公开(公告)号：US08667049B2

公开(公告)日：2014-03-04

申请号：US13566024

申请日：2012-08-03

申请人： Matthias A. Blumrich ,  Dong Chen ,  George L. Chiu ,  Thomas M. Cipolla ,  Paul W. Coteus ,  Alan G. Gara ,  Mark E. Giampap ,  Philip Heidlberger ,  Gerard V. Kopcsay ,  Lawrence S. Mok ,  Todd E. Takken

发明人： Matthias A. Blumrich ,  Dong Chen ,  George L. Chiu ,  Thomas M. Cipolla ,  Paul W. Coteus ,  Alan G. Gara ,  Mark E. Giampap ,  Philip Heidlberger ,  Gerard V. Kopcsay ,  Lawrence S. Mok ,  Todd E. Takken

IPC分类号： G06F15/173

CPC分类号： H05K7/20836 ,  F24F11/77 ,  G06F9/52 ,  G06F9/526 ,  G06F15/17381 ,  G06F17/142 ,  G09G5/008 ,  H04L7/0338

摘要： A novel massively parallel supercomputer of hundreds of teraOPS-scale includes node architectures based upon System-On-a-Chip technology, i.e., each processing node comprises a single Application Specific Integrated Circuit (ASIC). Within each ASIC node is a plurality of processing elements each of which consists of a central processing unit (CPU) and plurality of floating point processors to enable optimal balance of computational performance, packaging density, low cost, and power and cooling requirements. The plurality of processors within a single node individually or simultaneously work on any combination of computation or communication as required by the particular algorithm being solved. The system-on-a-chip ASIC nodes are interconnected by multiple independent networks that optimally maximizes packet communications throughput and minimizes latency. The multiple networks include three high-speed networks for parallel algorithm message passing including a Torus, Global Tree, and a Global Asynchronous network that provides global barrier and notification functions.

摘要翻译： 数百个teraOPS级别的新型大规模并行超级计算机包括基于片上系统技术的节点架构，即每个处理节点包括单个专用集成电路（ASIC）。 在每个ASIC节点内是多个处理元件，每个处理元件由中央处理单元（CPU）和多个浮点处理器组成，以实现计算性能，封装密度，低成本以及功率和冷却​​要求的最佳平衡。 单个节点内的多个处理器单独或同时工作在要解决的特定算法所要求的计算或通信的任何组合上。 片上系统ASIC节点通过多个独立网络互连，从而最大限度地最大限度地提高了分组通信吞吐量并最大限度地减少了延迟。 多个网络包括用于并行算法消息传递的三个高速网络，包括Torus，全局树和提供全局障碍和通知功能的全球异步网络。