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公开(公告)号：US20240302029A1
公开(公告)日：2024-09-12
申请号：US18668304
申请日：2024-05-20
发明人： Daniel S. SPIRO
IPC分类号： F21V21/02 , F16L3/06 , F21S2/00 , F21S8/02 , F21S8/04 , F21V5/02 , F21V5/04 , F21V23/00 , F21V23/02 , F21V23/04 , F21V23/06 , F21V29/70 , F21V29/74 , F21V29/75 , F21V29/77 , F21V31/00 , F21W131/305 , F21Y105/10 , F21Y115/10 , H02G3/03 , H02G3/04
CPC分类号： F21V21/02 , F16L3/06 , F21S2/005 , F21S8/026 , F21S8/04 , F21V5/02 , F21V5/04 , F21V23/002 , F21V23/008 , F21V23/023 , F21V23/06 , F21V29/70 , F21V29/74 , F21V29/75 , F21V29/773 , F21V31/005 , H02G3/03 , H02G3/0437 , F21V23/0464 , F21V23/0471 , F21W2131/305 , F21Y2105/10 , F21Y2115/10 , Y10T29/49117
摘要： A light emitting apparatus includes a light source, a unitary formed heat sink with a plurality of heat dissipating fins, a lensed enclosure that retains a light source and at least one power consuming device other than the light source. The lensed enclosure includes a recessed opening having at least a first wall that terminates at a substantially perpendicular second wall. The plurality of heat dissipating fins are disposed on at least one adjacent exterior side of the walled enclosure, the fins extending outwardly. At least one fin coupled to the heat sink extends beyond the light source, and the heat generated by the light source travels by conduction laterally through the heat sink to the at least one coupled fin.
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公开(公告)号：US11744200B2
公开(公告)日：2023-09-05
申请号：US18111892
申请日：2023-02-21
发明人： Daniel S. Spiro
IPC分类号： F21V33/00 , F21V29/74 , F21V21/03 , F21V23/00 , F21V7/00 , F21V29/77 , F21S8/02 , F21V21/04 , F21V29/70 , F21V29/508 , F21S8/06 , A01H5/10 , F04D19/00 , F04D29/58 , H05B47/16 , H05B47/105 , H05B45/12 , H05B45/10 , H04N7/18 , F21K9/232 , F21V13/04 , F21V15/01 , F21V21/08 , F21V23/02 , F21V29/83 , F21Y115/10 , H05B47/19 , H05B47/115
CPC分类号： A01H5/10 , F04D19/002 , F04D29/582 , F21K9/232 , F21S8/026 , F21S8/06 , F21V7/00 , F21V7/0025 , F21V13/04 , F21V15/01 , F21V21/03 , F21V21/047 , F21V21/0832 , F21V23/002 , F21V23/007 , F21V23/02 , F21V29/508 , F21V29/70 , F21V29/74 , F21V29/77 , F21V29/777 , F21V29/83 , F21V33/0056 , F21V33/0076 , F21V33/0096 , H04N7/188 , H05B45/10 , H05B45/12 , H05B47/105 , H05B47/16 , F21V33/00 , F21Y2115/10 , H05B47/115 , H05B47/19
摘要： An integrated ceiling device includes integrated ceiling device including an electronic device housing, a heat dissipating structure, a light source, and a reflection/refraction assembly. An air gap is defined between the electronics housing and other components allowing ambient air to flow therethrough for cooling.
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公开(公告)号：US20230200324A1
公开(公告)日：2023-06-29
申请号：US18111892
申请日：2023-02-21
发明人： Daniel S. SPIRO
IPC分类号： A01H5/10 , F21V33/00 , F04D19/00 , F21V29/74 , F04D29/58 , H05B47/16 , H05B47/105 , F21V21/03 , H05B45/12 , H05B45/10 , F21V23/00 , F21V7/00 , F21V29/77 , F21S8/02 , F21V21/04 , F21V29/70 , H04N7/18 , F21K9/232 , F21V29/508 , F21S8/06 , F21V13/04 , F21V15/01 , F21V21/08 , F21V23/02 , F21V29/83
CPC分类号： A01H5/10 , F21V33/0096 , F04D19/002 , F21V29/74 , F04D29/582 , H05B47/16 , H05B47/105 , F21V21/03 , H05B45/12 , H05B45/10 , F21V23/007 , F21V7/0025 , F21V29/777 , F21S8/026 , F21V21/047 , F21V33/0056 , F21V33/0076 , F21V29/70 , H04N7/188 , F21K9/232 , F21V29/508 , F21S8/06 , F21V13/04 , F21V15/01 , F21V21/0832 , F21V23/002 , F21V23/02 , F21V29/77 , F21V29/83 , F21V7/00 , F21Y2115/10
摘要： An integrated ceiling device includes integrated ceiling device including an electronic device housing, a heat dissipating structure, a light source, and a reflection/refraction assembly. An air gap is defined between the electronics housing and other components allowing ambient air to flow therethrough for cooling.
