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公开(公告)号：US20050175299A1
公开(公告)日：2005-08-11
申请号：US11042868
申请日：2005-01-25
申请人： Marian Hargis , David Gaio , Roger Lindquist , William Hogan , James Walling , Sundeep Nangalia , Philip Deane , Miles Swain , Christopher Gabel
发明人： Marian Hargis , David Gaio , Roger Lindquist , William Hogan , James Walling , Sundeep Nangalia , Philip Deane , Miles Swain , Christopher Gabel
CPC分类号： G02B6/4206 , G02B6/4292 , H01L2224/48091 , H01L2924/3011 , H05K1/189 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to an optical sub-assembly package for use in receiver optical sub-assemblies or transmitter optical sub-assemblies in which the electrical connections between the transducer chip, e.g. photo-detector or light source, and the device printed circuit board is made by a single flexible circuit conductor extending through the wall of the package. The package is comprised of a housing and a stiffening plate, which encloses and end of the housing and forms a mechanical support for an end of the flexible circuit conductor.
摘要翻译： 本发明涉及一种用于接收机光学子组件或发射器光学子组件中的光学子组件封装，其中，传感器芯片之间的电连接，例如， 光检测器或光源，并且设备印刷电路板由延伸穿过封装壁的单个柔性电路导体制成。 该包装包括外壳和加强板，其包围壳体的端部并且形成用于柔性电路导体的端部的机械支撑。
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公开(公告)号：US07160039B2
公开(公告)日：2007-01-09
申请号：US11042868
申请日：2005-01-25
申请人： Marian C. Hargis , David Peter Gaio , Roger T. Lindquist , William K. Hogan , James Walling , Sundeep Nangalia , Philip Deane , Miles F. Swain , Christopher M. Gabel
发明人： Marian C. Hargis , David Peter Gaio , Roger T. Lindquist , William K. Hogan , James Walling , Sundeep Nangalia , Philip Deane , Miles F. Swain , Christopher M. Gabel
CPC分类号： G02B6/4206 , G02B6/4292 , H01L2224/48091 , H01L2924/3011 , H05K1/189 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to an optical sub-assembly package for use in receiver optical sub-assemblies or transmitter optical sub-assemblies in which the electrical connections between the transducer chip, e.g. photo-detector or light source, and the device printed circuit board is made by a single flexible circuit conductor extending through the wall of the package. The package is comprised of a housing and a stiffening plate, which encloses and end of the housing and forms a mechanical support for an end of the flexible circuit conductor.
摘要翻译： 本发明涉及一种用于接收机光学子组件或发射器光学子组件中的光学子组件封装，其中，传感器芯片之间的电连接，例如， 光检测器或光源，并且设备印刷电路板由延伸穿过封装壁的单个柔性电路导体制成。 该包装包括外壳和加强板，其包围壳体的端部并且形成用于柔性电路导体的端部的机械支撑。
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公开(公告)号：US5499754A
公开(公告)日：1996-03-19
申请号：US339770
申请日：1994-11-15
CPC分类号： B23K35/38 , B23K1/20 , B23K2201/36 , H05K3/3489
摘要： A fluxless soldering sample pretreating system includes a sample chamber having an opening therein and a sample holder. A sample chamber extension extends outwardly from the opening to define a passageway from the sample chamber extension, through the opening, and into the sample chamber. A fluorine-containing gas is supplied into the sample chamber extension. Am energy source such as a microwave oven surrounds the sample chamber extension. The microwave oven produces microwave energy in the sample chamber extension to form a plasma therein and dissociate the fluorine-containing gas into atomic fluorine. A perforated aluminum plate extends transversely across the passageway and blocks the plasma from traversing the passageway from the sample chamber extension into the sample chamber, while allowing the atomic fluorine to traverse the passageway from the sample chamber extension into the sample holder. A second chamber extension, gas supply and microwave oven may be added to improve uniformity for large samples.
摘要翻译： 无助焊剂样品预处理系统包括其中具有开口的样品室和样品保持器。 样品室延伸部从开口向外延伸以限定从样品室延伸部穿过开口并进入样品室的通道。 向样品室延伸部供给含氟气体。 诸如微波炉的能量源围绕样品室延伸。 微波炉在样品室延伸部中产生微波能量，在其中形成等离子体，并将含氟气体解离为原子氟。 穿孔铝板横向延伸穿过通道，并阻止等离子体横穿从样品室延伸部进入样品室的通道，同时允许原子氟穿过从样品室延伸部分进入样品架的通道。 可以添加第二室延伸，气体供应和微波炉以改善大样品的均匀性。
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公开(公告)号：US5407121A
公开(公告)日：1995-04-18
申请号：US155020
申请日：1993-11-19
CPC分类号： B23K35/38 , B23K1/20 , B23K2201/36 , H05K3/3489
摘要： A method of soldering a copper layer without the use of fluxing agents by exposing the copper layer to a fluorine-containing plasma. Solder is then placed onto the surface of the copper layer and reflowed. Reflow can take place at low temperatures, atmospheric pressure and in an inert or oxidizing atmosphere using standard solder reflow equipment.
摘要翻译： 一种通过将铜层暴露于含氟等离子体而不使用助熔剂来焊接铜层的方法。 然后将焊料放置在铜层的表面上并回流。 回流可以使用标准的回流焊设备在低温，大气压和惰性或氧化性气氛中进行。
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公开(公告)号：US5992729A
公开(公告)日：1999-11-30
申请号：US724910
申请日：1996-10-02
CPC分类号： B23K1/06 , H05K3/3436
摘要： A first component is soldered to a second component by placing the first component on the second component with solder therebetween, then ultrasonically vibrating at least one of the first and second components to thereby tack the solder to at least one of the first and second components, and by reflowing the solder. Ultrasonic vibration of at least one of the first and second components to thereby tack the solder is preferably performed for less than one second. A component placer places the first component on the second component with solder therebetween. An ultrasonic vibrator ultrasonically vibrates at least one of the placed first and second components, to thereby tack the solder to at least one of the placed first and second components. A solder reflower reflows the tacked solder to thereby solder the first component to the second component.
摘要翻译： 将第一部件焊接到第二部件上，通过将第一部件放置在第二部件上，在其间具有焊料，然后对第一和第二部件中的至少一个进行超声波振动，从而将焊料固定到第一和第二部件中的至少一个， 并通过回流焊料。 第一和第二组分中的至少一个的超声波振动优选地进行少于1秒。 组件放置器将第一部件放置在第二部件上，其间具有焊料。 超声波振动器超声振动放置的第一和第二部件中的至少一个，从而将焊料固定到所放置的第一和第二部件中的至少一个。 焊料回流焊机将固定的焊料回流，从而将第一部件焊接到第二部件。
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