公开(公告)号：US20220189880A1

公开(公告)日：2022-06-16

申请号：US17124352

申请日：2020-12-16

申请人： Srinivas V. Pietambaram ,  Tarek A. Ibrahim ,  Gang Duan ,  Sai Vadlamani ,  Bharat Prasad Penmecha

发明人： Srinivas V. Pietambaram ,  Tarek A. Ibrahim ,  Gang Duan ,  Sai Vadlamani ,  Bharat Prasad Penmecha

IPC分类号： H01L23/538 ,  H01L23/498 ,  H01L25/065

摘要： Disclosed herein are microelectronic structures including glass cores, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a glass core having through-glass vias (TGVs) therein; a metallization region at a first face of the glass core, wherein a conductive pathway in the first metallization region is conductively coupled to at least one of the TGVs; a bridge component in the metallization region; a first conductive contact at a face of the metallization region, wherein the first conductive contact is conductively coupled to the conductive pathway; and a second conductive contact at the face of the metallization region, wherein the second conductive contact is conductively coupled to the bridge component.

公开(公告)号：US20200005994A1

公开(公告)日：2020-01-02

申请号：US16020035

申请日：2018-06-27

申请人： Kyu-Oh LEE ,  Rahul JAIN ,  Sai VADLAMANI ,  Cheng XU ,  Ji Yong PARK ,  Junnan ZHAO ,  Seo Young KIM

发明人： Kyu-Oh LEE ,  Rahul JAIN ,  Sai VADLAMANI ,  Cheng XU ,  Ji Yong PARK ,  Junnan ZHAO ,  Seo Young KIM

IPC分类号： H01F27/32 ,  H01F27/28 ,  H01L23/498 ,  H01F41/04 ,  H01L21/48

摘要： Apparatuses, systems and methods associated with a substrate assembly with an encapsulated magnetic feature for an inductor are disclosed herein. In embodiments, a substrate assembly may include a base substrate, a magnetic feature encapsulated within the base substrate, and a coil, wherein a portion of the coil extends through the magnetic feature. Other embodiments may be described and/or claimed.

公开(公告)号：US20200098848A1

公开(公告)日：2020-03-26

申请号：US16142817

申请日：2018-09-26

申请人： Chong Zhang ,  Andrew J. Brown ,  Sheng Li ,  Sai Vadlamani ,  Ying Wang

发明人： Chong Zhang ,  Andrew J. Brown ,  Sheng Li ,  Sai Vadlamani ,  Ying Wang

IPC分类号： H01L49/02 ,  H01F27/28 ,  G05F1/625 ,  H01L23/522 ,  C09D11/52

摘要： Methods of forming an inductor using dry processes are described. A cavity is laser drilled in an insulator. A first magnetic material layer is printed in the cavity. An Ag conductive ink is printed on the first magnetic material layer and a second magnetic material layer printed on the ink. The ink has a trace sandwiched between the first and second magnetic material layers that provides a majority of the inductance of the inductor. A protective insulating layer protects the second magnetic material layer from a wet chemistry solution when contacts are formed to the ink. The second magnetic material layer and ink are deposited in or on the cavity.

公开(公告)号：US20190214751A1

公开(公告)日：2019-07-11

申请号：US15868169

申请日：2018-01-11

申请人： Amruthavalli Pallavi Alur ,  Siddharth K. Alur ,  Liwei Cheng ,  Lauren A. Link ,  Jonathan L. Rosch ,  Sai Vadlamani ,  Cheng Xu

发明人： Amruthavalli Pallavi Alur ,  Siddharth K. Alur ,  Liwei Cheng ,  Lauren A. Link ,  Jonathan L. Rosch ,  Sai Vadlamani ,  Cheng Xu

IPC分类号： H01R12/71 ,  H01R12/70 ,  H01R13/24 ,  H01R43/16

摘要： An electronic interconnect may include a substrate. The substrate may include a passageway in the substrate. The passageway may extend from a first surface of the substrate toward a second surface of the substrate. The passageway may be closed at an end of the passageway. The electronic interconnect may include a plated through hole socket coupled to the passageway. The electronic interconnect may include a contact. The contact may include a pin. The pin may be configured to engage with the plated through hole socket. The electronic interconnect may include a solder ball. The solder ball may be coupled to the plated through hole socket.

公开(公告)号：US20200006464A1

公开(公告)日：2020-01-02

申请号：US16020590

申请日：2018-06-27

申请人： Andrew J. Brown ,  Rahul Jain ,  Sheng Li ,  Sai Vadlamani ,  Chong Zhang

发明人： Andrew J. Brown ,  Rahul Jain ,  Sheng Li ,  Sai Vadlamani ,  Chong Zhang

IPC分类号： H01L49/02 ,  H01L23/522 ,  H01L23/00 ,  H01F17/00

摘要： An apparatus and method of forming a magnetic inductor circuit. A substrate is provided and a first magnetic layer is formed in contact with one layer of the substrate. A conductive trace is formed in contact with the first magnetic layer. A sacrificial cooper layer protects the magnetic material from wet chemistry process steps. A conductive connection is formed from the conductive trace to the outside substrate, the conductive connection comprising a horizontal connection formed by in-layer plating A second magnetic layer is formed in contact with the conductive trace. Instead of a horizontal connection, a vertical conductive connection can be formed that is perpendicular to the magnetic layers, by drilling a first via in a second of the magnetic layers, forming a buildup layer, and drilling a second via through the buildup layer, where the buildup layer protects the magnetic layers from wet chemistry processes.