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公开(公告)号：US12103999B2
公开(公告)日：2024-10-01
申请号：US17440499
申请日：2020-05-25
Applicant: Showa Denko Materials Co., Ltd.
Inventor： Akihiro Nakamura , Yuji Takase , Hayato Sawamoto , Yoshikazu Suzuki , Shuji Nomoto , Shota Okade
IPC: C08F290/14 , G03F7/031 , H01L23/14 , H05K1/03 , H05K3/46
CPC classification number: C08F290/144 , G03F7/031 , H01L23/145 , H05K1/032 , H05K3/4676 , H05K1/0373
Abstract: The present invention relates to provision of a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent, and (B) a photopolymerization initiator, wherein at least one of the components contained in the photosensitive resin composition is a component including a dicyclopentadiene structure; a photosensitive resin film using the foregoing photosensitive resin composition; a printed wiring board and a method for producing the same; and a semiconductor package.
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公开(公告)号：US12028986B2
公开(公告)日：2024-07-02
申请号：US17367269
申请日：2021-07-02
Inventor： Naomichi Ohashi , Yasuhiro Okawa , Koso Matsuno
IPC: B23K1/00 , H05K1/03 , H05K1/09 , H05K3/34 , B23K101/40 , B23K103/00
CPC classification number: H05K3/341 , B23K1/0016 , H05K1/032 , H05K1/092 , B23K2101/40 , B23K2103/42
Abstract: A method for mounting an electronic component on a resin base material, the method including:
(1) preparing the resin base material having a wiring pattern formed of a conductive paste;
(2) supplying a solder paste which contains solder particles and a thermosetting resin in a state before curing to a predetermined portion of the resin base material;
(3) placing the electronic component on the solder paste; and
(4) heating the resin base material to heat the solder paste to a temperature in a range from 105° C. to 130° C., inclusive to melt the solder particles, and starting a curing exothermic reaction of the thermosetting resin, wherein
a melting temperature of the solder particles is in a range from 90° C. to 130° C., inclusive, and a peak temperature of the curing exothermic reaction of the thermosetting resin is in a range from 135° C. to 165° C., inclusive.-
公开(公告)号：US12016117B2
公开(公告)日：2024-06-18
申请号：US17464049
申请日：2021-09-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takahito Tomoda
CPC classification number: H05K1/0296 , H05K1/0283 , H05K1/032 , H05K1/0393 , H05K1/181 , H05K1/189 , H05K3/284
Abstract: An extensible and contractible mounting board that includes an extensible and contractible substrate; an extensible and contractible wiring line on one main surface of the extensible and contractible substrate; an electronic component electrically connected to the extensible and contractible wiring line; and a resin portion in contact with the extensible and contractible wiring line and overlapping an end portion of a connection region between the extensible and contractible wiring line and the electronic component in a plan view of the extensible and contractible mounting board, the resin portion having a cutout portion that overlaps the extensible and contractible wiring line. A Young's modulus of the resin portion is higher than a Young's modulus of the extensible and contractible substrate.
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4.发明公开公开(公告)号：US20240076552A9
公开(公告)日：2024-03-07
申请号：US18193703
申请日：2023-03-31
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takeshi EDA , Fumiko IKEDA , Yutaka MIZUNO , Taichi FURUKAWA
CPC classification number: C09K19/3809 , C08J5/18 , H05K1/0298 , H05K1/032 , C08J2367/02 , H05K2201/0141
Abstract: A liquid crystal polymer film that includes: a benzene ring; a naphthalene ring; and a carboxymethyl group, wherein, in a 13C-NMR spectrum of a liquid crystal polymer film decomposed with supercritical methanol, an integral value CA of a peak derived from the benzene ring, an integral value CB of a peak derived from the naphthalene ring, and an integral value CC of a peak derived from the carboxymethyl group satisfy (CA+CB)/CC of 1.35 to 1.65.
