公开(公告)号：US20240260199A1

公开(公告)日：2024-08-01

申请号：US18222127

申请日：2023-07-14

申请人： Vestas Wind Systems A/S

发明人： Mie Elholm Birkbak ,  Jesper Rømer Hansen

IPC分类号： H05K3/00 ,  B03C1/18 ,  B03C1/247

CPC分类号： H05K3/0011 ,  B03C1/18 ,  B03C1/247 ,  B03C2201/20 ,  H05K2203/178

摘要： Methods and systems for recycling a printed circuit board (PCB). The printed circuit board is exposed to a swelling agent that causes an epoxy matrix of the printed circuit board to swell and disintegrate into particles. The particles of epoxy are then separated from the printed circuit board, leaving behind reinforcing fiber and metal containing components thereof. These remaining components are separated from each other and recycled separately using suitable processes. The epoxy particles are also recovered, and may be reduced to a monomer for use in synthesizing new epoxy. The swelling agent includes a carboxylic acid, preferably formic acid, as an active ingredient.

公开(公告)号：US20240247335A1

公开(公告)日：2024-07-25

申请号：US18421194

申请日：2024-01-24

申请人： NewSouth Innovations Pty Limited

发明人： Veena Sahajwalla

IPC分类号： C22B11/02 ,  C22B7/00 ,  C22B13/02 ,  C22B15/00 ,  C22B25/02 ,  H05K3/22

CPC分类号： C22B11/025 ,  C22B7/004 ,  C22B13/025 ,  C22B15/0056 ,  C22B25/02 ,  H05K3/22 ,  H05K2203/1105 ,  H05K2203/178

摘要： A method, apparatus and system for processing a composite waste source, such as e-waste, is disclosed. The composite waste source may comprise low-, moderate and high-melting point constituents, such as plastics, metals and ceramics. The composite waste source is heated to a first temperature zone, causing at least some of the low-melting point constituents to at least partially thermally transform. The composite waste source is subsequently heated to a second, higher, temperature zone, causing at least some of the moderate-melting point constituents to at least partially thermally transform. At least some of the at least partially thermally transformed constituents may be recovered. The method, apparatus and system disclosed may provide for the recovery and reuse of materials which would otherwise be sent to landfill or incinerated.

公开(公告)号：US11884992B2

公开(公告)日：2024-01-30

申请号：US16076289

申请日：2017-02-08

申请人： NewSouth Innovations Pty Limited

发明人： Veena Sahajwalla

IPC分类号： C22B11/02 ,  C22B7/00 ,  C22B13/02 ,  C22B15/00 ,  C22B25/02 ,  H05K3/22

CPC分类号： C22B11/025 ,  C22B7/004 ,  C22B13/025 ,  C22B15/0056 ,  C22B25/02 ,  H05K3/22 ,  H05K2203/1105 ,  H05K2203/178

摘要： A method, apparatus and system for processing a composite waste source, such as e-waste, is disclosed. The composite waste source may comprise low-, moderate and high-melting point constituents, such as plastics, metals and ceramics. The composite waste source is heated to a first temperature zone, causing at least some of the low-melting point constituents to at least partially thermally transform. The composite waste source is subsequently heated to a second, higher, temperature zone, causing at least some of the moderate-melting point constituents to at least partially thermally transform. At least some of the at least partially thermally transformed constituents may be recovered. The method, apparatus and system disclosed may provide for the recovery and reuse of materials which would otherwise be sent to landfill or incinerated.

公开(公告)号：US09704817B2

公开(公告)日：2017-07-11

申请号：US12205693

申请日：2008-09-05

申请人： Gareth J. Knowles ,  Lindsay Quarrie

发明人： Gareth J. Knowles ,  Lindsay Quarrie

IPC分类号： G06F1/26 ,  G06F11/00 ,  G08B13/00 ,  G08B21/00 ,  G08B29/00 ,  H01L23/00 ,  H05K1/02 ,  H01S5/02 ,  H01S5/40

CPC分类号： H01L23/576 ,  H01L2924/0002 ,  H01S5/02 ,  H01S5/4025 ,  H05K1/0274 ,  H05K1/0275 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10689 ,  H05K2203/178 ,  H01L2924/00

摘要： An apparatus, method and system for securing proprietary semiconductor IC components including a target semiconductor IC; at least one laser diode array disposed adjacent to the target semiconductor IC and coupled thereto; a power supply coupled to the at least one laser diode array; a sensor for sensing a predetermined parameter operatively coupled to the laser diode array through the power supply; wherein the sensor detects the existence of a predetermined event and as a result of the detection of the predetermined event activates the power supply and energizes the laser diode array, causing the laser diode array to project focused laser energy into the target semiconductor IC, damaging the target semiconductor IC.