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公开(公告)号：US20230015975A1
公开(公告)日：2023-01-19
申请号：US17954386
申请日：2022-09-28
发明人： Daniel S. SPIRO
IPC分类号： F21V21/02 , F21V29/70 , F21V29/74 , F21V29/75 , F21V29/77 , F21S2/00 , F21S8/02 , F21S8/04 , F21V5/02 , F21V5/04 , F21V23/00 , F21V23/02 , F21V31/00 , F16L3/06 , F21V23/06 , H02G3/03 , H02G3/04
摘要： A light emitting apparatus includes a light source, a unitary formed heat sink with a plurality of heat dissipating fins, a lensed enclosure that retains a light source and at least one power consuming device other than the light source. The lensed enclosure includes a recessed opening having at least a first wall that terminates at a substantially perpendicular second wall. The plurality of heat dissipating fins are disposed on at least one adjacent exterior side of the walled enclosure, the fins extending outwardly. At least one fin coupled to the heat sink extends beyond the light source, and the heat generated by the light source travels by conduction laterally through the heat sink to the at least one coupled fin.
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公开(公告)号：US20230392771A1
公开(公告)日：2023-12-07
申请号：US18235363
申请日：2023-08-18
发明人： Daniel S. SPIRO
IPC分类号： F21V21/02 , F21S8/02 , F21V29/77 , F21V5/02 , F21V29/75 , F21S8/04 , H02G3/03 , F21V5/04 , F21S2/00 , F21V29/70 , F21V23/02 , F16L3/06 , F21V23/00 , F21V31/00 , F21V23/06 , H02G3/04 , F21V29/74
CPC分类号： F21V21/02 , F21S8/026 , F21V29/773 , F21V5/02 , F21V29/75 , F21S8/04 , H02G3/03 , F21V5/04 , F21S2/005 , F21V29/70 , F21V23/023 , F16L3/06 , F21V23/008 , F21V31/005 , F21V23/06 , H02G3/0437 , F21V29/74 , F21V23/002 , F21V23/0471
摘要： A light emitting apparatus includes a light source, a unitary formed heat sink with a plurality of heat dissipating fins, a lensed enclosure that retains a light source and at least one power consuming device other than the light source. The lensed enclosure includes a recessed opening having at least a first wall that terminates at a substantially perpendicular second wall. The plurality of heat dissipating fins are disposed on at least one adjacent exterior side of the walled enclosure, the fins extending outwardly. At least one fin coupled to the heat sink extends beyond the light source, and the heat generated by the light source travels by conduction laterally through the heat sink to the at least one coupled fin.
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公开(公告)号：US11828442B1
公开(公告)日：2023-11-28
申请号：US18235363
申请日：2023-08-18
发明人： Daniel S. Spiro
IPC分类号： F21V29/75 , F21V21/02 , F21V5/04 , F21V23/06 , F21V23/02 , F21V29/77 , F21V23/00 , F21S2/00 , H02G3/03 , F16L3/06 , F21S8/04 , F21V29/74 , F21V29/70 , F21V31/00 , F21V5/02 , F21S8/02 , H02G3/04 , F21V23/04 , F21Y105/10 , F21W131/305 , F21Y115/10
CPC分类号： F21V21/02 , F16L3/06 , F21S2/005 , F21S8/026 , F21S8/04 , F21V5/02 , F21V5/04 , F21V23/002 , F21V23/008 , F21V23/023 , F21V23/06 , F21V29/70 , F21V29/74 , F21V29/75 , F21V29/773 , F21V31/005 , H02G3/03 , H02G3/0437 , F21V23/0464 , F21V23/0471 , F21W2131/305 , F21Y2105/10 , F21Y2115/10 , Y10T29/49117
摘要： A light emitting apparatus includes a light source, a unitary formed heat sink with a plurality of heat dissipating fins, a lensed enclosure that retains a light source and at least one power consuming device other than the light source. The lensed enclosure includes a recessed opening having at least a first wall that terminates at a substantially perpendicular second wall. The plurality of heat dissipating fins are disposed on at least one adjacent exterior side of the walled enclosure, the fins extending outwardly. At least one fin coupled to the heat sink extends beyond the light source, and the heat generated by the light source travels by conduction laterally through the heat sink to the at least one coupled fin.
