公开(公告)号：US20120086113A1

公开(公告)日：2012-04-12

申请号：US13267688

申请日：2011-10-06

申请人： Brian Smith ,  Maria Cardoso

发明人： Brian Smith ,  Maria Cardoso

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L23/5389 ,  H01L23/13 ,  H01L2224/73204 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15165 ,  H05K1/0281 ,  H05K1/189 ,  H05K3/0067 ,  H05K3/284 ,  H05K2201/10674 ,  H01L2924/15153 ,  H01L2924/00

摘要： Embodiments of the invention relate to a method for creating a flexible circuit, including defining a cavity in a top surface of a substrate before disposing a semiconductor chip within the cavity, such that a backside of the chip is disposed beneath the top surface of the substrate and above a bottom surface of the cavity. The method also includes forming a flexible connecting layer on the top surface of the substrate and extending over the chip. Other embodiments relate to a flexible circuit including a substrate defining a cavity in a top surface thereof. The cavity has encapsulant and a chip disposed therein, wherein a frontside of the chip is substantially coplanar with the top surface of the substrate. A flexible connecting layer is disposed on the top surface of the substrate and is partially supported by the substrate.

摘要翻译： 本发明的实施例涉及一种用于创建柔性电路的方法，包括在将半导体芯片设置在空腔内之前限定衬底的顶表面中的空腔，使得芯片的背面设置在衬底的顶表面下方 并且在空腔的底表面之上。 该方法还包括在衬底的顶表面上形成柔性连接层并在芯片上延伸。 其他实施例涉及包括在其顶表面中限定腔的衬底的柔性电路。 空腔具有密封剂和设置在其中的芯片，其中芯片的前侧基本上与基板的顶表面共面。 柔性连接层设置在基板的顶表面上并被基板部分支撑。