公开(公告)号：US07160039B2

公开(公告)日：2007-01-09

申请号：US11042868

申请日：2005-01-25

申请人： Marian C. Hargis ,  David Peter Gaio ,  Roger T. Lindquist ,  William K. Hogan ,  James Walling ,  Sundeep Nangalia ,  Philip Deane ,  Miles F. Swain ,  Christopher M. Gabel

发明人： Marian C. Hargis ,  David Peter Gaio ,  Roger T. Lindquist ,  William K. Hogan ,  James Walling ,  Sundeep Nangalia ,  Philip Deane ,  Miles F. Swain ,  Christopher M. Gabel

IPC分类号： G02B6/36 ,  H05K1/14 ,  H05K5/00

CPC分类号： G02B6/4206 ,  G02B6/4292 ,  H01L2224/48091 ,  H01L2924/3011 ,  H05K1/189 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention relates to an optical sub-assembly package for use in receiver optical sub-assemblies or transmitter optical sub-assemblies in which the electrical connections between the transducer chip, e.g. photo-detector or light source, and the device printed circuit board is made by a single flexible circuit conductor extending through the wall of the package. The package is comprised of a housing and a stiffening plate, which encloses and end of the housing and forms a mechanical support for an end of the flexible circuit conductor.

摘要翻译： 本发明涉及一种用于接收机光学子组件或发射器光学子组件中的光学子组件封装，其中，传感器芯片之间的电连接，例如， 光检测器或光源，并且设备印刷电路板由延伸穿过封装壁的单个柔性电路导体制成。 该包装包括外壳和加强板，其包围壳体的端部并且形成用于柔性电路导体的端部的机械支撑。

公开(公告)号：US20050175299A1

公开(公告)日：2005-08-11

申请号：US11042868

申请日：2005-01-25

申请人： Marian Hargis ,  David Gaio ,  Roger Lindquist ,  William Hogan ,  James Walling ,  Sundeep Nangalia ,  Philip Deane ,  Miles Swain ,  Christopher Gabel

发明人： Marian Hargis ,  David Gaio ,  Roger Lindquist ,  William Hogan ,  James Walling ,  Sundeep Nangalia ,  Philip Deane ,  Miles Swain ,  Christopher Gabel

IPC分类号： G02B6/42 ,  H04B10/12 ,  H05K1/00 ,  H05K1/18 ,  G02B6/36

CPC分类号： G02B6/4206 ,  G02B6/4292 ,  H01L2224/48091 ,  H01L2924/3011 ,  H05K1/189 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention relates to an optical sub-assembly package for use in receiver optical sub-assemblies or transmitter optical sub-assemblies in which the electrical connections between the transducer chip, e.g. photo-detector or light source, and the device printed circuit board is made by a single flexible circuit conductor extending through the wall of the package. The package is comprised of a housing and a stiffening plate, which encloses and end of the housing and forms a mechanical support for an end of the flexible circuit conductor.

摘要翻译： 本发明涉及一种用于接收机光学子组件或发射器光学子组件中的光学子组件封装，其中，传感器芯片之间的电连接，例如， 光检测器或光源，并且设备印刷电路板由延伸穿过封装壁的单个柔性电路导体制成。 该包装包括外壳和加强板，其包围壳体的端部并且形成用于柔性电路导体的端部的机械支撑。

公开(公告)号：US07476040B2

公开(公告)日：2009-01-13

申请号：US11046939

申请日：2005-01-31

申请人： Jeffrey Zack ,  Craig A. Young ,  Anand Shukla ,  Wei Xu ,  William K. Hogan ,  David Peter Gaio ,  Chris Hart ,  Philip Deane ,  Mark J. Bailey ,  Martin A. Helfand

发明人： Jeffrey Zack ,  Craig A. Young ,  Anand Shukla ,  Wei Xu ,  William K. Hogan ,  David Peter Gaio ,  Chris Hart ,  Philip Deane ,  Mark J. Bailey ,  Martin A. Helfand

IPC分类号： G02B6/42

CPC分类号： G02B6/4201 ,  G02B6/4212 ,  G02B6/4256 ,  G02B6/4277 ,  G02B6/4279 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292 ,  H01L2224/48091 ,  H01S5/02212 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/06226 ,  H01L2924/00014

摘要： The present invention relates to an optical sub-assembly, i.e. a receiver optical subassembly or a transmitter optical sub-assembly, for use in an optical transceiver device. The optical sub-assembly according to the present invention includes a hermetic ceramic package with a multi-layer ceramic structure providing a unique RF signal and ground structure providing a controlled signal impedance to achieve high signal transmission quality.

摘要翻译： 光子组件技术领域本发明涉及用于光收发器设备中的光学子组件，即接收器光学子组件或发射机光学子组件。 根据本发明的光学子组件包括具有多层陶瓷结构的气密陶瓷封装，提供独特的RF信号和接地结构，提供受控的信号阻抗以实现高信号传输质量。

公开(公告)号：US20050185882A1

公开(公告)日：2005-08-25

申请号：US11046939

申请日：2005-01-31

申请人： Jeffrey Zack ,  Craig Young ,  Anand Shukla ,  Wei Xu ,  William Hogan ,  David Gaio ,  Chris Hart ,  Philip Deane ,  Mark Bailey ,  Martin Helfand

发明人： Jeffrey Zack ,  Craig Young ,  Anand Shukla ,  Wei Xu ,  William Hogan ,  David Gaio ,  Chris Hart ,  Philip Deane ,  Mark Bailey ,  Martin Helfand

IPC分类号： G02B6/26 ,  G02B6/42 ,  H01S3/00 ,  H01S5/022 ,  H04B10/02

CPC分类号： G02B6/4201 ,  G02B6/4212 ,  G02B6/4256 ,  G02B6/4277 ,  G02B6/4279 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292 ,  H01L2224/48091 ,  H01S5/02212 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/06226 ,  H01L2924/00014

摘要： The present invention relates to an optical sub-assembly, i.e. a receiver optical subassembly or a transmitter optical sub-assembly, for use in an optical transceiver device. The optical sub-assembly according to the present invention includes a hermetic ceramic package with a multi-layer ceramic structure providing a unique RF signal and ground structure providing a controlled signal impedance to achieve high signal transmission quality.

