摘要:
Cutting fluids for brittle materials, e.g., silicon ingot, comprise, in weight percent: A. 70-99% polyalkylene glycol (PAG), e.g., polyethylene glycol; B. 0.01-10% PAG-grafted polycarboxylate; and C. 0-30% water. These cutting fluids are used with abrasive materials, e.g., silicon carbide (SiC), to form cutting slurries. The slurry is sprayed on the cutting tool, e.g., a wire saw, to cut a brittle work piece, e.g., a silicon ingot.
摘要翻译:用于脆性材料例如硅锭的切削液包含重量百分比:A.70-99%的聚亚烷基二醇(PAG),例如聚乙二醇; B. 0.01-10%PAG接枝的聚羧酸酯; 和0-30%的水。 这些切削液与研磨材料(例如碳化硅(SiC))一起使用以形成切割浆料。 将浆料喷涂在切割工具,例如线锯上,以切割脆性工件,例如硅锭。
摘要:
Cutting fluids for brittle materials, e.g., silicon ingot, comprise, in weight percent: A. 70-99% polyalkylene glycol (PAG), e.g., polyethylene glycol; B. 0.01-10% PAG-grafted polycarboxylate; and C. 0-30% water. These cutting fluids are used with abrasive materials, e.g., silicon carbide (SiC), to form cutting slurries. The slurry is sprayed on the cutting tool, e.g., a wire saw, to cut a brittle work piece, e.g., a silicon ingot.
摘要翻译:用于脆性材料例如硅锭的切削液包含重量百分比:A.70-99%的聚亚烷基二醇(PAG),例如聚乙二醇; B. 0.01-10%PAG接枝的聚羧酸酯; 和0-30%的水。 这些切削液与研磨材料(例如碳化硅(SiC))一起使用以形成切割浆料。 将浆料喷涂在切割工具,例如线锯上,以切割脆性工件,例如硅锭。
摘要:
Water-based cutting fluids for use with diamond wiresaws that are used for cutting or otherwise treating hard brittle materials, e.g., silicon ingots, comprise: A. Water-soluble, polymeric dispersing agent, typically a polycarboxylate; B. Optionally wetting agent; C. Optionally defoamer; B. Optionally corrosion inhibitor; E. Optionally chelant; F. Optionally biocide; and G. Water. Typically water comprises at least 50 weight percent of the fluid, and the polycarboxylate is grafted with a polyalkylene glycol, e.g., polyethylene glycol.
摘要:
The cutting of semiconducting crystals with a wire saw is facilitated with a cutting fluid comprising a polyalkylene glycol neutralized with an un-neutralized or partially neutralized polymeric acid that has a molecular weight of 500 to 1,000,000 and contains more than three acid groups per molecule.
摘要:
The cutting of semi-conducting crystals with a wire saw is facilitated with a cutting fluid comprising a polyalkylene glycol neutralized with an un-neutralized or partially neutralized polymeric acid that has a molecular weight of 500 to 1,000,000 and contains more than three acid groups per molecule.