公开(公告)号：US20170079146A1

公开(公告)日：2017-03-16

申请号：US15341626

申请日：2016-11-02

申请人： ADVANCED TECHNOLOGY MATERIALS, INC.

发明人： André BROSSEAU ,  Svitlana GRIGORENKO ,  Ping JIANG ,  Michael B. KORZENSKI

IPC分类号： H05K3/22 ,  C22B3/00 ,  C22B7/00 ,  C25C1/20

CPC分类号： H05K3/22 ,  C22B7/007 ,  C22B7/008 ,  C22B11/046 ,  C23F1/44 ,  C25C1/20 ,  H05K2203/176 ,  H05K2203/178 ,  Y02P10/214 ,  Y02P10/234 ,  Y02P20/582 ,  Y02P70/613 ,  Y02W30/54 ,  Y10T29/49815

摘要： Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be collected for reuse and recycling.

摘要翻译： 使用环境友好的组合物回收印刷线路板的方法，其中电子元件，贵金属和贱金属可以被收集用于再利用和再循环。

公开(公告)号：US09215799B2

公开(公告)日：2015-12-15

申请号：US14684857

申请日：2015-04-13

申请人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

发明人： Shunjiro Takemori ,  Shigeru Narakino

IPC分类号： H05K1/02 ,  G06F21/86 ,  H05K5/02 ,  H05K1/14

CPC分类号： H05K1/0275 ,  G06F21/86 ,  H05K1/0213 ,  H05K1/141 ,  H05K1/147 ,  H05K5/0208 ,  H05K2201/0314 ,  H05K2201/047 ,  H05K2201/056 ,  H05K2201/2018 ,  H05K2203/178

摘要： The terminal unit includes a main board, electronic components implemented on the main board, a sub-board covering above the electronic components and a frame member so disposed between the main board and the sub-board as to surround the electronic components. A flexible printed circuit covers an outer side of a wall portion of the frame member and is so wound around the frame member from upper and lower sides of the wall portion as to cover at least part of an inner side of the wall portion. A wiring pattern formed on the flexible printed circuit is electrically connected to the electronic components, and information to be protected that is stored on the electronic components becomes unreadable if the wiring pattern is cut off or short-circuited.

摘要翻译： 终端单元包括主板，在主板上实现的电子部件，覆盖在电子部件上的子板，以及围绕电子部件设置在主板和子板之间的框架部件。 柔性印刷电路覆盖框架构件的壁部的外侧，并且被从壁部的上侧和下侧卷绕在框架构件上以覆盖壁部的内侧的至少一部分。 形成在柔性印刷电路上的布线图案电连接到电子部件，并且如果布线图案被切断或短路，则存储在电子部件上的要被保护的信息变得不可读。

公开(公告)号：US09113584B2

公开(公告)日：2015-08-18

申请号：US13982036

申请日：2012-01-30

申请人： Hangfeng Ji ,  Abraham Rudolf Balkenende ,  Hong Chen

发明人： Hangfeng Ji ,  Abraham Rudolf Balkenende ,  Hong Chen

IPC分类号： H05K7/00 ,  H05K3/30 ,  H05K3/22 ,  H05K1/02 ,  H05K3/32 ,  H05K3/34

CPC分类号： H05K3/305 ,  H05K1/0269 ,  H05K3/22 ,  H05K3/321 ,  H05K3/34 ,  H05K2201/09936 ,  H05K2203/047 ,  H05K2203/176 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T156/1089

摘要： The present invention relates to a printed circuit board assembly (10), said printed circuit board assembly comprising: a substrate (100); two or more electronic components which are categorized, wherein each component is secured to the substrate by securing means having a different predetermined thermal-release temperature, depending on which category said component belongs to. The invention furthermore relates to a method of assembling the printed circuit board assembly and a method of disassembling the printed circuit board assembly according to the invention.