摘要翻译： 光子组件技术领域本发明涉及用于光收发器设备中的光学子组件，即接收器光学子组件或发射机光学子组件。 根据本发明的光学子组件包括具有多层陶瓷结构的气密陶瓷封装，提供独特的RF信号和接地结构，提供受控的信号阻抗以实现高信号传输质量。

公开(公告)号：US3940966A

公开(公告)日：1976-03-02

申请号：US528815

申请日：1974-12-02

申请人： Norman Philip Deane

发明人： Norman Philip Deane

IPC分类号： B21D33/00 ,  B21D13/04 ,  B21D53/04 ,  B31F1/26

CPC分类号： B31F1/26 ,  B21D13/04 ,  B21D53/025 ,  B21D53/04

摘要： Apparatus for shaping sheet material such as metal foil includes co-operating rollers with teeth, between which the sheet material is fed. The teeth shape the sheet to form corrugations, and projections on the flanks of the teeth form patterns on the corrugations. In order to free the shaped sheet from the teeth, resilient material projects from the flanks of the teeth and urges the sheet away from the flanks after a shaping operation.The invention is intended for use in forming the secondary heat exchange surfaces in aluminium radiators.

摘要翻译： 用于成形片材（例如金属箔）的装置包括具有齿的配合辊，在其间供给片材。 齿形成片材以形成波纹，并且齿的侧面上的突起在波纹上形成图案。 为了从牙齿上释放成形的片材，弹性材料从牙齿的侧面突出，并且在成型操作之后将片材从侧面推开。

公开(公告)号：US07007835B2

公开(公告)日：2006-03-07

申请号：US10775395

申请日：2004-02-10

申请人： Philip Deane ,  Neil Teitelbaum

发明人： Philip Deane ,  Neil Teitelbaum

IPC分类号： B23K35/38

CPC分类号： H05K3/3436 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12043 ,  H05K3/3494 ,  H05K2201/10484 ,  H05K2201/10674 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599

摘要： A method for solder bonding a photodiode or an array of photodiodes to a substrate, the photodiode(s) tilted at a predetermined angle, uses a pair solder bumps placed on a photodiode chip opposite a corresponding pair of solder pads placed on the substrate. When the photodiode chip is placed on the substrate, with the solder bumps therebetween, the solder is melted and undergoes a reflow over the surface of the pads. The shape of the pads and the location of the solder bumps on the pads causes the surface tension of the solder to tilt the chip by pulling it to one side.

摘要翻译： 将光电二极管或阵列的光电二极管焊接到基板上的方法，即以预定角度倾斜的光电二极管，使用放置在与放置在基板上的对应的一对焊盘相对的光电二极管芯片上的一对焊料凸块。 当光电二极管芯片放置在基板上时，焊料凸起之间，焊料熔化并在焊盘的表面上经过回流焊。 焊盘的形状和焊盘上的焊料凸点的位置使得焊料的表面张力通过将芯片拉到一侧来使芯片倾斜。

公开(公告)号：US06792171B2

公开(公告)日：2004-09-14

申请号：US10713377

申请日：2003-11-14

申请人： Marian C. Hargis ,  David Peter Gaio ,  Christopher M. Gabel ,  Sundeep NandNangalia ,  James Walling ,  Philip Deane ,  William K Hogan

发明人： Marian C. Hargis ,  David Peter Gaio ,  Christopher M. Gabel ,  Sundeep NandNangalia ,  James Walling ,  Philip Deane ,  William K Hogan

IPC分类号： G02B612

CPC分类号： G02B6/4201 ,  G02B6/4204

摘要： The invention relates to a receiver optical sub-assembly (ROSA) for use in a high-speed small-form factor transceiver. The ROSA, according to the present invention, includes a stacked chip design in which a semiconductor micro-bench, upon which the photodiode and trans-impedance amplifier are mounted, is disposed perpendicular to the direction that the light travels. A flexible electrical connector is attached to the semiconductor micro-bench for electrically connecting the ROSA to a host a transceiver device. The flexible electrical connector is fixed to the surface of the semiconductor micro-bench with portions cut-out to receive the amplifier and other electrical components extending therefrom. To facilitate assembly, wells are etched from the semiconductor micro-bench corresponding to bumps extending from a mounting flange for the optical coupler.

摘要翻译： 本发明涉及一种用于高速小型收发器的接收机光学子组件（ROSA）。 根据本发明的ROSA包括堆叠式芯片设计，其中安装有光电二极管和跨阻抗放大器的半导体微型工作台垂直于光行进的方向设置。 柔性电连接器连接到半导体微型工作台，用于将ROSA电连接到主机收发器装置。 柔性电连接器固定到半导体微型工作台的表面，其部分切口以接收放大器和从其延伸的其它电气部件。 为了便于组装，从半导体微型工作台蚀刻孔，对应于从用于光耦合器的安装法兰延伸的凸块。