公开(公告)号：USD637564S1

公开(公告)日：2011-05-10

申请号：US29377201

申请日：2010-10-19

Applicant: Chung-Ting Tseng ,  Ming-Sung Tsai ,  Shih-Tai Chuang

Designer： Chung-Ting Tseng ,  Ming-Sung Tsai ,  Shih-Tai Chuang

公开(公告)号：USD634718S1

公开(公告)日：2011-03-22

申请号：US29364906

申请日：2010-06-30

Applicant: Shih-Tai Chuang ,  Hsiao-Lun Lin

Designer： Shih-Tai Chuang ,  Hsiao-Lun Lin

公开(公告)号：US20100184241A1

公开(公告)日：2010-07-22

申请号：US12355117

申请日：2009-01-16

Applicant: SHIH-TAI CHUANG ,  LI-JEN HO

Inventor： SHIH-TAI CHUANG ,  LI-JEN HO

IPC: H01L33/00

CPC classification number: H01L33/52 ,  H01L2224/48095 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A method is applied to manufacture a thin type light emitting diode (LED) assembly, and comprises the steps of: pressing a light-transmissible conductive film onto a carrier; etching an etched circuit on the light-transmissible conductive film to form an etched light-transmissible conductive film; bonding a LED chip on the etched light-transmissible conductive film to make the LED chip electrically connected with the etched circuit; covering the LED chip and the etched light-transmissible conductive film with a light-transmissible encapsulation layer to encapsulate the LED chip therein; and cutting the carrier to make the carrier be removed from the etched light-transmissible conductive film, so as to manufacture the thin type LED assembly.

Abstract translation: 一种制造薄型发光二极管（LED）组件的方法，包括以下步骤：将透光导电膜压在载体上; 在透光导电膜上蚀刻蚀刻电路，形成蚀刻的透光导电膜; 将LED芯片接合在蚀刻的透光导电膜上，使LED芯片与蚀刻电路电连接; 用透光封装层覆盖LED芯片和蚀刻的透光导电膜，以将LED芯片封装在其中; 并切割载体以使载体从蚀刻的透光导电膜上移除，以制造薄型LED组件。

公开(公告)号：US20120081033A1

公开(公告)日：2012-04-05

申请号：US12895910

申请日：2010-10-01

Applicant: Tsung-Ting SUN ,  Shih-Tai Chuang

Inventor： Tsung-Ting SUN ,  Shih-Tai Chuang

IPC: H05B37/02

CPC classification number: H05B33/0857 ,  H01L27/156 ,  H01L33/08 ,  H01L33/504 ,  H01L33/505

Abstract: A white light emitting diode comprises a light emitting diode chip for emitting a blue light, a first wavelength conversion layer and a second wavelength conversion layer. The light emitting diode chip comprises a first lighting area and a second lighting area through which at least two currents flow, respectively. The first wavelength conversion layer is coated on the first lighting area and generates a first conversion light upon excitation by the blue light. A warm white light is generated by mixing the blue light and the first conversion light. The second wavelength conversion layer is coated on the second lighting area and generates a second conversion light upon excitation by the blue light. A cold white light is generated by mixing the blue light and the second conversion light. The amount of the currents can be controlled to modify the luminescence intensity of each light area, thus adjusting the color temperature of the white LED.

Abstract translation: 白色发光二极管包括用于发射蓝光的发光二极管芯片，第一波长转换层和第二波长转换层。 发光二极管芯片包括分别流过至少两个电流的第一照明区域和第二照明区域。 第一波长转换层被涂覆在第一照明区域上，并且在被蓝光激发时产生第一转换光。 通过混合蓝光和第一转换光产生温暖的白光。 第二波长转换层被涂覆在第二照明区域上，并且在通过蓝光激发时产生第二转换光。 通过混合蓝光和第二转换光产生冷白光。 可以控制电流量以改变每个光区的发光强度，从而调节白色LED的色温。

公开(公告)号：US20100105156A1

公开(公告)日：2010-04-29

申请号：US12258576

申请日：2008-10-27

Applicant: Po-Shen CHEN ,  Li-Jen Ho ,  Shih-Tai Chuang ,  Hong-Syun Chou

Inventor： Po-Shen CHEN ,  Li-Jen Ho ,  Shih-Tai Chuang ,  Hong-Syun Chou

IPC: H01L33/00

CPC classification number: H01L33/508 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014

Abstract: A method of manufacturing a light-emitting diode package, including following steps: providing a mounting base; providing a light-emitting chip on the mounting base, and the light-emitting chip including at least one electrode on the top surface thereof; forming a fluorescent layer on the top surface of the light-emitting chip, and the fluorescent layer covering the electrode; providing a laser generator to emit a focused laser beam to remove a portion of the fluorescent layer covered on the light-emitting chip to form a through-hole; providing a conductive wire to electrically connect the electrode of the light-emitting chip via the through-hole to the mounting base. The conductive wire can then be electrically connecting the electrode to the mounting base via the through-hole. Therefore, the thickness of fluorescent layer around the metal wire would be evenly formed, resulting better uniformity of white light mixing of the light-emitting diode package.

