公开(公告)号：US20050162761A1

公开(公告)日：2005-07-28

申请号：US11042541

申请日：2005-01-25

申请人： Marian Hargis ,  Michael Hanley ,  James Moon

发明人： Marian Hargis ,  Michael Hanley ,  James Moon

IPC分类号： G02B7/00 ,  G02B26/06 ,  G12B15/06 ,  H05K5/00 ,  H05K7/20 ,  G02B7/02

CPC分类号： G02B7/008 ,  G02B6/4269 ,  G02B6/4281 ,  G02B6/4283 ,  G02B26/06

摘要： The present invention relates to a heat sinking tab for dissipating heat directly from an optical sub-assembly (OSA) to a transceiver housing, within which the optical sub-assembly is located. The heat sinking tab includes a mounting plate for mounting on the rear end of a transistor outline (TO) can, and a finger for extending into contact or close proximity to the transceiver housing. The mounting plate also provides a stiffening plate for flexible conductors used to connect the OSA leads to a transceiver printed circuit board (PCB).

摘要翻译： 本发明涉及一种用于将热量从光学子组件（OSA）直接散热到光学子组件所在的收发器壳体的散热片。 散热片包括用于安装在晶体管轮廓（TO）罐的后端上的安装板和用于延伸到接收或靠近收发机壳体的手指。 安装板还提供用于将OSA引线连接到收发器印刷电路板（PCB）的柔性导体的加强板。

公开(公告)号：US20050175299A1

公开(公告)日：2005-08-11

申请号：US11042868

申请日：2005-01-25

申请人： Marian Hargis ,  David Gaio ,  Roger Lindquist ,  William Hogan ,  James Walling ,  Sundeep Nangalia ,  Philip Deane ,  Miles Swain ,  Christopher Gabel

发明人： Marian Hargis ,  David Gaio ,  Roger Lindquist ,  William Hogan ,  James Walling ,  Sundeep Nangalia ,  Philip Deane ,  Miles Swain ,  Christopher Gabel

IPC分类号： G02B6/42 ,  H04B10/12 ,  H05K1/00 ,  H05K1/18 ,  G02B6/36

CPC分类号： G02B6/4206 ,  G02B6/4292 ,  H01L2224/48091 ,  H01L2924/3011 ,  H05K1/189 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention relates to an optical sub-assembly package for use in receiver optical sub-assemblies or transmitter optical sub-assemblies in which the electrical connections between the transducer chip, e.g. photo-detector or light source, and the device printed circuit board is made by a single flexible circuit conductor extending through the wall of the package. The package is comprised of a housing and a stiffening plate, which encloses and end of the housing and forms a mechanical support for an end of the flexible circuit conductor.

摘要翻译： 本发明涉及一种用于接收机光学子组件或发射器光学子组件中的光学子组件封装，其中，传感器芯片之间的电连接，例如， 光检测器或光源，并且设备印刷电路板由延伸穿过封装壁的单个柔性电路导体制成。 该包装包括外壳和加强板，其包围壳体的端部并且形成用于柔性电路导体的端部的机械支撑。