公开(公告)号：US5011730A

公开(公告)日：1991-04-30

申请号：US336373

申请日：1989-04-11

申请人： Lindwood P. Tenney ,  David J. Smith ,  Dennis J. Janda ,  Dennis A. Barnes

发明人： Lindwood P. Tenney ,  David J. Smith ,  Dennis J. Janda ,  Dennis A. Barnes

IPC分类号： C08G61/08 ,  H01B3/30 ,  H05K1/03

CPC分类号： C08G61/08 ,  H01B3/30 ,  H05K1/032 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31504 ,  Y10T428/31678 ,  Y10T428/31692 ,  Y10T428/31855 ,  Y10T428/31913

摘要： Dielectric supports for electronic components, such as circuit boards, are provided which are comprised of two or more bulk polymerized norbornene-type monomers. The monomers may be easily processed into circuit boards, etc. by reaction injection molding. The copolymers obtained exhibit high heat distortion temperatures and good dielectric properties and a balance of properties that make them, for example, well suited for molded wire board materials.

摘要翻译： 提供了由两个或多个本体聚合的降冰片烯型单体组成的电子部件如电路板的介质载体。 单体可以通过反应注射成型容易地加工成电路板等。 获得的共聚物表现出高的热变形温度和良好的介电性能以及使它们的性质的平衡，例如，非常适合于模制的线板材料。