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公开(公告)号：US11889615B2
公开(公告)日：2024-01-30
申请号：US17075350
申请日：2020-10-20
Applicant: Graphcore Limited
Inventor： Stephen Felix
CPC classification number: H05K1/0231 , H05K1/0215 , H05K1/032 , H05K1/184 , H05K3/0058 , H05K2201/0162
Abstract: There is provided a computer structure comprising a first silicon substrate and a second silicon substrate. Computer circuitry configured to perform computing operations is formed in the first silicon substrate, which has a self-supporting depth and an inner facing surface. A plurality of distributed capacitance units are formed in the second silicon substrate, which has an inner facing surface located in overlap with the inner facing surface of the first substrate and is connected to the first substrate via a set of connectors arranged extending depthwise of the structure between the inner facing surfaces. The inner facing surfaces have matching planar surface dimensions. The second substrate has an outer facing surface on which are arranged a plurality of connector terminals for connecting the computer structure to a supply voltage. The second substrate has a smaller depth than the first substrate.
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Patent Agency Ranking
公开(公告)号：US11859045B2
公开(公告)日：2024-01-02
申请号：US17126446
申请日：2020-12-18
Applicant: Chang Chun Plastics Co., Ltd.
Inventor： An-Pang Tu , Chia-Hung Wu , Chien-Chun Chen
IPC: B32B27/36 , C08G63/06 , C08G63/83 , C08J5/18 , H05K1/03 , B32B15/20 , B32B15/09 , C08G63/60 , C08L67/04 , C09K19/38 , B29C41/12 , B29D7/01 , B29K67/00 , B29K105/00
CPC classification number: C08G63/065 , B29C41/12 , B29D7/01 , B32B15/09 , B32B15/20 , B32B27/36 , C08G63/06 , C08G63/60 , C08G63/83 , C08J5/18 , C08L67/04 , C09K19/3809 , H05K1/032 , B29K2067/00 , B29K2105/0079 , B32B2250/03 , B32B2250/40 , B32B2305/55 , B32B2307/538 , B32B2307/704 , B32B2307/732 , B32B2457/08 , C08G2250/00 , C08J2367/04 , C08L2203/16 , H05K2201/0141
Abstract: Provided are a liquid crystal polymer film (LCP film) and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and the first surface has an arithmetical mean height of a surface (Sa) less than 0.32 μm. The LCP film with proper Sa is suitable to be stacked with a metal foil, such that a laminate comprising the LCP film can have an advantage of low insertion loss.
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公开(公告)号：US11840602B2
公开(公告)日：2023-12-12
申请号：US17126413
申请日：2020-12-18
Applicant: Chang Chun Plastics Co., Ltd.
Inventor： An-Pang Tu , Chien-Chun Chen , Chia-Hung Wu
IPC: B32B15/04 , C08G63/06 , C08G63/83 , C08J5/18 , H05K1/03 , B32B15/20 , B32B15/09 , B32B27/36 , C08G63/60 , C08L67/04 , C09K19/38 , B29C41/12 , B29D7/01 , B29K67/00 , B29K105/00
CPC classification number: C08G63/065 , B29C41/12 , B29D7/01 , B32B15/09 , B32B15/20 , B32B27/36 , C08G63/06 , C08G63/60 , C08G63/83 , C08J5/18 , C08L67/04 , C09K19/3809 , H05K1/032 , B29K2067/00 , B29K2105/0079 , B32B2250/03 , B32B2250/40 , B32B2305/55 , B32B2307/538 , B32B2307/704 , B32B2307/732 , B32B2457/08 , C08G2250/00 , C08J2367/04 , C08L2203/16 , H05K2201/0141
Abstract: Provided are a laminate, a circuit board, and a liquid crystal polymer (LCP) film comprised therein. The laminate comprises a metal foil and an LCP film. The LCP film in the laminate has a dissipation factor before water absorption (Df′0), a dissipation factor after water absorption (Df′1), and a relative percentage difference between dissipation factors (ΔDf′), which is calculated by the following equation:
Δ
Df
′
(
%
)
=
❘
"\[LeftBracketingBar]"
Df
1
′
-
Df
0
′
❘
"\[RightBracketingBar]"
Df
0
′
×
100
%
;
wherein ΔDf′ may be less than or equal to 16%.