摘要翻译： 印刷电路板组件技术领域本发明涉及印刷电路板组件（10），所述印刷电路板组件包括：基板（100）; 两个或多个被分类的电子部件，其中根据所述部件所属的类别，每个部件通过具有不同的预定热释放温度的固定装置固定到基板。 本发明还涉及组装印刷电路板组件的方法和拆卸根据本发明的印刷电路板组件的方法。

公开(公告)号：US20150014039A1

公开(公告)日：2015-01-15

申请号：US14311546

申请日：2014-06-23

申请人： NIPPON MEKTRON, LTD. ,  OSAKA UNIVERSITY

发明人： Masaya Nogi ,  Katsuaki Suganuma ,  Hirotaka Koga ,  Natsuki Komoda ,  Hirofumi Matsumoto ,  Masayuki Iwase ,  Kazayuki Ozaki ,  Keizo Toyama

IPC分类号： H01G4/16 ,  D21H21/14 ,  D21H11/10 ,  H05K1/18

CPC分类号： H01G4/16 ,  D21H11/10 ,  D21H21/14 ,  H01G4/203 ,  H05K1/02 ,  H05K1/0386 ,  H05K1/162 ,  H05K3/4602 ,  H05K3/4614 ,  H05K2201/026 ,  H05K2201/09672 ,  H05K2203/178 ,  Y10T428/249921

摘要： Disclosed are an insulating material (high-k layer) which includes a fiber assembly mainly composed of a cellulose nanofiber, and an electroconductive metal material supported by the fiber assembly; and a passive element (capacitor) which includes a high-k layer which is composed of the insulating material, and an electroconductive part stacked on the high-k layer.

摘要翻译： 公开了一种绝缘材料（高k层），其包括主要由纤维素纳米纤维构成的纤维集合体和由纤维集合体支撑的导电金属材料; 以及包括由绝缘材料构成的高k层的无源元件（电容器）和堆叠在高k层上的导电部分。

公开(公告)号：US20140191019A1

公开(公告)日：2014-07-10

申请号：US14240220

申请日：2012-12-13

申请人： Tianniu Chen ,  Michael B. Korzenski ,  Ping Jiang

发明人： Tianniu Chen ,  Michael B. Korzenski ,  Ping Jiang

IPC分类号： B23K1/018 ,  B09B5/00

CPC分类号： B23K1/018 ,  B09B3/00 ,  B09B5/00 ,  B23K3/08 ,  B23K37/00 ,  C22B1/005 ,  C22B3/02 ,  C22B3/04 ,  C22B4/00 ,  C22B7/006 ,  C22B11/046 ,  C25C1/00 ,  H05K3/22 ,  H05K2203/178 ,  Y02P10/234 ,  Y02P70/613 ,  Y02W30/82 ,  Y02W30/821 ,  Y02W30/822

摘要： Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.

摘要翻译： 可以收集用于回收印刷线路板的设备和方法，其中电子元件，贵金属和贱金属可以被收集用于再利用和再循环。 这些设备通常包括机械焊料去除模块和/或热模块，化学焊剂去除模块和贵金属浸出模块，其中模块被附接以使电子废物从模块连续通过模块。

公开(公告)号：US20140097008A1

公开(公告)日：2014-04-10

申请号：US14021099

申请日：2013-09-09

申请人： Eben Bayer ,  Gavin Mclntyre

发明人： Eben Bayer ,  Gavin Mclntyre

IPC分类号： H05K3/00 ,  H05K1/03

CPC分类号： H05K3/0011 ,  C12N1/14 ,  C12P1/02 ,  C12P3/00 ,  H01L51/0093 ,  H05K1/0353 ,  H05K1/0366 ,  H05K2203/122 ,  H05K2203/178

摘要： An electrical circuit is comprised of a sheet of mycelium having a wiring pattern for an electrical circuit thereon. The sheet of mycelium is prepared from a solution of Potato Dextrose Broth and Potato Dextrose Agar that is inoculated with a macerated tissue culture including a filamentous fungi selected from the group consisting of Basidiomycota, Ascomycota and Zygomycota. A sheet of tissue that grows on the surface of the solution is extracted, plasticized and dried prior to being formed with the wiring pattern.

摘要翻译： 电路由具有用于其上的电路的布线图案的菌丝体片构成。 菌丝体片由马铃薯葡萄糖肉汤和马铃薯葡萄糖琼脂的溶液制成，该琼脂接种有浸没组织培养物，包括选自担子菌纲，子囊菌纲和接合菌属的丝状真菌。 在形成布线图案之前，将在该溶液表面上生长的薄片片材提取，塑化和干燥。