垂直移动，并且在加热期间，测量元件的垂直位置的变化。
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公开(公告)号：US09167703B2
公开(公告)日：2015-10-20
申请号：US12576542
申请日：2009-10-09
CPC分类号： H05K3/34 , B23K1/0056 , B23K3/0607 , B23K2101/36 , H01L24/75 , H01L2924/12042 , H05K3/341 , H05K3/3494 , H05K2201/10969 , H05K2203/0195 , H05K2203/0415 , H05K2203/107 , H05K2203/163 , Y02P70/613 , Y10T29/49144 , Y10T29/53174 , Y10T29/53178 , H01L2924/00
摘要： In this method, a vertical stack is formed on an axis coinciding substantially with the gravity direction and comprising, from top to bottom: the element; the mass in a solid state; and the substrate. The mass is then heated so as to cause it to pass into a liquid state enabling it to spread on the substrate. More particularly, after the stack has been formed, the element is left free to move vertically, and during heating, variation in the vertical position of the element is measured.
摘要翻译： 在该方法中，垂直堆叠形成在与重力方向基本重合的轴上，并且包括从顶部到底部的元件; 质量处于固体状态; 和基板。 然后将该质量加热以使其进入液态，使其能够在基底上扩散。 更具体地说，在堆叠已经形成之后，元件可以自由地垂直移动，并且在加热期间，测量元件的垂直位置的变化。
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