摘要:
A polymer layering process that encapsulates and protects electronics components with complex and imprecise geometries. The protective layering process provides a combination of a flexible mold and/or a rigid mold that apply close-forming, encapsulating the polymer layers to the electronic components and precision assemblies. Polymer layer protective jackets are shaped to as-populated circuit boards and assemblies, providing tightly fit barriers with fine resolution accommodating imprecise geometries. The protective jackets can be formed in rigid, semi-rigid, or highly flexible polymer films, to protect the circuitry from the elements, CTE mismatches, shock and vibration loads and extreme g-forces.
摘要:
A protective layering process that encapsulates and protects printed circuit board assemblies with complex and imprecise geometries. The protective layering process provides a combination of a flexible mold and/or a rigid mold, which are derived from modified data from a 3 dimensional scan of the printed circuit board assembly, and which applies close-forming, encapsulating polymer layers, electrically non-conductive layers, EMI shielding layers, and/or thermal management layers to the electronic components and circuit board assemblies. Polymer layers and protective jackets are shaped to as-populated circuit boards and assemblies, providing tightly fit barriers with fine resolution accommodating imprecise geometries. The protective jackets/layers can be formed in rigid, semi-rigid, or highly flexible polymer films, to protect the circuitry from the elements, CTE mismatches, shock and vibration loads and extreme g-forces, and from internal and external EMI and to manage thermal dissipation. Multiple, nesting layers, each with different protective properties, can be formed and applied.
摘要:
A device and method of unitarily forming an electrically shielded panel for use in electromagnetically sealing an opening defined in an electronic enclosure. The unitary electrically shielded panel is formed of an electrically non-conductive rigid thermoplastic panel part and a substantially planar, electrically conductive elastomeric gasket bonded together to form the unitary panel in a single tool during a single injection-molding operation.
摘要:
The present invention provides an initial strike-face layer for armor, a method of constructing an armor plate and armor. In one embodiment, the initial strike-face layer includes a substantially planar surface having a relief pattern with raised or recessed structures, each of the structures having sides that are oblique to the substantially planar surface.
摘要:
The support bracket is formed of two bodies which simultaneously engage the top surface of a shelf and the depending sides of the sheet metal shelf. A pair of locking bolts are provided to guide the inner body relative to the outer bracket body during securement of the bracket to a notched corner of a shelf. The bracket may be secured to shelving of different thicknesses. The brackets may be slid over tubular vertical legs to form tables or shelving.
摘要:
The present invention provides an initial strike-face layer for armor, a method of constructing an armor plate and armor. In one embodiment, the initial strike-face layer includes a substantially planar surface having a relief pattern with raised or recessed structures, each of the structures having sides that are oblique to the substantially planar surface.