公开(公告)号：US09900988B1

公开(公告)日：2018-02-20

申请号：US14249540

申请日：2014-04-10

申请人： Nien-Hua Chao ,  John A. Dispenza ,  Mario DeAngelis

发明人： Nien-Hua Chao ,  John A. Dispenza ,  Mario DeAngelis

IPC分类号： H05K1/18 ,  H05K3/00 ,  H01L21/56 ,  B29C51/16 ,  B29L31/34

CPC分类号： H01L21/565 ,  B29C33/3842 ,  B29C51/16 ,  B29C2791/006 ,  B29L2031/3406 ,  B29L2031/3425 ,  H01L2924/0002 ,  H05K3/0014 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2203/1316 ,  H05K2203/1322 ,  H01L2924/00

摘要： A protective layering process that encapsulates and protects printed circuit board assemblies with complex and imprecise geometries. The protective layering process provides a combination of a flexible mold and/or a rigid mold, which are derived from modified data from a 3 dimensional scan of the printed circuit board assembly, and which applies close-forming, encapsulating polymer layers, electrically non-conductive layers, EMI shielding layers, and/or thermal management layers to the electronic components and circuit board assemblies. Polymer layers and protective jackets are shaped to as-populated circuit boards and assemblies, providing tightly fit barriers with fine resolution accommodating imprecise geometries. The protective jackets/layers can be formed in rigid, semi-rigid, or highly flexible polymer films, to protect the circuitry from the elements, CTE mismatches, shock and vibration loads and extreme g-forces, and from internal and external EMI and to manage thermal dissipation. Multiple, nesting layers, each with different protective properties, can be formed and applied.

公开(公告)号：US09254588B1

公开(公告)日：2016-02-09

申请号：US13682980

申请日：2012-11-21

申请人： Nien-Hua Chao ,  John A. Dispenza ,  Mario DeAngelis

发明人： Nien-Hua Chao ,  John A. Dispenza ,  Mario DeAngelis

IPC分类号： B29C41/20

CPC分类号： H05K3/0014 ,  B29C33/3842 ,  B29C51/16 ,  B29C2791/006 ,  B29L2031/3406 ,  B29L2031/3425 ,  H01L21/565 ,  H01L2924/0002 ,  H05K3/0047 ,  H05K3/284 ,  H05K3/4644 ,  H05K2201/0715 ,  H05K2203/1316 ,  H05K2203/1322 ,  H01L2924/00

摘要： A polymer layering process that encapsulates and protects electronics components with complex and imprecise geometries. The protective layering process provides a combination of a flexible mold and/or a rigid mold that apply close-forming, encapsulating the polymer layers to the electronic components and precision assemblies. Polymer layer protective jackets are shaped to as-populated circuit boards and assemblies, providing tightly fit barriers with fine resolution accommodating imprecise geometries. The protective jackets can be formed in rigid, semi-rigid, or highly flexible polymer films, to protect the circuitry from the elements, CTE mismatches, shock and vibration loads and extreme g-forces.

摘要翻译： 聚合物分层工艺，用复杂且不精确的几何封装和保护电子元件。 保护层叠方法提供了柔性模具和/或刚性模具的组合，其应用紧密成型，将聚合物层封装到电子部件和精密组件。 聚合物层保护套被成形为人机接口的电路板和组件，提供紧密配合的屏障，其精细分辨率适应不精确的几何形状。 保护套可以形成刚性，半刚性或高度柔性的聚合物膜，以保护电路免受元件，CTE不匹配，冲击和振动负载以及极端的g力。