公开(公告)号：US5029242A

公开(公告)日：1991-07-02

申请号：US522338

申请日：1990-05-10

Applicant: Manfred Sammet

Inventor： Manfred Sammet

IPC: H05K1/03 ,  C03C14/00 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K1/11 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46

CPC classification number: H01L21/4867 ,  C03C14/004 ,  H01L21/486 ,  H01L23/49883 ,  H05K3/4061 ,  C03C2214/04 ,  C03C2214/08 ,  C03C2214/20 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/092 ,  H05K2203/086 ,  H05K2203/087 ,  H05K2203/1126 ,  H05K3/1291 ,  H05K3/4629

Abstract: The structure consists of at least one glass-ceramic sheet (1) with holes (3) being filled with a conductive material (4) having a TCE slightly higher than that of the glass-ceramics and having undergone liquid phase sintering at the crystallization temperature of the glass-ceramic material (2) with the solid phase comprising conductive particles (5) and the liquid phase comprising at least a glass (6).The method comprises the steps of providing a green sheet comprising an organic vehicle and particles of a crystallizable first glass and having via holes, filling the via holes with a paste comprising an organic vehicle, and an inorganic material comprising conductive particles and at least a second glass being low viscous at the sintering temperature, firing the then present structure in a reducing, neutral or slightly oxidizing atmosphere with the temperature being slowly raised to said sintering temperature and slowly cooling the structure.

Abstract translation: 该结构由至少一个具有孔（3）的玻璃陶瓷片（1）填充有导电材料（4），其导电材料（TCE）略高于玻璃陶瓷的TCE，并且在结晶温度下经历了液相烧结 的玻璃陶瓷材料（2），其中固相包含导电颗粒（5）和液相至少包括玻璃（6）。 该方法包括以下步骤：提供包含有机载体的生片和可结晶的第一玻璃的颗粒，并且具有通孔，用包含有机载体的糊状物填充通孔，以及包含导电颗粒和至少第二玻璃的无机材料 玻璃在烧结温度下为低粘度，然后在还原性，中性或轻微氧化气氛中焙烧当前的结构，将温度缓慢升高至所述烧结温度并缓慢冷却结构。

公开(公告)号：US5468445A

公开(公告)日：1995-11-21

申请号：US281716

申请日：1994-07-28

Applicant: Jon A. Casey ,  Renuka S. Divakaruni ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Manfred Sammet

Inventor： Jon A. Casey ,  Renuka S. Divakaruni ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Manfred Sammet

IPC: C04B37/00 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K3/12 ,  H05K3/46 ,  B22F7/08

CPC classification number: H05K1/092 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306

Abstract: A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.

Abstract translation: 一种用于陶瓷的新型金属填充通孔组合物。 可以将通孔组合物配制成具有接近于陶瓷材料的体积收缩率，从而克服了烧结时通孔（特别是铜填充的通孔）和陶瓷之间体积收缩失配的问题。 该新型通孔组合物表现出增强的对陶瓷的附着力。 还公开了通过控制新型通孔组合物的收缩并提高粘合性的烧结方法。

公开(公告)号：US5336444A

公开(公告)日：1994-08-09

申请号：US890898

申请日：1992-05-29

Applicant: Jon A. Casey ,  Renuka S. Divakaruni ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Manfred Sammet

Inventor： Jon A. Casey ,  Renuka S. Divakaruni ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Manfred Sammet

IPC: C04B37/00 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K3/12 ,  H05K3/46 ,  H01B1/00 ,  H01B1/02

CPC classification number: H05K1/092 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306

Abstract: A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.

Abstract translation: 一种用于陶瓷的新型金属填充通孔组合物。 可以将通孔组合物配制成具有接近于陶瓷材料的体积收缩率，从而克服了烧结时通孔（特别是铜填充的通孔）和陶瓷之间体积收缩失配的问题。 该新型通孔组合物表现出增强的对陶瓷的附着力。 还公开了通过控制新型通孔组合物的收缩并提高粘合性的烧结方法。