公开(公告)号：USD611436S1

公开(公告)日：2010-03-09

申请号：US29341973

申请日：2009-08-16

Applicant: Li-Jen Ho

Designer： Li-Jen Ho

公开(公告)号：US20100184241A1

公开(公告)日：2010-07-22

申请号：US12355117

申请日：2009-01-16

Applicant: SHIH-TAI CHUANG ,  LI-JEN HO

Inventor： SHIH-TAI CHUANG ,  LI-JEN HO

IPC: H01L33/00

CPC classification number: H01L33/52 ,  H01L2224/48095 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A method is applied to manufacture a thin type light emitting diode (LED) assembly, and comprises the steps of: pressing a light-transmissible conductive film onto a carrier; etching an etched circuit on the light-transmissible conductive film to form an etched light-transmissible conductive film; bonding a LED chip on the etched light-transmissible conductive film to make the LED chip electrically connected with the etched circuit; covering the LED chip and the etched light-transmissible conductive film with a light-transmissible encapsulation layer to encapsulate the LED chip therein; and cutting the carrier to make the carrier be removed from the etched light-transmissible conductive film, so as to manufacture the thin type LED assembly.

Abstract translation: 一种制造薄型发光二极管（LED）组件的方法，包括以下步骤：将透光导电膜压在载体上; 在透光导电膜上蚀刻蚀刻电路，形成蚀刻的透光导电膜; 将LED芯片接合在蚀刻的透光导电膜上，使LED芯片与蚀刻电路电连接; 用透光封装层覆盖LED芯片和蚀刻的透光导电膜，以将LED芯片封装在其中; 并切割载体以使载体从蚀刻的透光导电膜上移除，以制造薄型LED组件。

公开(公告)号：US20100105156A1

公开(公告)日：2010-04-29

申请号：US12258576

申请日：2008-10-27

Applicant: Po-Shen CHEN ,  Li-Jen Ho ,  Shih-Tai Chuang ,  Hong-Syun Chou

Inventor： Po-Shen CHEN ,  Li-Jen Ho ,  Shih-Tai Chuang ,  Hong-Syun Chou

IPC: H01L33/00

CPC classification number: H01L33/508 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014

Abstract: A method of manufacturing a light-emitting diode package, including following steps: providing a mounting base; providing a light-emitting chip on the mounting base, and the light-emitting chip including at least one electrode on the top surface thereof; forming a fluorescent layer on the top surface of the light-emitting chip, and the fluorescent layer covering the electrode; providing a laser generator to emit a focused laser beam to remove a portion of the fluorescent layer covered on the light-emitting chip to form a through-hole; providing a conductive wire to electrically connect the electrode of the light-emitting chip via the through-hole to the mounting base. The conductive wire can then be electrically connecting the electrode to the mounting base via the through-hole. Therefore, the thickness of fluorescent layer around the metal wire would be evenly formed, resulting better uniformity of white light mixing of the light-emitting diode package.

Abstract translation: 一种制造发光二极管封装的方法，包括以下步骤：提供安装基座; 在所述安装基座上设置发光芯片，所述发光芯片在其顶面包括至少一个电极; 在发光芯片的顶面形成荧光层，覆盖电极的荧光层; 提供激光发生器来发射聚焦激光束以去除覆盖在发光芯片上的荧光层的一部分以形成通孔; 提供导电线，以将发光芯片的电极经由通孔电连接到安装基座。 导线然后可以通过通孔将电极电连接到安装基座。 因此，金属线周围的荧光层的厚度将被均匀地形成，从而使发光二极管封装的白光混合更均匀。