公开(公告)号：US20120149174A1

公开(公告)日：2012-06-14

申请号：US13313282

申请日：2011-12-07

Applicant: Vincent Jarry ,  Marc Feron

Inventor： Vincent Jarry ,  Marc Feron

IPC: H01L21/78 ,  B23Q3/00 ,  B26D1/00

CPC classification number: H01L21/78 ,  Y10T83/929

Abstract: A method for thinning and dicing a wafer of electronic circuits, wherein: a thinning step is carried out while the wafer is supported by a first film bonded at the periphery of a support frame; and a dicing step is carried out while the thinned wafer is supported by a second film bonded at the periphery of the same frame from the other surface of the wafer, the first film being unstuck only once the second one is in place.

Abstract translation: 一种用于对电子电路的晶片进行薄化和切割的方法，其中：当晶片被支撑在支撑框架的周边处的第一薄膜支撑时，进行变薄步骤; 并且在薄的晶片被从晶片的另一个表面接合在同一框架的周边处的第二薄膜支撑的同时进行切割步骤，第一薄膜仅在第二薄膜就位时被解除。

公开(公告)号：US20110124157A1

公开(公告)日：2011-05-26

申请号：US12946986

申请日：2010-11-16

Applicant: Marc Feron ,  Vincent Jarry ,  Laurent Barreau

Inventor： Marc Feron ,  Vincent Jarry ,  Laurent Barreau

IPC: H01L21/56

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L23/3114 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01087

Abstract: A method for encapsulating electronic components, including the steps of: forming, in a first surface of a semiconductor wafer, electronic components; forming, on the first surface, an interconnection stack including conductive tracks and vias separated by an insulating material; forming first and second bonding pads on the interconnection stack; thinning down the wafer, except at least on its contour; filling the thinned-down region with a first resin layer; arranging at least one first chip on the first bonding pads and forming solder bumps on the second bonding pads; depositing a second resin layer covering the first chips and partially covering the solder bumps; bonding an adhesive strip on the first resin layer; and scribing the structure into individual chips.

Abstract translation: 一种封装电子部件的方法，包括以下步骤：在半导体晶片的第一表面中形成电子部件; 在第一表面上形成包括由绝缘材料分隔开的导电轨道和通孔的互连堆叠; 在互连堆叠上形成第一和第二接合焊盘; 至少在轮廓上除外，使晶片变薄; 用第一树脂层填充薄的区域; 在所述第一接合焊盘上布置至少一个第一芯片，并在所述第二焊盘上形成焊料凸块; 沉积覆盖第一芯片并部分覆盖焊料凸块的第二树脂层; 将粘合带粘合在第一树脂层上; 并将结构划分成单个芯片。

公开(公告)号：US08309403B2

公开(公告)日：2012-11-13

申请号：US12946986

申请日：2010-11-16

Applicant: Marc Feron ,  Vincent Jarry ,  Laurent Barreau

Inventor： Marc Feron ,  Vincent Jarry ,  Laurent Barreau

IPC: H01L21/00 ,  H01L29/06

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L23/3114 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01087

Abstract: A method for encapsulating electronic components, including the steps of: forming, in a first surface of a semiconductor wafer, electronic components; forming, on the first surface, an interconnection stack including conductive tracks and vias separated by an insulating material; forming first and second bonding pads on the interconnection stack; thinning down the wafer, except at least on its contour; filling the thinned-down region with a first resin layer; arranging at least one first chip on the first bonding pads and forming solder bumps on the second bonding pads; depositing a second resin layer covering the first chips and partially covering the solder bumps; bonding an adhesive strip on the first resin layer; and scribing the structure into individual chips.

Abstract translation: 一种封装电子部件的方法，包括以下步骤：在半导体晶片的第一表面中形成电子部件; 在第一表面上形成包括由绝缘材料分隔开的导电轨道和通孔的互连堆叠; 在互连堆叠上形成第一和第二接合焊盘; 至少在轮廓上除外，使晶片变薄; 用第一树脂层填充薄的区域; 在所述第一接合焊盘上布置至少一个第一芯片，并在所述第二焊盘上形成焊料凸块; 沉积覆盖第一芯片并部分覆盖焊料凸块的第二树脂层; 将粘合带粘合在第一树脂层上; 并将结构划分成单个芯片。

公开(公告)号：US08486763B2

公开(公告)日：2013-07-16

申请号：US13313282

申请日：2011-12-07

Applicant: Vincent Jarry ,  Marc Feron

Inventor： Vincent Jarry ,  Marc Feron

IPC: H01L21/00

CPC classification number: H01L21/78 ,  Y10T83/929

Abstract: A method for thinning and dicing a wafer of electronic circuits, wherein: a thinning step is carried out while the wafer is supported by a first film bonded at the periphery of a support frame; and a dicing step is carried out while the thinned wafer is supported by a second film bonded at the periphery of the same frame from the other surface of the wafer, the first film being unstuck only once the second one is in place.