By controlling ΔDf′ of the LCP film in the laminate, the insertion loss of a circuit board comprising a laminate during signal transmission in low-, medium-, and/or high-frequency bands is decreased and/or inhibited. In addition, the difference between the insertion losses of signal transmission before and after water absorption is decreased, so the laminate is suitable for high-end or outdoor high-frequency electronic products.-
公开(公告)号：US11751321B2
公开(公告)日：2023-09-05
申请号：US17863451
申请日：2022-07-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Atsushi Kasuya , Tomohiko Naruoka
CPC classification number: H05K1/0237 , H05K1/0218 , H05K1/032 , H05K2201/0141 , H05K2201/068 , H05K2201/09027
Abstract: A resin multilayer substrate includes a multilayer body including resin base-material layers in a thickness direction, a side-surface conductor on at least a side surface of the multilayer body and made of a metallic material with a coefficient of thermal expansion whose difference from a coefficient of thermal expansion of the resin base-material layers in a plane direction is smaller than a difference from a coefficient of thermal expansion of the resin base-material layers in the thickness direction, a circuit component in the multilayer body and defining a circuit, and inner conductors in the multilayer body, located between the side-surface conductor and the circuit component along the side-surface conductor, and at least partially overlapping each other when viewed in the thickness direction, each of the inner conductors being one of a dummy conductor and a ground conductor.
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公开(公告)号：US11690173B2
公开(公告)日：2023-06-27
申请号：US17674837
申请日：2022-02-18
Applicant: Unimicron Technology Corp.
Inventor： Tzyy-Jang Tseng , Chin-Sheng Wang , Ra-Min Tain
CPC classification number: H05K1/0298 , H05K1/023 , H05K1/181 , H05K1/185 , H05K1/032 , H05K1/036 , H05K1/092 , H05K1/113 , H05K2201/0323
Abstract: A circuit board structure includes a dielectric substrate, at least one embedded block, at least one electronic component, at least one first build-up circuit layer, and at least one second build-up circuit layer. The dielectric substrate includes a through cavity penetrating the dielectric substrate. The embedded block is fixed in the through cavity. The embedded block includes a first through hole and a second through hole. The electronic component is disposed in the through hole of the embedded block. The first build-up circuit layer is disposed on the top surface of the dielectric substrate and covers the embedded block. The second build-up circuit layer is disposed on the bottom surface of the dielectric substrate and covers the embedded block.
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公开(公告)号：US20180346657A1
公开(公告)日：2018-12-06
申请号：US15611360
申请日：2017-06-01
Applicant: International Business Machines Corporation
Inventor： Sarah K. Czaplewski , Brandon M. Kobilka , Joseph Kuczynski , Jason T. Wertz , Jing Zhang
CPC classification number: C08G81/027 , C07C69/003 , C07C69/007 , C07F9/091 , C07F9/093 , C07F9/113 , C07F9/1411 , C07F9/1412 , C08G18/836 , C08K5/0066 , C08K5/521 , C08K5/524 , C08L2201/02 , C08L2666/84 , H05K1/032
Abstract: A flame-retardant aconitic acid-derived cross-linker, a process for forming a flame-retardant resin, and an article of manufacture comprising a material that contains a flame-retardant aconitic acid-derived cross-linker are disclosed. The flame-retardant aconitic acid-derived cross-linker can have at least two phosphoryl or phosphonyl moieties with allyl functional groups, epoxy functional groups, propylene carbonate functional group, or functionalized thioether substituents. The process for forming the flame-retardant polymer can include forming an aconitic acid derivative, forming a phosphorus-based flame-retardant molecule, and reacting the aconitic acid derivative with the phosphorus-based flame-retardant molecule to form a flame-retardant aconitic acid-derived cross-linker, and binding the cross-linker to a polymer. The aconitic acid derivative can be synthesized from aconitic acid obtained from a bio-based source. Examples of aconitic acid derivatives include carboxysuccinic acid, 2-(hydroxymethyl)-1,4-butenediol, and 2-(hydroxymethyl)-1,4-butanediol. The article of manufacture can further comprise an electronic component.
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