公开(公告)号：US06219243B1

公开(公告)日：2001-04-17

申请号：US09461469

申请日：1999-12-14

申请人： Qing Ma ,  Lise Varner ,  Harry Fujimoto

发明人： Qing Ma ,  Lise Varner ,  Harry Fujimoto

IPC分类号： H05K720

CPC分类号： H05K1/0204 ,  H01L23/36 ,  H01L23/3677 ,  H01L2224/32225 ,  H01L2924/15311 ,  H05K2201/09054 ,  H05K2201/10734

摘要： An enhanced heat dissipation device for a chip-on-flex packaged unit includes a flex circuit material attached to a front side of an integrated circuit die. The flex circuit material further attached to a bottom side of a printed circuit board having an opening to expose the flex circuit material. A top heat spreader thermally coupled to the flex circuit material through the opening in the printed circuit to dissipate heat from the front side of the integrated circuit die. The device further includes a bottom heat spreader, that is thermally coupled to back side of the integrated circuit die, to dissipate heat from the back side of the integrated circuit die. This enables the heat dissipation device to dissipate heat from both the front side and back side of the integrated circuit die, and thereby enhancing the heat dissipation for a given unit surface are of the integrated circuit die without increasing the volume of the heat dissipation device.

摘要翻译： 用于芯片上的柔性封装单元的增强的散热装置包括附接到集成电路管芯的前侧的柔性电路材料。 柔性电路材料进一步附接到具有开口的印刷电路板的底侧以暴露柔性电路材料。 顶部散热器，其通过印刷电路中的开口热耦合到柔性电路材料，以从集成电路管芯的前侧消散热量。 该装置还包括热耦合到集成电路管芯的背侧的底部散热器，以从集成电路管芯的背面散发热量。 这使得散热装置能够从集成电路管芯的前侧和后侧散发热量，从而增加给定单元表面的散热是集成电路管芯而不增加散热装置的体积。