公开(公告)号：US06759597B1

公开(公告)日：2004-07-06

申请号：US09017338

申请日：1998-02-02

申请人： Lawrence Richard Cutting ,  John Gerard Gaudiello ,  Luis Jesus Matienzo ,  Nikhil Mohan Murdeshwar

发明人： Lawrence Richard Cutting ,  John Gerard Gaudiello ,  Luis Jesus Matienzo ,  Nikhil Mohan Murdeshwar

IPC分类号： H05K116

CPC分类号： H01L24/85 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/4847 ,  H01L2224/48644 ,  H01L2224/48744 ,  H01L2224/48844 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/1579 ,  H01L2924/15798 ,  H01L2924/20105 ,  H01L2924/20752 ,  H01L2924/20753 ,  H05K3/244 ,  H05K3/328 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  H01L2924/00014 ,  H01L2924/00

摘要： Wire bonds are made to palladium coated bonded pads on organic dielectric substrates at temperatures below 200° C. A layer of palladium thicker than 14 micro-inches is covered with a thin flash of gold. Palladium coated over copper pads is protected from copper diffusion by a thin nickel layer positioned between the two. Subsequent baking for 1 hour at 185° C. drives off hydrogen molecules provided the gold is less than 200 Å thick. A bonding wire, preferably of gold is then successfully bonded to the pad using conventional bonding equipment at temperatures below 200° C.

摘要翻译： 在低于200℃的温度下，将引线键合到有机电介质基底上的钯涂覆的键合焊盘。厚度大于14微英寸的钯层被薄闪闪的金覆盖。 通过位于两者之间的薄镍层来保护涂覆在铜焊盘上的钯不被铜扩散。 随后在185℃下烘烤1小时，如果金小于200埃，则驱除氢分子。 然后使用常规粘合设备在200℃以下的温度下将优选为金的接合线成功地粘合到垫上。

公开(公告)号：US06519845B1

公开(公告)日：2003-02-18

申请号：US09481478

申请日：2000-01-11

申请人： Lawrence Richard Cutting ,  John Gerard Gaudiello ,  Luis Jesus Matienzo ,  Nikhil Mohan Murdeshwar

发明人： Lawrence Richard Cutting ,  John Gerard Gaudiello ,  Luis Jesus Matienzo ,  Nikhil Mohan Murdeshwar

IPC分类号： H01R900

CPC分类号： H01L24/85 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/4847 ,  H01L2224/48644 ,  H01L2224/48744 ,  H01L2224/48844 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/1579 ,  H01L2924/15798 ,  H01L2924/20105 ,  H01L2924/20752 ,  H01L2924/20753 ,  H05K3/244 ,  H05K3/328 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  H01L2924/00014 ,  H01L2924/00

摘要： Wire bonds are made to palladium coated bonded lads on organic dielectric substrates at temperatures below 200° C. A layer of palladium thicker than 14 micro-inches is covered with a thin flash of gold. Palladium coated over copper pads is protected from copper diffusion by a thin nickel layer positioned between the two. Subsequent baking for 1 hour at 185° C. drives off hydrogen molecules provided the gold is less than 200 Å thick. A bonding wire, preferably of gold is then successfully bonded to the pad using conventional bonding equipment at temperatures below 200° C.

摘要翻译： 在低于200℃的温度下，在有机电介质基底上将钯键合到钯涂层的粘合层上。厚度超过14微英寸的钯层被薄闪闪的金覆盖。 通过位于两者之间的薄镍层来保护涂覆在铜焊盘上的钯不被铜扩散。 随后在185℃下烘烤1小时，如果金小于200埃，则驱除氢分子。 然后使用常规粘合设备在200℃以下的温度下将优选为金的接合线成功地粘合到垫上。

公开(公告)号：US5777705A

公开(公告)日：1998-07-07

申请号：US865713

申请日：1997-05-30

申请人： Mark Vincent Pierson ,  Steven F. Arndt ,  Michael Anthony Gaynes ,  Lawrence Richard Cutting ,  David Brian Stone

发明人： Mark Vincent Pierson ,  Steven F. Arndt ,  Michael Anthony Gaynes ,  Lawrence Richard Cutting ,  David Brian Stone

IPC分类号： G02F1/1333 ,  G02F1/1345

CPC分类号： G02F1/13336 ,  G02F1/1345 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48472 ,  H01L2924/01322

摘要： A plurality of liquid crystal display tiles arranged in a matrix are electrically interconnected to a tile carrier by wire bonds.

摘要翻译： 以矩阵形式布置的多个液晶显示瓦片通过引线接合与瓷砖载体电互连。