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公开(公告)号：US20230329171A1
公开(公告)日：2023-10-19
申请号：US18213306
申请日：2023-06-23
发明人： Daniel S. SPIRO
IPC分类号： F04D29/58 , H05B47/16 , F21V21/03 , H05B45/10 , F21V29/77 , F21S8/06 , F21V21/08 , F21V23/02 , F21S8/02 , F21V29/70 , F21V29/508 , F21V15/01 , A01H5/10 , F04D19/00 , F21V29/74 , H05B45/12 , F21V23/00 , F21V7/00 , F21V21/04 , F21K9/232 , F21V33/00 , H05B47/105 , H04N7/18 , F21V13/04 , F21V29/83
CPC分类号： A01H5/10 , F04D19/002 , F04D29/582 , F21K9/232 , F21S8/026 , F21S8/06 , F21V7/00 , F21V7/0025 , F21V13/04 , F21V15/01 , F21V21/03 , F21V21/047 , F21V21/0832 , F21V23/002 , F21V23/007 , F21V23/02 , F21V29/508 , F21V29/70 , F21V29/74 , F21V29/77 , F21V29/777 , F21V29/83 , F21V33/0056 , F21V33/0076 , F21V33/0096 , H04N7/188 , H05B45/10 , H05B45/12 , H05B47/105 , H05B47/16 , F21Y2115/10
摘要： An integrated ceiling device includes integrated ceiling device including an electronic device housing, a heat dissipating structure, a light source, and a reflection/refraction assembly. An air gap is defined between the electronics housing and other components allowing ambient air to flow therethrough for cooling.
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公开(公告)号：US11730100B2
公开(公告)日：2023-08-22
申请号：US17517451
申请日：2021-11-02
发明人： Daniel S. Spiro
IPC分类号： F21V33/00 , F21V29/74 , F21V21/03 , F21V23/00 , F21V7/00 , F21V29/77 , F21S8/02 , F21V21/04 , F21V29/70 , F21K9/232 , F21V29/508 , F21S8/06 , A01H5/10 , F04D19/00 , F04D29/58 , H05B47/16 , H05B47/105 , H05B45/12 , H05B45/10 , H04N7/18 , F21V13/04 , F21V15/01 , F21V21/08 , F21V23/02 , F21V29/83 , F21Y115/10 , H05B47/19 , H05B47/115
CPC分类号： A01H5/10 , F04D19/002 , F04D29/582 , F21K9/232 , F21S8/026 , F21S8/06 , F21V7/00 , F21V7/0025 , F21V13/04 , F21V15/01 , F21V21/03 , F21V21/047 , F21V21/0832 , F21V23/002 , F21V23/007 , F21V23/02 , F21V29/508 , F21V29/70 , F21V29/74 , F21V29/77 , F21V29/777 , F21V29/83 , F21V33/0056 , F21V33/0076 , F21V33/0096 , H04N7/188 , H05B45/10 , H05B45/12 , H05B47/105 , H05B47/16 , F21V33/00 , F21Y2115/10 , H05B47/115 , H05B47/19
摘要： An integrated ceiling device includes integrated ceiling device including an electronic device housing, a heat dissipating structure, a light source, and a reflection/refraction assembly. An air gap is defined between the electronics housing and other components allowing ambient air to flow therethrough for cooling.
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公开(公告)号：US11690336B2
公开(公告)日：2023-07-04
申请号：US17964919
申请日：2022-10-13
发明人： Daniel S. Spiro
IPC分类号： F21V13/04 , F21V23/02 , F21V29/83 , F21Y115/10 , F21V15/01 , F21V21/08 , A01H5/10 , F21V33/00 , F04D19/00 , F21V29/74 , F04D29/58 , H05B47/16 , H05B47/105 , F21V21/03 , H05B45/12 , H05B45/10 , F21V23/00 , F21V7/00 , F21V29/77 , F21S8/02 , F21V21/04 , F21V29/70 , H04N7/18 , F21K9/232 , F21V29/508 , F21S8/06 , H05B47/19 , H05B47/115
CPC分类号： A01H5/10 , F04D19/002 , F04D29/582 , F21K9/232 , F21S8/026 , F21S8/06 , F21V7/00 , F21V7/0025 , F21V13/04 , F21V15/01 , F21V21/03 , F21V21/047 , F21V21/0832 , F21V23/002 , F21V23/007 , F21V23/02 , F21V29/508 , F21V29/70 , F21V29/74 , F21V29/77 , F21V29/777 , F21V29/83 , F21V33/0056 , F21V33/0076 , F21V33/0096 , H04N7/188 , H05B45/10 , H05B45/12 , H05B47/105 , H05B47/16 , F21V33/00 , F21Y2115/10 , H05B47/115 , H05B47/19
摘要： An integrated ceiling device includes a housing retaining an electronic assembly, a heat sink having a central opening, a light source coupled onto the heat sink, the housing is coupled with and disposed at least partly above the heat sink, and a central vertical axis of the housing aligns or is in proximity with the central opening of the heat sink.
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公开(公告)号：US20220408169A1
公开(公告)日：2022-12-22
申请号：US17895072
申请日：2022-08-25
摘要： In non-limiting examples of the present disclosure, an electrical receptacle is provided. A first transmission tab configured to be electrically connected to a neutral terminal of the electrical receptacle is provided. A second transmission tab configured to be electrically connected to a live terminal of the electrical is provided. A speaker device in electrical communication with the first and second transmission tabs and a speaker grille cover secured to the receptacle cover are also provided, Other examples of the present disclosure relate to systems, methods and devices for influencing resonant modes of one or more vibrating surface, including a mode throttling device and an exciter device.
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