Abstract translation: 一种制造发光二极管封装的方法，包括以下步骤：提供安装基座; 在所述安装基座上设置发光芯片，所述发光芯片在其顶面包括至少一个电极; 在发光芯片的顶面形成荧光层，覆盖电极的荧光层; 提供激光发生器来发射聚焦激光束以去除覆盖在发光芯片上的荧光层的一部分以形成通孔; 提供导电线，以将发光芯片的电极经由通孔电连接到安装基座。 导线然后可以通过通孔将电极电连接到安装基座。 因此，金属线周围的荧光层的厚度将被均匀地形成，从而使发光二极管封装的白光混合更均匀。

公开(公告)号：USD605142S1

公开(公告)日：2009-12-01

申请号：US29335918

申请日：2009-04-24

Applicant: Shih-Tai Chuang

Designer： Shih-Tai Chuang

公开(公告)号：US07892869B2

公开(公告)日：2011-02-22

申请号：US12507987

申请日：2009-07-23

Applicant: Shih-Tai Chuang ,  Hsi-Ku Tu

Inventor： Shih-Tai Chuang ,  Hsi-Ku Tu

IPC: H01L21/00

CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2924/00014

Abstract: A method for manufacturing a light emitting diode (LED) assembly comprises the steps of: preparing a chip carrier comprising a carrier substrate, a P type electrode and an N type electrode, and arranging an LED chip onto the carrier substrate to electrically connect the LED chip with the P type electrode and the N type electrode; packaging the LED chip with a light-transmissible packaging gel and making the P type electrode and the N type electrode exposed to form a molded LED chip cell; preparing an arrangement carrier comprising a arrangement carrier substrate, a P type electrode plate and an N type electrode plate; forming an arrangement recess on the arrangement carrier substrate; and arranging the molded LED chip cell into the arrangement recess to make the P type electrode and the N type electrode electrically connect to the P type electrode plate and the N type electrode plate respectively.

Abstract translation: 一种制造发光二极管（LED）组件的方法，包括以下步骤：制备包括载体衬底，P型电极和N型电极的芯片载体，并将LED芯片布置在载体衬底上以电连接LED 芯片与P型电极和N型电极; 用透光封装凝胶封装LED芯片，使P型电极和N型电极暴露形成模制LED芯片; 制备包括布置载体衬底，P型电极板和N型电极板的布置载体; 在所述布置载体基板上形成布置凹槽; 并且将成型的LED芯片单元布置在配置凹槽中，以使P型电极和N型电极分别电连接到P型电极板和N型电极板。

公开(公告)号：US20110020961A1

公开(公告)日：2011-01-27

申请号：US12507987

申请日：2009-07-23

Applicant: SHIH-TAI CHUANG ,  HSI-KU TU

Inventor： SHIH-TAI CHUANG ,  HSI-KU TU

IPC: H01L21/66 ,  H01L33/00

CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2924/00014

Abstract: A method for manufacturing a light emitting diode (LED) assembly comprises the steps of: preparing a chip carrier comprising a carrier substrate, a P type electrode and an N type electrode, and arranging an LED chip onto the carrier substrate to electrically connect the LED chip with the P type electrode and the N type electrode; packaging the LED chip with a light-transmissible packaging gel and making the P type electrode and the N type electrode exposed to form a molded LED chip cell; preparing an arrangement carrier comprising a arrangement carrier substrate, a P type electrode plate and an N type electrode plate; forming an arrangement recess on the arrangement carrier substrate; and arranging the molded LED chip cell into the arrangement recess to make the P type electrode and the N type electrode electrically connect to the P type electrode plate and the N type electrode plate respectively.

Abstract translation: 一种制造发光二极管（LED）组件的方法，包括以下步骤：制备包括载体衬底，P型电极和N型电极的芯片载体，并将LED芯片布置在载体衬底上以电连接LED 芯片与P型电极和N型电极; 用透光封装凝胶封装LED芯片，使P型电极和N型电极暴露形成模制LED芯片; 制备包括布置载体衬底，P型电极板和N型电极板的布置载体; 在所述布置载体基板上形成布置凹槽; 并且将成型的LED芯片单元布置在配置凹槽中，以使P型电极和N型电极分别电连接到P型电极板和N型电极板。

公开(公告)号：USD631020S1

公开(公告)日：2011-01-18

申请号：US29360641

申请日：2010-04-29

Applicant: Shih-Tai Chuang ,  Hsiao-Lun Lin

Designer： Shih-Tai Chuang ,  Hsiao-Lun Lin