Abstract translation: 一种用于对电子电路的晶片进行薄化和切割的方法，其中：当晶片被支撑在支撑框架的周边处的第一薄膜支撑时，进行变薄步骤; 并且在薄的晶片被从晶片的另一个表面接合在同一框架的周边处的第二薄膜支撑的同时进行切割步骤，第一薄膜仅在第二薄膜就位时被解除。

公开(公告)号：US20130043586A1

公开(公告)日：2013-02-21

申请号：US13649797

申请日：2012-10-11

Applicant: Marc Feron ,  Vincent Jarry ,  Laurent Barreau

Inventor： Marc Feron ,  Vincent Jarry ,  Laurent Barreau

IPC: H01L23/48 ,  H01L21/56

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L23/3114 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01087

Abstract: A method for encapsulating electronic components, including the steps of: forming, in a first surface of a semiconductor wafer, electronic components; forming, on the first surface, an interconnection stack including conductive tracks and vias separated by an insulating material; forming first and second bonding pads on the interconnection stack; thinning down the wafer, except at least on its contour; filling the thinned-down region with a first resin layer; arranging at least one first chip on the first bonding pads and forming solder bumps on the second bonding pads; depositing a second resin layer covering the first chips and partially covering the solder bumps; bonding an adhesive strip on the first resin layer; and scribing the structure into individual chips.

Abstract translation: 一种封装电子部件的方法，包括以下步骤：在半导体晶片的第一表面中形成电子部件; 在第一表面上形成包括由绝缘材料分隔开的导电轨道和通孔的互连堆叠; 在互连堆叠上形成第一和第二接合焊盘; 至少在轮廓上除外，使晶片变薄; 用第一树脂层填充薄的区域; 在所述第一接合焊盘上布置至少一个第一芯片，并在所述第二焊盘上形成焊料凸块; 沉积覆盖第一芯片并部分覆盖焊料凸块的第二树脂层; 将粘合带粘合在第一树脂层上; 并将结构划分成单个芯片。

公开(公告)号：US4844631A

公开(公告)日：1989-07-04

申请号：US116302

申请日：1987-11-04

Applicant: Jean-Marc Feron ,  Michel Prasloix

Inventor： Jean-Marc Feron ,  Michel Prasloix

IPC: B41J11/42 ,  B41J13/10 ,  B41J25/316

CPC classification number: B41J13/10 ,  B41J11/42 ,  B41J25/316

Abstract: The platen (11) is mounted between two side plates (9-10) of equipment which is hinged to two risers (5-6) to rotate about an axis .gamma. running parallel to the axis of the platen. The platen is provided with a freewheel mechanism including an inner ring (28) which is connected to the platen and an outer ring (29) which is provided with a peg (31) engaged in a slot (8) in a fixed member (7). The slot is situated on the opposite side of the platen axis .DELTA. relative to the axis of rotation .gamma. and in substantially the same plane. Detector means (36-37) for detecting the presence of a document in an insertion channel (17) cause the platen to rotate in the direction in which the freewheel mechanism drives the outer ring, thereby pressing the peg against the slot and rocking the equipment about the axis .gamma. thus allowing a document to pass between the print head and the platen until it meets an abutment (14) which is moved into place by the rocking action. When the document is detected as engaging the abutment, the platen is rotated in the opposite, document-driving direction, and return means press the platen against the print head.

Abstract translation: 压板（11）安装在设备的两个侧板（9-10）之间，该侧板铰接到两个立管（5-6），以围绕平行于压板的轴线延伸的轴线旋转。 压板设置有自由轮机构，其包括连接到压板的内环（28）和设置有固定在固定构件（7）中的狭槽（8）中的钉（31）的外圈（29） ）。 槽位于压板轴线DELTA相对于旋转轴线γ的相对侧并且在基本上相同的平面中。 用于检测在插入通道（17）中文件的存在的检测器装置（36-37）使得压板沿着自由轮机构驱动外圈的方向旋转，从而将钉压靠在槽上并摇摆设备 关于轴线γ，从而允许文件在打印头和压板之间通过，直到其遇到通过摇摆动作移动到位置的基台（14）。 当文件被检测为接合基座时，压板在相反的原稿驱动方向上旋转，并且返回装置将压板压靠打印头。