公开(公告)号：US11849790B2

公开(公告)日：2023-12-26

申请号：US17639965

申请日：2020-09-03

Applicant: Liwei Cheng

Inventor： Liwei Cheng ,  Wei Hu

IPC: A41H3/00 ,  G06T7/60 ,  G06T13/40

CPC classification number: A41H3/007 ,  G06T7/60 ,  G06T13/40 ,  G06T2210/16

Abstract: The present disclosure discloses a method and apparatus for processing data, a computer device and computer-readable storage medium. The method comprises: acquiring image data of a human body; identifying a two-dimensional posture of the human body based on the image data; comparing the identified two-dimensional posture to a posture database to determine preset parts of the two-dimensional posture; and assigning cloth physical property of to-be-tried-on apparel to a part of the preset parts of the two-dimensional posture covered by original apparel. The present disclosure can greatly improve the efficiency of data processing, thereby improving user experiences.

公开(公告)号：US20220322775A1

公开(公告)日：2022-10-13

申请号：US17639965

申请日：2020-09-03

Applicant: Liwei CHENG

Inventor： Liwei Cheng ,  Wei Hu

IPC: A41H3/00 ,  G06T13/40 ,  G06T7/60

Abstract: The present disclosure discloses a method and apparatus for processing data, a computer device and computer-readable storage medium. The method comprises: acquiring image data of a human body; identifying a two-dimensional posture of the human body based on the image data; comparing the identified two-dimensional posture to a posture database to determine preset parts of the two-dimensional posture; and assigning cloth physical property of to-be-tried-on apparel to a part of the preset parts of the two-dimensional posture covered by original apparel. The present disclosure can greatly improve the efficiency of data processing, thereby improving user experiences.

公开(公告)号：US20190214751A1

公开(公告)日：2019-07-11

申请号：US15868169

申请日：2018-01-11

Applicant: Amruthavalli Pallavi Alur ,  Siddharth K. Alur ,  Liwei Cheng ,  Lauren A. Link ,  Jonathan L. Rosch ,  Sai Vadlamani ,  Cheng Xu

Inventor： Amruthavalli Pallavi Alur ,  Siddharth K. Alur ,  Liwei Cheng ,  Lauren A. Link ,  Jonathan L. Rosch ,  Sai Vadlamani ,  Cheng Xu

IPC: H01R12/71 ,  H01R12/70 ,  H01R13/24 ,  H01R43/16

Abstract: An electronic interconnect may include a substrate. The substrate may include a passageway in the substrate. The passageway may extend from a first surface of the substrate toward a second surface of the substrate. The passageway may be closed at an end of the passageway. The electronic interconnect may include a plated through hole socket coupled to the passageway. The electronic interconnect may include a contact. The contact may include a pin. The pin may be configured to engage with the plated through hole socket. The electronic interconnect may include a solder ball. The solder ball may be coupled to the plated through hole socket.